Device and method for conducting plastic package forming and bottom-filling on flip chip through ultrasonic vibration assistance

Abstract

The invention discloses a device and method for conducting plastic package forming and bottom-filling on a flip chip through ultrasonic vibration assistance. The device is mainly composed of an ultrasonic generator (11), an ultrasonic transducer (12), an ultrasonic vibration tool head (2), a heating platform (7), a heating system (15), an air pump (14), an air cylinder (13), a three-coordinate mechanical arm (16) and a dispensing machine, wherein the ultrasonic generator converts the mains supply into high-frequency alternating-current electric signals matched with the ultrasonic transducer and drives the ultrasonic transducer to work; the ultrasonic transducer converts the high-frequency alternating-current electric signals into ultrasonic vibration, and after being amplified by an amplitude-change pole, the mechanical vibration amplitude is transmitted to the ultrasonic vibration tool head; the heating platform is located under the ultrasonic vibration tool head and connected with the heating system, and after the heating system is started, the heating platform is heated to heat a substrate and a chip. The method includes the steps of preheating, dispensing, seam filling and adhesive curing. The device and method have the advantages of being low in low, simple in procedure, high in production efficiency and the like.

Description

technical field [0001] The invention relates to a flip-chip plastic packaging molding process, in particular to an ultrasonic vibration-assisted flip-chip plastic packaging molding lower filling device and method. Background technique [0002] Flip chip has high I / O density, short interconnection path, low circuit parasitic and excellent heat dissipation performance. It is widely used in computer, wireless communication, network, telecommunications / data, automotive electronics and consumer products. Become the key technology of low-cost high-density packaging. [0003] With the development of high-density flip-chip production technology, the size of silicon chips is getting larger and larger (30×30mm 2 ), the density of solder joints is getting higher and higher (5000 solder joints), the spacing of solder joints is getting smaller and smaller (up to 50 microns), and the gap height after assembly and welding is getting smaller and smaller (up to 30 microns). The gap filling...

AI Technical Summary

Problems solved by technology

[0003] With the development of high-density flip-chip production technology, the size of silicon chips is getting larger and larger (30×30mm 2 ), the density of solder joints is getting higher and higher (5000 solder joints), the spacing of solder joints is getting smaller and smaller (up to 50 microns), and the gap height after assembly and welding is getting smaller and smaller (up to 30 microns). The gap filling process of the chip is mainly driven by capillary action. This kind of traditional underfill production process has encountered great difficulties: in terms of molding, the capillary driving force is insufficient and the curing process is complicated and slow; The bonding strength of the adhesive wall surface becomes poor, and the performance of the sealant layer decreases due to the non-uniform distribution of fillers

This traditional underfill process makes it difficult for the produced flip chip to meet the performance requirements in actual production

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