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Multi-particle ceramic/metal compound heat dissipation substrate and preparation method thereof

A technology of metal composite materials and heat dissipation substrates, applied in lighting and heating equipment, cooling/heating devices of lighting devices, point light sources, etc., can solve chip failure, heat dissipation substrate expansion coefficient cannot match chip substrate and aluminum heat sink To achieve the effect of prolonging the life of the LED, keeping the heat transfer path smooth for a long time, and reducing the stress level

Inactive Publication Date: 2014-08-06
襄阳新瑞源科技信息有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Through the above analysis, it can be found that the crux of the heat dissipation problem is that the expansion coefficient of the heat dissipation substrate cannot be well matched with the chip substrate and the aluminum heat sink, resulting in chip failure.

Method used

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  • Multi-particle ceramic/metal compound heat dissipation substrate and preparation method thereof
  • Multi-particle ceramic/metal compound heat dissipation substrate and preparation method thereof
  • Multi-particle ceramic/metal compound heat dissipation substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] 1) Preparation of foamed silicon carbide ceramic blocks

[0058] According to the patent: A high-strength silicon carbide foam ceramic and its preparation method (ZL00110479.9), a cylindrical silicon carbide foam ceramic block is prepared with a volume fraction of 60%, such as figure 2 shown.

[0059] 2) Aluminum smelting

[0060] Select industrial pure aluminum and put it into a pit furnace with a melting temperature of 850°C.

[0061] 3) Squeeze casting

[0062] First put the silicon carbide foam ceramic block into the box furnace for preheating, the preheating temperature is 800 °C;

[0063] At the same time, preheat the composite mold to 300 °C with acetylene flame or blowtorch;

[0064] Then put the preheated silicon carbide foam ceramic block into the composite mould, and at the same time pour the aluminum liquid into the mould, pressurize and fill the mould. The applied pressure is 100 MPa; the pressurization time is 20 s; the holding time is 40 s.

[0065...

Embodiment 2

[0074] The difference from Example 1 lies in the arrangement of the foam ceramics. Foam ceramics are arranged in a hexagonal shape, such as Figure 5 shown.

Embodiment 3

[0076] The difference from Example 1 lies in the shape of the ceramic foam block. Foam ceramic block choose cuboid. Such as Figure 6 shown.

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Abstract

The invention discloses a multi-particle ceramic / metal compound heat dissipation substrate and a preparation method thereof. The heat dissipation substrate comprises a ceramic / metal compound material formed by compounding a plurality of ceramics with metal, an insulation layer and a circuit layer, wherein each ceramic and metal compound part is a particle in the ceramic / metal compound material; the total area of particles accounts for 10%-80% that of the ceramic / metal compound material. The heat dissipation substrate has the characteristics of high heat conduction rate, small heat expansion coefficient, low cost, convenience in use and the like, and is applied to the aspects of lamp decorations, communication electronic equipment, power modules, computers, automotive electronics and the like; the stress level of the connection layer of a chip or device substrate and the heat dissipation substrate can be greatly reduced, that the heat dissipation substrate is in close contact with heat sinks of lamps, machine cases and the like can be kept, a heat transfer passage is kept unblocked for a long term, the weight of the metal heat sinks can be reduced, and a heat transfer technology guarantee is provided for greatly prolonging the service lives of components and economically utilizing heat sink materials.

Description

technical field [0001] The invention relates to the design and preparation technology of a novel heat dissipation substrate, in particular to a heat dissipation substrate of a multi-particle ceramic / metal composite material and a preparation method thereof. Background technique [0002] Heat dissipation substrates are widely used in the fields of electronics and electric power. Taking the rapidly developing semiconductor lighting (LED) technology as an example, LED lamps must have excellent heat dissipation capabilities to ensure that LED chips maintain their proper luminous efficiency for a long time, and their energy-saving materials are ultimately guaranteed. The typical heat dissipation process of flip-chip packaged LED lamps is as follows: figure 1 As shown, 1 is the LED chip, 2 is the flip-chip layer, 3 is SiC or other substrates, 4 is the die-bonding glue, 5 is the heat dissipation substrate, 6 is the gold wire lead, 7 is the heat-conducting glue, and 8 is the alumin...

Claims

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Application Information

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IPC IPC(8): F21V29/00F21Y101/02F21Y115/10
Inventor 张劲松金鹏许卫刚曹小明杨振明田冲付强
Owner 襄阳新瑞源科技信息有限公司
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