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Copper alloy electroconduction slurry and preparation method thereof

A technology of conductive paste and copper alloy, which is applied to conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc. , copper conductive paste is easy to oxidize and other problems, to achieve the effect of strong operability, simple steps and low cost

Inactive Publication Date: 2014-07-16
刘金宁
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention provides a copper alloy conductive paste in order to solve the problem that the copper conductive paste in the prior art is easy to oxidize and generate copper-silicon compounds. The copper alloy conductive paste of the present invention maintains the pure copper powder conductive paste Low resistivity, oxidation resistance and not easy to form copper-silicon compound, very suitable for solar cells, LEDs, thick film integrated circuits, integrated electronic components and other fields

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] (1) Preparation of organic carrier: take by weighing 30Kg of terpineol, 5Kg of butyl carbitol, 5Kg of butyl carbitol acetate, 2Kg of ethyl cellulose, 5Kg of diethyl phthalate and sorbitan stearyl After 3Kg of the ester, mix the components and keep stirring at 70°C until the liquid is uniform and transparent, and the organic vehicle is obtained.

[0027] (2) Preparation of glass powder: take Bi 2 o 3 : 20Kg, B 2 o 3 : 5Kg, NaF: 1Kg, SiO2: 10Kg, ZnO: 5Kg, TiO 2 : 1Kg, Al 2 o 3 : 10Kg, P 2 o 5 : After 1Kg, mix the components, dry at 200°C for 2h, take it out and melt at 1000°C for 30min, quench with deionized water, then dry, and grind with a ball mill for 8h to get glass powder.

[0028] (3) Pulp making: Weigh 50Kg of copper-containing alloy conductive powder, 1Kg of glass powder, and 10Kg of organic carrier, mix and grind the components until the fineness is ≤10μm, and the viscosity is 20-200Pa.s to obtain copper alloy conductive paste Material, wherein, the cop...

Embodiment 2

[0030] (1) Preparation of organic carrier: take by weighing terpineol 40Kg, butyl carbitol 10Kg, butyl carbitol acetate 8Kg, ethyl cellulose 6Kg, diethyl phthalate 15Kg and sorbitan stearyl After 4Kg of the ester, the components were mixed and stirred continuously at 78°C until the liquid became uniform and transparent, and the organic vehicle was obtained.

[0031] (2) Preparation of glass powder: take Bi 2 o 3 : 30Kg, B 2 o 3 : 15Kg, NaF: 1.5Kg, SiO 2 : 20Kg, ZnO: 10Kg, TiO 2 : 7Kg, Al 2 o 3 : 12Kg, P 2 o 5 : After 3Kg, mix the components, dry at 205°C for 2.5h, take it out and melt at 1050°C for 35min, quench with deionized water, then dry, grind with a ball mill for 8.5h to get glass powder.

[0032] (3) Pulp making: Weigh 70Kg of copper-containing alloy conductive powder, 8Kg of glass powder, and 15Kg of organic carrier, mix and grind the components until the fineness is ≤10μm, and the viscosity is 20-200Pa.s to obtain copper alloy conductive paste material, whe...

Embodiment 3

[0034] (1) Preparation of organic carrier: take by weighing terpineol 70Kg, butyl carbitol 15Kg, butyl carbitol acetate 10Kg, ethyl cellulose 15Kg, diethyl phthalate 20Kg and sorbitan stearyl After 5Kg of the ester, the components were mixed, and stirred continuously at 80°C until the liquid became uniform and transparent, and the organic vehicle was obtained.

[0035] (2) Preparation of glass powder: take Bi 2 o 3 : 60Kg, B 2 o 3 : 20Kg, NaF: 2Kg, SiO 2 : 30Kg, ZnO: 15Kg, TiO 2 : 10Kg, Al 2 o 3 : 30Kg, P 2 o 5 : Mix the components after 5Kg, dry at 210°C for 3h, take it out and melt at 1100°C for 40min, quench with deionized water, then dry, grind with a ball mill for 9h to get glass powder.

[0036] (3) Slurry: Weigh 90Kg of copper-containing alloy conductive powder, 10Kg of glass powder, and 40Kg of organic carrier, mix and grind the components until the fineness is ≤10μm, and the viscosity is 20-200Pa.s to obtain copper alloy conductive paste Material, wherein, t...

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Abstract

The invention discloses copper alloy electroconduction slurry. The problem that copper electroconduction slurry in the prior art is prone to oxidation and then copper silicon compounds are easily generated is solved. The copper alloy electroconduction slurry comprises the following components, by weight, 50-90 parts of conductive powder containing copper alloy, 1-10 parts of glass powder and 10-40 parts of organic carriers. The copper alloy electroconduction slurry has the advantages that low electrical resistivity of pure copper powder electroconduction slurry is maintained, and the copper alloy electroconduction slurry has oxidative resistance, copper silicon compounds are not easily generated, and the copper alloy electroconduction slurry is suitable for the fields of solar cells, LEDs, thick-film integrated circuits, integrated electronic elements and the like. A preparation method of the copper alloy electroconduction slurry includes the following steps of preparing the organic carriers, preparing the glass powder and preparing the slurry. The preparation method is simple in step, high in operability, low in cost and suitable for industrial production.

Description

technical field [0001] The invention relates to a conductive paste, in particular to a copper alloy conductive paste and a preparation method thereof. Background technique [0002] Conductive paste is the basis for the development of electronic components. It is the key material for packaging, electrodes and interconnection. It is a high-tech electronic functional material integrating metallurgy, chemical industry and electronic technology. It is mainly used in the manufacture of thick film integrated circuits, sensitive Components, capacitors, potentiometers, solar cells, LEDs, automotive glass and other fields of the electronics industry. [0003] The conductive components in the conductive paste are generally composed of graphite powder, gold, silver, copper, palladium, platinum, and ruthenium powder. In terms of performance, metal powder has better conductivity, followed by carbon powder; gold and platinum have the best stability, silver and copper have the best conduct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
Inventor 刘金宁刘小敏陈斐邢杰
Owner 刘金宁
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