Flexible metal laminate containing fluorocarbon resin

A fluorinated polymer, flexible metal technology, applied in the direction of metal layered products, synthetic resin layered products, coatings, etc. Copper foil circuit peeling and other problems, to achieve the effect of high heat resistance, low dielectric constant, and high chemical resistance

Active Publication Date: 2014-07-30
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem that the adhesion to the cover layer or to the prepreg (prepreg) is reduced
Also, since the value of the coefficient of thermal expansion (CTE) in the above-mentioned patent embodiment is too large, it has limitations when used as a flexible metal laminate
In addition, since the fluorinated polymer is exposed to the surface, the fluorinated polymer dissolves during high-temperature storage, leading to the risk of peeling the copper foil line from the insulation

Method used

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  • Flexible metal laminate containing fluorocarbon resin
  • Flexible metal laminate containing fluorocarbon resin
  • Flexible metal laminate containing fluorocarbon resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0079] Example 1: Preparation of polyamic acid varnish comprising dispersed fluorinated polymer powder (1)

[0080] After being filled with nitrogen in a 1L PE bottle, add 300g DMAc, 57g PTFE powder (average particle diameter 0.1 to 2 microns), 5.7g polycaprolactone diol (Mn=2,000) as a polyester dispersant, and 200g ball mill, and agitate the mixture in a high speed ball milling device to disperse the PTFE. After dispersion, 4.49g of 6FDA, 19.86g of PMDA and 32.41g of TFDB were added to the PTFE dispersion solution, and the mixture was stirred at 50°C for 10 hours to react, thereby obtaining a polyamic acid varnish with a viscosity of about 15000cps.

Embodiment 2

[0081] Example 2: Preparation of polyamic acid varnish comprising dispersed fluorinated polymer powder (2)

[0082] The polyamic acid varnish was prepared in the same manner as in Example 1, except that 38 g of PTFE powder (average particle diameter 0.1 to 2 microns) was added.

Embodiment 3

[0083] Embodiment 3: the preparation of polyamic acid varnish

[0084] After 200g of DMAc was packed into a 500mL round bottom flask, 12.07g of PMDA and 23.18g of BAPP were added, and the mixture was stirred at 50° C. for 10 hours to obtain a polyamic acid with a viscosity of 3,000 cps while being fed with nitrogen gas using a stirrer. solution.

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Abstract

The present invention relates to a flexible metal laminate having low permittivity, capable of being applied to a soft printed circuit board. According to one aspect of the present invention, the flexible metal laminate comprises: a first metal layer; a first polyimide layer; a polyimide layer in which a fluorocarbon resin, which is formed on the first polyimide layer, is dispersed; and a second polyimide layer formed on the polyimide layer in which a fluorocarbon resin is dispersed, wherein the content per unit volume of the fluorocarbon resin is greater in a depth of 40-60% than in a depth of 5-10% of the total thickness from the surface of the polyimide layer in which a fluorocarbon resin is dispersed.

Description

technical field [0001] The present invention relates to a flexible metal laminate comprising a fluorinated polymer. More specifically, the present invention relates to a flexible metal laminate suitable for use in flexible printed circuits. Background technique [0002] Flexible metal laminates are mainly used as substrates for flexible printed circuit boards, and they can also be used as electromagnetic shielding materials for flat heating components, flat cables, packaging materials, and the like. In the flexible metal laminate, the flexible copper clad laminate is composed of a polyimide layer and a copper foil layer, and it depends on whether there is an epoxy adhesive layer between the polyimide layer and the copper foil layer. Divided into adhesive type and non-adhesive type. The non-adhesive flexible copper foil laminate is formed by directly bonding polyimide to the surface of copper foil, and with the recent trend of miniaturization and thinning of electronic prod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08H05K1/03B05D7/16
CPCB32B15/08B32B27/08B32B27/281
Inventor 朴永锡朴谆龙张世明
Owner GUANGDONG SHENGYI SCI TECH
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