Circuit board comprising blind hole and manufacturing method of circuit board

A manufacturing method and circuit board technology, which is applied to printed circuit components, electrical connection formation of printed components, electrical connection of printed components, etc., can solve problems such as inability to effectively polish resin, inability to complete grinding board, and substrate surface grinding. , to achieve the effect of tight filling, reduced production process, and no layering of resin

Inactive Publication Date: 2014-07-09
GUANGZHOU FASTPRINT CIRCUIT TECH +2
View PDF3 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the conventional technology, after the resin plugs the hole, it is necessary to remove the excess resin on the board surface through the grinding process. When using the PTFE high-frequency board, since the PTFE high-frequency board clearly prohibits mechanical grinding, the grinding board after the resin plugging hole cannot be completed ; When non-PTFE high-frequency boards are used, especially RO4450 prepreg

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board comprising blind hole and manufacturing method of circuit board
  • Circuit board comprising blind hole and manufacturing method of circuit board
  • Circuit board comprising blind hole and manufacturing method of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0025] Example 1

[0026] A method for fabricating a circuit board including blind holes, comprising pre-procedure, sub-board drilling, copper sinking, plate plating, hole-plating, inner layer pattern making, browning, resin plug hole, baking board, sub-board lamination, post-processing process, where:

[0027] The pre-process includes sub-board cutting, inner-layer pattern transfer, inner-layer etching, inner-layer AOI, and sub-board lamination procedures. The above-mentioned pre-procedures are all made according to conventional techniques. Pressed with RO4450 prepreg.

[0028] The sub-board drilling, copper sinking, plate plating, hole plating, inner layer pattern making, and browning processes are also made according to conventional techniques. The pattern transfer is carried out by the method of negative film electroplating.

[0029] In the resin plug hole process, the prefabricated plug hole aluminum sheet is covered on the surface of the daughter board, and the plug h...

Example Embodiment

[0036] Example 2

[0037] The manufacturing method of the circuit board including blind holes in this embodiment is basically the same as the method in Embodiment 1, except that in this embodiment, a PTFE sheet is used as the base material of the circuit board.

[0038] In the resin plugging process, the length of each side of the windowed area on the plugged aluminum sheet is 6 mils larger than the length of each side of the area that needs the resin plugged hole on the daughter board. SKY-2000 type resin is used, and NTU FL-6080PSR-TM semi-automatic plugging screen printing machine or Dongyuan ATMAOE-67 semi-automatic plugging screen printing machine is used. The inclination angle of the scraper is 5°, the rotation angle of the scraper is 3°, and the screen printing pressure is 6kg / cm 2 , The plug hole speed is 14 Hz, the ink filling speed is 4 scales (1 scale = 10 Hz), the mesh number is 36T, and the screen tension is 27N / cm 2 under the conditions of plugging.

[0039] ...

Example Embodiment

[0041] Example 3

[0042] The manufacturing method of the circuit board including blind holes in this embodiment is basically the same as the method in Embodiment 2, except that in this embodiment, the sub-board is made of RO4350B board and is pressed together with RO4450 prepreg.

[0043] In the resin plugging process, the length of each side of the window area on the plugged aluminum sheet is 4 mils larger than the length of each side of the area that needs the resin plugged hole on the sub-board. Using SKY-2000 resin, the inclination angle of the scraper is 4°, the rotation angle of the scraper is 0°, and the screen printing pressure is 5kg / cm 2 , The plugging speed is 8 Hz, the ink filling speed is 3 scales, the mesh number is 36T, and the mesh tension is 26N / cm 2 under the conditions of plugging.

[0044] In the baking process, the baking temperature was 100° C., and the baking time was 30 min.

[0045] Through the above method, the circuit board C is produced.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a circuit board comprising a blind hole and a manufacturing method of the circuit board and belongs to the technical field of printed circuit boards. The manufacturing method comprises the steps that the processes of daughter board hole drilling, electroless copper plating, board plating, hole plating, inner layer pattern manufacturing, brownification, resin hole blocking, board drying and daughter board lamination. In the resin hole blocking process, a pre-manufactured hole blocking aluminum piece is arranged on the surface of a daughter board in a covering mode, a window-opening zone corresponding to a zone which needs resin hole blocking on the daughter board is arranged on the hole blocking aluminum piece, and then resin hole blocking is carried out. Accordingly, the problem that a whole board face is full of resin is avoided, ceramic board grinding is of no need, and the problem that surplus resin stays in concave parts on the board face or base materials are exposed out of the board face is solved. The manufacturing method of a resin blocking hole is suitable for blind hole resin filling of various boards, and limitation on boards of the resin blocking hole is removed.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a circuit board containing blind holes and a manufacturing method thereof. Background technique [0002] At present, it is often encountered that PTFE (polytetrafluoroethylene) high-frequency boards or non-PTFE high-frequency boards and their prepregs (commonly such as RO4350B boards and RO4450 prepregs) are used to make buried blind via circuit boards. When there are special requirements for circuit boards or circuit board stack design, a single sheet of RO4450PP will appear. At this time, the blind hole glue filling process should take into account the influence of the thickness of the sub-board and the copper thickness of the sub-board. Usually, the thickness of the sub-board should be Less than 0.76mm, while the copper thickness of the sub-board is required to be less than or equal to 0.5oz (ounces), and materials such as RO4450FPP with better fluidity are used...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K1/11H05K3/40
Inventor 张勃王雪涛乔书晓
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products