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Methods and apparatus to provide transient event protection for circuits

An event and circuit technology, applied in circuit devices, emergency protection circuit devices for limiting overcurrent/overvoltage, emergency protection circuit devices, etc., can solve problems such as signal crosstalk

Active Publication Date: 2014-09-17
THE BOEING CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, in some systems, interconnect failures can lead to undesired phenomena in the circuit, such as signal crosstalk
[0002] In one such system, certain interconnect failures may cause signal crosstalk by circulating current on the signal lines through the ESD protection circuit

Method used

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  • Methods and apparatus to provide transient event protection for circuits
  • Methods and apparatus to provide transient event protection for circuits
  • Methods and apparatus to provide transient event protection for circuits

Examples

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Embodiment Construction

[0043] Electronic systems and modern avionics subsystems may employ several integrated circuits (ICs) of different semiconductor process technologies. Exemplary semiconductor processing technologies include bipolar, complementary metal oxide semiconductor (CMOS), BiCMOS, gallium arsenide (GaAs), gallium nitride (GaN), and silicon germanium (SiGe). Operation of ICs using these technologies may require one or more power supply circuits and / or one or more bias voltages. For example, a phased array communication antenna system may include hundreds of individual radio frequency electronic modules using CMOS ICs and / or GaAs ICs. Multiple direct current (DC) power sources (eg, energy sources of multiple voltages) may be required for proper operation of such systems.

[0044] Exemplary methods and apparatus disclosed herein provide protection against transient electrical events, such as electrostatic discharge, in ICs. In known ICs, signal crosstalk between different communication l...

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Abstract

Methods and apparatus to provide transient event protection for circuits are disclosed. An example apparatus includes a first clamp circuit. The first power circuit provides a first reference voltage. The first clamp circuit directs energy from a signal node to the first power circuit in response to a transient resulting in a voltage at the signal node being lower than a second reference voltage. The apparatus also includes a second clamp circuit. The second clamp circuit includes a transistor. A collector terminal of the transistor is prevented from having a lower voltage than the second reference voltage. A second power circuit provides the second reference voltage, which is lower than the first reference voltage. The second clamp circuit directs energy from the signal node to the second power circuit in response to a transient resulting in the voltage at the signal node being higher than the first reference voltage.

Description

Background technique [0001] The aerospace environment presents challenging conditions for electronic assemblies. For example, electrical and mechanical interconnections between integrated circuits and underlying substrates can fail after exposure to moisture, temperature cycling, and / or vibration. Metal corrosion, solder creep, material fatigue, and intermetallic compound formation are also well-known causes of interconnect failure in electronic systems. Furthermore, in some systems, interconnect failures can lead to undesired phenomena in the circuit, such as signal crosstalk. [0002] In one such system, certain interconnect failures may cause signal crosstalk by circulating current on the signal lines through the ESD protection circuit. Accordingly, there remains a need for an electrostatic discharge protection circuit that reduces or eliminates the flow of circulating current in the event of interconnect failure. Contents of the invention [0003] The disclosed exempl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02H9/04
CPCH02H9/046H02H9/005G06F17/5081H01L27/0259G06F17/5068G06F2117/02G06F30/398G06F30/39
Inventor F·史
Owner THE BOEING CO