Copper-based contact material applied to lower-voltage apparatus and preparation method of copper-based contact material
A technology of contact material and low-voltage electrical appliances, which is used in cable/conductor manufacturing, circuits, electrical components, etc., can solve the problems of increased contact resistance and increased temperature of contacts, and achieves low contact resistance between contacts and high contact Low temperature rise, less oxidative denaturation
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0022] To make contacts with 1% titanium carbide and copper balance by weight percentage:
[0023] a. Powder mixing: Put 99 kg of -200 mesh electrolytic copper powder and 1 kg of titanium carbide powder with an average particle size of 1.2 microns into a V-shaped forced powder mixing machine for 2 hours;
[0024] B. Pressing: Weigh the uniformly mixed powder, 10 kilograms per portion of powder, put it into the die sleeve of the cold isostatic press, hold the pressure for 5 minutes under the pressure of 300MPa, and press it into a cylindrical ingot;
[0025] c. Sintering: sinter the ingot under the protection of argon for 3 hours, and the sintering temperature is 920 degrees;
[0026] d. Extrusion: After heating the sintered ingot to 830 degrees, put it into a hot extrusion machine for extrusion, and extrude it into a plate with a width of 68mm and a thickness of 4mm;
[0027] e. Rolling: cold-roll the extruded plate to the thickness of 1.0mm specified in the drawing;
[0028...
Embodiment 2
[0030] To make a contact with 40% titanium carbide and copper balance by weight percentage:
[0031] a. Powder mixing: Put 60 kg of -200 mesh electrolytic copper powder and 40 kg of titanium carbide powder with an average particle size of 1.0 microns into a V-type forced powder mixing machine for 4 hours;
[0032] B, pressing: Weigh the evenly mixed powder, 10 kilograms of every portion of powder, put it into the die sleeve of the cold isostatic press, hold the pressure for 5 minutes under the pressure of 340MPa, and press it into a cylindrical ingot;
[0033] c. Sintering: sinter the ingot under the protection of argon for 3 hours, and the sintering temperature is 950 degrees;
[0034] d. Extrusion: After heating the sintered ingot to 840 degrees, put it into a hot extrusion machine for extrusion, and extrude it into a plate with a width of 68mm and a thickness of 4mm;
[0035] e. Rolling: cold-roll the extruded plate to the thickness of 2.5mm specified in the drawing;
[0...
Embodiment 3
[0038] Make contacts with 1% titanium carbide, 0.01% graphite, and copper balance by weight percentage:
[0039] a. Powder mixing: Put 98.99 kg of -200 mesh electrolytic copper powder, 1 kg of titanium carbide powder with an average particle size of 1.0 microns, and 0.01 kg of graphite powder with an average particle size of 0.8 microns, and put them into a V-shaped forced powder mixer for 2 hours of powder mixing ;
[0040] B, pressing: Weigh the evenly mixed powder, 10 kilograms of every portion of powder, put it in the die sleeve of the cold isostatic press, hold the pressure for 5 minutes under the pressure of 340MPa, and press it into a cylindrical ingot;
[0041] c. Sintering: sinter the ingot under the protection of argon for 3 hours, and the sintering temperature is 900 degrees;
[0042] d. Extrusion: After heating the sintered ingot to 840 degrees, put it into a hot extrusion machine for extrusion, and extrude it into a plate with a width of 68mm and a thickness of 4...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com