Surface modification method of aluminate yellow fluorescent powder for LED

A yellow phosphor and surface modification technology, applied in the field of surface modification of aluminate yellow phosphor for LED, can solve the problems of poor compatibility of carrier glue, low product qualification rate, fast settling speed, etc., and achieve good compatibility , The effect of high product qualification rate and slow settling speed

Active Publication Date: 2014-10-29
CAIHONG GRP ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the rapid development of LED lighting, the market has put forward higher requirements for aluminate phosphors for LEDs. At present, the commercial phosphors generally have poor compatibility with the carrier gel during use. Disadvantages such as too fast settling speed and low product qualification rate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Step 1, nano-SiO2 surface pretreatment:

[0036] Add 1ml tetraethyl orthosilicate to 30ml ethanol solution, under the condition of rapid stirring at 200 rpm, titrate with ammonia water with a concentration of 0.013mol / L until the pH value is about 8.5, the reaction temperature is 60°C, and react for 1h Then add 20g aluminate yellow fluorescent powder, and continue to stir for 2h;

[0037] Step 2, polyethylene glycol (PEG) surface modification:

[0038] Add 1.16g of PEG into 90ml of acetone solution, stir for 30min, mix with the solution obtained in step 1, and react for 40min under the condition of high-speed stirring at 1000 rpm. Add 468.75ml of CTAC aqueous solution with a concentration of 0.001mol / L into the mixed solution, and stir rapidly at 400 rpm for 12 hours, then dry at 100°C for 24 hours, and pass the dried phosphor powder through a 200-mesh sieve to obtain Primary products for surface treatment;

[0039] Step 3, low temperature sintering treatment:

[00...

Embodiment 2

[0042] Step 1, nano-SiO2 surface pretreatment:

[0043] Add 15ml of tetraethyl orthosilicate to 750ml of ethanol solution, and titrate with ammonia water at a concentration of 0.026mol / L under the condition of rapid stirring at 300 rpm until the pH value is about 9.0, the reaction temperature is 70°C, and the reaction is 2 hours Finally, add 300g aluminate yellow fluorescent powder and continue stirring for 3h;

[0044] Step 2, polyethylene glycol (PEG) surface modification:

[0045] Add 17.4g of PEG to 1.35L of acetone solution, stir for 35min, mix with the solution obtained in step 1, and react for 50min under the condition of high-speed stirring at 1200 rpm; Add 8 L of ammonium chloride (CTAC) aqueous solution into the mixed solution, and stir rapidly at 500 rpm. After stirring for 36 hours, dry at 100°C for 24 hours, and pass the dried fluorescent powder through a 200-mesh sieve to obtain a surface-treated primary product;

[0046] Step 3, low temperature sintering treat...

Embodiment 3

[0049] Step 1, nano-SiO2 surface pretreatment:

[0050] Add 3ml tetraethyl orthosilicate to 135ml ethanol solution, and titrate with 0.04mol / L ammonia water at a concentration of 0.04mol / L under the condition of rapid stirring at 270rpm, until the pH value is about 8.2, the reaction temperature is 70°C, and the reaction is 2h Finally, add 50g of aluminate yellow fluorescent powder and continue stirring for 4h;

[0051] Step 2, polyethylene glycol (PEG) surface modification:

[0052]Add 3.5g of PEG into 270ml of acetone solution, stir for 35min, mix with the solution obtained in step 1, and react for 60min under the condition of high-speed stirring at 1380 rpm; ) aqueous solution 750ml was added to the mixed solution, and stirred rapidly at 480 rpm for 36 hours, and then dried at 90°C for 36 hours, and the dried fluorescent powder was passed through a 200-mesh sieve to obtain a surface-treated primary product;

[0053] Step 3, low temperature sintering treatment:

[0054] Pu...

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PUM

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Abstract

The invention relates to a surface modification method of aluminate yellow fluorescent powder for an LED. The method comprises the following technical steps: nano SiO2 surface pretreatment; surface modification by polyethylene glycol; low-temperature sintering treatment and the like. The method specifically comprises the following steps: adding the aluminate yellow fluorescent powder into a hydrating solution of ethyl orthosilicate; after reaction, carrying out surface modification by polyethylene glycol; by using N-hexadecyl trimethyl ammonium chloride as an emulsifier, drying; and in a nitrogen atmosphere, firing at low temperature to obtain the surface modified fluorescent powder. The aluminate yellow fluorescent powder provided by the invention has the characteristics of good compatibility with carrier glue, slow settling velocity in the carrier glue, high product percent of pass and the like and can be used for surface modification of synthesizing the aluminate yellow fluorescent powder.

Description

technical field [0001] The invention belongs to the technical field of fluorescent powder preparation, and in particular relates to a surface modification method of aluminate yellow fluorescent powder for LEDs. Background technique [0002] White light LED has significant advantages such as energy saving, environmental protection, greenness, and high efficiency. As a new type of all-solid-state lighting source, it is deeply valued by people. In recent years, with the continuous deepening of research on semiconductor light-emitting materials, the development and application of new LED manufacturing processes and new materials, breakthroughs have been made in ultra-high brightness LEDs of various colors. Due to its high luminous efficiency, low power consumption, long service life, strong safety and reliability, environmental protection and sanitation, LED lighting is considered by the industry to be one of the greatest inventions of human beings since Edison invented the inca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K11/02C09K11/80
Inventor 崔淑杰方向乾李蓬
Owner CAIHONG GRP ELECTRONICS CO LTD
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