Circuit board comprising blind hole and manufacturing method of circuit board
A manufacturing method and circuit board technology, which is applied to printed circuit components, electrical connection formation of printed components, electrical connection of printed components, etc., can solve problems such as inability to effectively polish resin, inability to complete grinding board, and substrate surface grinding. , to achieve the effect of tight filling, reduced production process, and no layering of resin
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Example Embodiment
[0025] Example 1
[0026] A method for fabricating a circuit board including blind holes, comprising pre-procedure, sub-board drilling, copper sinking, plate plating, hole-plating, inner layer pattern making, browning, resin plug hole, baking board, sub-board lamination, post-processing process, where:
[0027] The pre-process includes sub-board cutting, inner-layer pattern transfer, inner-layer etching, inner-layer AOI, and sub-board lamination procedures. The above-mentioned pre-procedures are all made according to conventional techniques. Pressed with RO4450 prepreg.
[0028] The sub-board drilling, copper sinking, plate plating, hole plating, inner layer pattern making, and browning processes are also made according to conventional techniques. The pattern transfer is carried out by the method of negative film electroplating.
[0029] In the resin plug hole process, the prefabricated plug hole aluminum sheet is covered on the surface of the daughter board, and the plug h...
Example Embodiment
[0036] Example 2
[0037] The manufacturing method of the circuit board including blind holes in this embodiment is basically the same as the method in Embodiment 1, except that in this embodiment, a PTFE sheet is used as the base material of the circuit board.
[0038] In the resin plugging process, the length of each side of the windowed area on the plugged aluminum sheet is 6 mils larger than the length of each side of the area that needs the resin plugged hole on the daughter board. SKY-2000 type resin is used, and NTU FL-6080PSR-TM semi-automatic plugging screen printing machine or Dongyuan ATMAOE-67 semi-automatic plugging screen printing machine is used. The inclination angle of the scraper is 5°, the rotation angle of the scraper is 3°, and the screen printing pressure is 6kg / cm 2 , The plug hole speed is 14 Hz, the ink filling speed is 4 scales (1 scale = 10 Hz), the mesh number is 36T, and the screen tension is 27N / cm 2 under the conditions of plugging.
[0039] ...
Example Embodiment
[0041] Example 3
[0042] The manufacturing method of the circuit board including blind holes in this embodiment is basically the same as the method in Embodiment 2, except that in this embodiment, the sub-board is made of RO4350B board and is pressed together with RO4450 prepreg.
[0043] In the resin plugging process, the length of each side of the window area on the plugged aluminum sheet is 4 mils larger than the length of each side of the area that needs the resin plugged hole on the sub-board. Using SKY-2000 resin, the inclination angle of the scraper is 4°, the rotation angle of the scraper is 0°, and the screen printing pressure is 5kg / cm 2 , The plugging speed is 8 Hz, the ink filling speed is 3 scales, the mesh number is 36T, and the mesh tension is 26N / cm 2 under the conditions of plugging.
[0044] In the baking process, the baking temperature was 100° C., and the baking time was 30 min.
[0045] Through the above method, the circuit board C is produced.
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