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High-conductivity silver covered copper powder resistant to high temperature and preparing method of high-conductivity silver covered copper powder

A technology of silver-coated copper powder and high conductivity, which is applied in the direction of liquid chemical plating, coating, metal material coating technology, etc., can solve the problem of insufficient coating rate of silver-coated copper powder, weight gain of silver-coated copper powder, silver Copper-coated powder is not resistant to high temperature, etc., to achieve the effect of large-scale production, shortened operation steps, and smooth silver plating results

Inactive Publication Date: 2014-07-16
游京晶
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned process of electroless silver plating on the surface of copper powder has the disadvantages that the composition of the composition solution is complex, the hydrazine hydrate used in the reducing solution is highly toxic, and some even require electroless silver plating at a temperature higher than room temperature, and the copper powder targeted Most of the shapes are spherical, and the temperature it can withstand is low, which cannot meet the needs of normal use at high temperatures
[0005] In addition, Chinese patent 201210440784.0 proposes a method for preparing closely bonded silver-coated copper powder, which uses the same replacement principle and different preparation processes to obtain silver-coated copper powder, but according to the TGA curve of the obtained product, we can see that , in the high temperature range above 400 ℃, silver-coated copper powder and copper powder have equal weight gain, which shows that the coating rate of silver-coated copper powder prepared by this process is not high enough
The coating rate is very important to the high temperature resistance of silver-coated copper powder. At present, in the field of electronic paste, the main reason why silver-coated copper powder paste cannot replace silver paste is that the silver-coated copper powder produced by the existing process is not resistant to high temperature, thus limiting its application field

Method used

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  • High-conductivity silver covered copper powder resistant to high temperature and preparing method of high-conductivity silver covered copper powder
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  • High-conductivity silver covered copper powder resistant to high temperature and preparing method of high-conductivity silver covered copper powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] (1) Example 1: Ag: Cu molar ratio is about 2: 1

[0045] Step 1) Add 1 g of flake copper powder with a size of 3-5 μm into 30 g of acetone or ethanol, soak and wash for 10 minutes, and redisperse the copper powder in 20 g of ethanol after centrifugation.

[0046] Step 2) Add 150 g of deionized water and 6 g of polyvinylpyrrolidone (PVP) to the ethanol dispersed with copper powder to obtain a reducing solution.

[0047] Step 3) Dissolve 5.1 g of solid silver nitrate in 100 g of deionized water, and then add 50 g of deionized aqueous solution containing 1 g of citric acid to the solution to obtain a silver stock solution.

[0048] Step 4) Under the conditions of maintaining stirring and ice-water bath, adding the silver stock solution into the reducing solution, stirring for 30 minutes to complete the reaction.

[0049] Step 5) centrifuging, washing with deionized water and acetone for 1-2 times, and vacuum drying at 80°C for 10 minutes to obtain silver-coated copper pow...

Embodiment 2

[0050] (2) Example 2: Ag: Cu molar ratio is about 1: 1

[0051] Step 1) Add 1 g of flake copper powder with a size of 3-5 μm into 30 g of acetone or ethanol, soak and wash for 30 minutes, and redisperse the copper powder in 20 g of ethanol after centrifugation.

[0052] Step 2) Add 150 g of deionized water and 6 g of polyvinylpyrrolidone (PVP) to the ethanol dispersed with copper powder to obtain a reducing solution.

[0053] Step 3) After dissolving 2.6g of solid silver nitrate in 100g of deionized water, add 50g of deionized aqueous solution containing 1g of citric acid to the solution to obtain a silver stock solution.

[0054] Step 4) Under the condition of keeping stirring and ice-water bath, add the silver stock solution into the reducing solution, and stir for 50 minutes to complete the reaction.

[0055] Step 5) centrifuging, washing with deionized water and acetone for 1-2 times, and vacuum drying at 80°C for 30 minutes to obtain silver-coated copper powder.

Embodiment 3

[0056] (3) Example 3: Ag: Cu molar ratio is about 1: 2

[0057] Step 1) Add 1 g of flake copper powder with a size of 3-5 μm into 30 g of acetone or ethanol, soak and wash for 20 minutes, and redisperse the copper powder in 20 g of ethanol after centrifugation.

[0058] Step 2) Add 150 g of deionized water and 6 g of polyvinylpyrrolidone (PVP) to the ethanol dispersed with copper powder to obtain a reducing solution.

[0059] Step 3) Dissolve 1.33g of solid silver nitrate in 100g of deionized water, and then add 50g of deionized aqueous solution containing 1g of citric acid to the solution to obtain a silver stock solution.

[0060] Step 4) Under the conditions of maintaining stirring and ice-water bath, adding the silver stock solution into the reducing solution, stirring for 40 minutes to complete the reaction.

[0061] Step 5) centrifuging, washing with deionized water and acetone for 1-2 times, and vacuum drying at 80°C for 20 minutes to obtain silver-coated copper powder...

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Abstract

The invention discloses high-conductivity silver covered copper powder resistant to high temperature and a preparing method of the high-conductivity silver covered copper powder. The method comprises the steps that (1)by weight, one part of copper powder is added into 30 parts of acetone or ethyl alcohol and after centrifugation is conducted, the mixture is diffused in 20 parts of ethyl alcohol; (2)by weight, 150 parts of deionized water and 6 parts of polyvinylpyrrolidone are added, so that reduced liquid is obtained; (3)by weight, 0.5 to 10 parts of solid silver nitrate are dissolved in 100 parts of deionized water, and after 50 parts of deionized water containing one part of citric acid is added, silver reduced liquid is obtained; (4) the silver reducing liquid is added into the reducing liquid and stirred; (5) centrifugation is conducted and after deionized water and acetone cleaning, the silver covered copper powder is obtained through drying. According to the silver covered copper powder prepared through the method, the silver content is 45% to 90%, the copper content is 10 % to 55%, the electrical resistivity is 2 to 5 times that of pure silver powder, the technology preparation procedure is simple, sources of raw materials are wide, and the requirement for environment protection is met.

Description

technical field [0001] The invention relates to the field of chemical silver plating, in particular to a high-temperature-resistant high-conductivity silver-coated copper powder and a preparation method thereof. The obtained silver-plated copper powder has high temperature resistance, oxidation resistance and low resistivity value. As the raw material of conductive materials, silver-plated copper powder is often used to prepare conductive plastics, conductive coatings, conductive adhesives, etc. Background technique [0002] Silver is a metal with high conductivity and is often used in electronics, solar energy and other industries, but it is expensive as a precious metal, so it is very important to find suitable replacement materials. The purpose of this case is to find a suitable material - a composite material of silver and other metals, to replace silver powder. In view of the fact that some application fields need to undergo high-temperature treatment, and many metals...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02C23C18/42
Inventor 游宇健韩玉杰黄翠
Owner 游京晶