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Preparation method for bisphenol A modified phenolic paper-based single-side copper-clad plate

A technology of phenolic paper base and copper clad laminate, applied in chemical instruments and methods, lamination devices, lamination, etc., can solve problems such as production difficulties, poor quality stability, easy aging, etc., and achieve high peel strength and high temperature resistance , the effect of stable quality

Inactive Publication Date: 2014-08-13
江阴市明康绝缘玻纤有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the price of 6101 epoxy resin is high, it is easy to age after being mixed with phenolic resin, and the cost is high, and the storage time of the paper-based prepreg is short, the quality stability is poor, it is difficult to produce in summer, it needs to be stored in an air-conditioned room, and the cost is high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A method for preparing bisphenol A modified phenolic paper-based single-sided copper-clad laminate, the preparation method comprising the following steps:

[0040] 1. Preparation of epoxy phenolic resin mixed solution:

[0041] The raw material mass portion proportioning of described bisphenol A modified phenolic resin mixed solution is as follows:

[0042] 2200 parts soybean oil

[0043] Bisphenol A 1600 parts

[0044] Phenol 190 parts

[0045] 2 ~ 4 parts of methylimidazole

[0046] Formaldehyde 1100 parts

[0047] 22 parts of triethylamine

[0048] Ammonia 13 parts

[0049] Methanol 4500 parts

[0050] During preparation, introduce soybean oil, bisphenol A, phenol, and 2-methylimidazole into the reaction kettle for reaction, the reaction temperature is 165°C, the constant temperature reaction time is 200-260min, after cooling to 100°C, formaldehyde, triethylimidazole The amine and ammonia water were respectively inhaled into the reaction kettle for secondary ...

Embodiment 2

[0055] The difference between embodiment 2 and embodiment 1 is only the ratio of raw materials by mass of bisphenol A modified phenolic resin mixed solution:

[0056] 2000 parts soybean oil

[0057] Bisphenol A 1500 parts

[0058] 150 parts of phenol

[0059] 2 ~ 3 parts of methylimidazole

[0060] Formaldehyde 1000 parts

[0061] 20 parts of triethylamine

[0062] Ammonia 10 parts

[0063] Methanol 4000 parts

Embodiment 3

[0065] The difference between embodiment 2 and embodiment 1 is only the ratio of raw materials by mass of bisphenol A modified phenolic resin mixed solution:

[0066] 2350 parts of soybean oil

[0067] Bisphenol A 1950 parts

[0068] Phenol 220 parts

[0069] 2 ~ 4.5 parts of methylimidazole

[0070] Formaldehyde 1150 parts

[0071] 23 parts of triethylamine

[0072] Ammonia 15 parts

[0073] Methanol 4600 parts

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Abstract

The invention discloses a preparation method for a bisphenol A modified phenolic paper-based single-side copper-clad plate. The method comprises two steps, i.e., preparation of an epoxy phenolic resin mixed solution and preparation of a copper-clad laminate, wherein the epoxy phenolic resin mixed solution is a bisphenol A modified epoxy phenolic resin mixed solution prepared through mixing of soybean oil, bisphenol A, phenol, 2-methylimidazole, formaldehyde, triethylamine, ammonia water and methanol. According to the preparation method, the bisphenol A modified epoxy phenolic resin mixed solution is adopted for dipping of paper-based prepreg, and the prepared paper-based copper-clad plate has the advantages of uneasy layering, good flatness, high temperature resistance, no bubbling during high temperature welding and stable quality.

Description

technical field [0001] The invention relates to a preparation method of a bisphenol A modified phenolic paper-based single-sided copper-clad laminate, which is mainly used in the technical field of copper-clad laminate production. Background technique [0002] Copper-clad laminate is a plate-shaped material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing. It is called copper-clad laminate ( Copper Clad Laminate, CCL), referred to as copper clad laminate. [0003] Copper-clad laminates are extremely important basic materials for printed circuit boards. Printed circuit boards of various forms and functions are selectively processed, etched, drilled and plated on copper-clad laminates. Copper and other processes are made into different printed circuits (single-sided, double-sided, multi-layer). As the substrate material in the manufacture of printed circuit boards, co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B15/12C08L61/14C08L91/00C08G8/24
Inventor 王宏章陆富才陶雪松
Owner 江阴市明康绝缘玻纤有限公司
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