A pressure sensitive device using axial sintering of ceramic metal shell
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A technology of ceramic metal and sensitive devices, which is used in the measurement of fluid pressure by changing ohmic resistance, and the measurement of the property force of piezoelectric resistance materials. It can solve the problems of large axial size and large radial size, and achieve shrinking The effect of axial dimensions, firm connection and simple sintering process
Inactive Publication Date: 2016-03-02
NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
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[0004] The purpose of the present invention is to solve the problem of large axial dimension and radial dimension of existing pressure sensitive devices, and provide a pressure sensitive device adopting axial sintering of ceramic metal tube shell
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specific Embodiment approach 1
[0021] Specific implementation mode one: combine figure 1 In this embodiment, a pressure-sensitive device adopting axial sintering of a ceramic-metal shell includes a lead wire 1, a tube base 2, a ceramic insulating material 3, a multilayer composite material 4, a borosilicate glass base 5, and a glass-metal composite material 6. Metal electrode 7, chip 8 and sealing ring 9;
[0022] Among them, the ceramic insulating material 3 is sintered together with the lead wire 1 and the tube base 2 at a high temperature under a protective atmosphere; Sintered together with the ceramic insulating material 3 through solder, and sintered together with the surface of the inner hole of the lead wire 1 and the sealing ring 9 through solder;
[0023] The lead wire 1 runs through the ceramic insulating material 3, the multilayer composite material 4 and the borosilicate glass base 5, and the lead wire 1 is connected to the metal electrode 7 by sintering at a low temperature under a protective...
specific Embodiment approach 2
[0032] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the ceramic insulating material 3 is Al 2 o 3 , SiC, BeO, TiO 2 , ZrO 2 , MgO, AlN, Si 3 N 4 , BN and mixtures of the above substances. Others are the same as the first embodiment.
specific Embodiment approach 3
[0033] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the multilayer composite material 4 is a wafer structure, and the edge of the upper surface of the multilayer composite material 4 is chamfered . Others are the same as those in Embodiment 1 or 2.
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Abstract
The invention discloses a pressure-sensitive device with axial sintering of a ceramic metal tube shell adopted, and relates to a pressure-sensitive device. The pressure-sensitive device solves the problem that the axial size and the radial size of an existing pressure-sensitive device are large. The pressure-sensitive device comprises a lead, a tube base, a ceramic insulating material, a multi-layer composite material, a borosilicate glass base, a glass-metal composite material, a metal electrode, a chip and a seal ring. The upper surface of the borosilicate glass base and the lower surface of the chip are in static connection to form a seal structure. The method of axial low-temperature sintering is used for sintering the lower surface of the borosilicate glass base and the upper surface of the ceramic insulating material into a whole through the multi-layer composite material, the multi-layer composite material is of a wafer structure, the lower surface of the borosilicate glass base is square and the diameter of the multi-layer composite material is larger than or equal to the diagonal line of a square of the lower surface of the borosilicate glass base. The pressure-sensitive device with axial sintering of the ceramic metal tube shell adopted is used in the field of pressure-sensitive devices.
Description
technical field [0001] The invention relates to a pressure sensitive device. Background technique [0002] There are mainly two packaging methods for existing pressure-sensitive devices. One is to use the front of the pressure-sensitive chip as the pressure-sensing surface, which is sensitive to the high and low pressure signals formed by the inner and outer chambers, and outputs a strain proportional to the pressure difference to form a positive pressure sensor. , Negative two strain areas; at the same time, due to the piezoresistive effect, the resistivity of the material will change accordingly, and the sensitive chip will output a voltage signal proportional to the measured pressure. By measuring the magnitude of the voltage signal, you can Realize pressure measurement; this packaging method requires leads (gold wire, silicon aluminum wire) to form an electrical connection between the electrodes on the front of the pressure-sensitive chip and the electrodes of the suppor...
Claims
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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/18G01L9/06
Inventor 苗欣吴亚林张伟亮王长虹
Owner NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
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