Method for manufacturing diamond cutting wire

A technology of diamond cutting wire and manufacturing method, applied in metal material coating process, liquid chemical plating, coating and other directions, can solve the problems of nickel-phosphorus alloy wear, corrosion, peeling, etc., to improve corrosion resistance and hardness, The effect of improving hardness and wear resistance and improving service life

Inactive Publication Date: 2014-11-19
QINGDAO GAOCE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are following deficiencies in this kind of method for making electroplated diamond cutting wire: (1) the diamond micropowder that adopts is usually surface chemically plated one deck nickel-phosphorus alloy, and the corrosion resistance of the nickel-phosphorus alloy surface that this method obtains is not high enough, and long-term in electroplating solution Soaking will cause corrosion, which will affect the stability of continuous production of diamond cutting wire a

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] (1) Diamond micropowder surface treatment: Put the diamond micropowder with a particle size of 10 μm into a sodium hydroxide solution with a mass percent concentration of 10% for 2 hours to remove oil, wash with distilled water until neutral, and then put the diamond micropowder into the mass percent Soak in 30% nitric acid solution for 24 hours to remove solid impurities on the surface, then wash with distilled water until neutral. (2) Electroless nickel-tungsten-phosphorus alloy plating on the surface of diamond micropowder: after sensitization and activation treatment, the diamond micropowder obtained in step (1) is placed in an electroless nickel-tungsten-phosphorus plating solution, and a layer of nickel is chemically plated on the surface of diamond micropowder Tungsten-phosphorus alloy, diamond micropowder is electroless-plated nickel-tungsten-phosphorus alloy, and its weight increases by 45%, of which the tungsten content is 7%, and the phosphorus content is 7%. ...

Embodiment 2

[0026](1) Diamond micropowder surface treatment: put the diamond micropowder with a particle size of 35 μm into a sodium hydroxide solution with a mass percentage concentration of 10% for 50 minutes to remove oil, wash with distilled water until neutral, and then put the diamond micropowder into the mass percent Soak in 40% nitric acid solution for 20 hours to remove solid impurities on the surface, and then wash with distilled water until neutral. (2) Electroless nickel-tungsten-phosphorus alloy plating on the surface of diamond micropowder: after sensitization and activation treatment, the diamond micropowder obtained in step (1) is placed in an electroless nickel-tungsten-phosphorus plating solution, and a layer of nickel is chemically plated on the surface of diamond micropowder Tungsten-phosphorus alloy, diamond micropowder is electroless-plated nickel-tungsten-phosphorus alloy, and its weight increases by 30%, including 5% tungsten and 8% phosphorus; the electroless nicke...

Embodiment 3

[0028] (1) Diamond micropowder surface treatment: put the diamond micropowder with a particle size of 45 μm into a sodium hydroxide solution with a mass percent concentration of 10% for 30 minutes to remove oil, wash with distilled water until neutral, and then put the diamond micropowder into the mass percent concentration Soak in 40% nitric acid solution for 15 hours, remove the solid impurities on the surface, and then wash to neutrality with distilled water; (2) electroless nickel-tungsten-phosphorus alloy plating on the surface of diamond micropowder: sensitize the diamond micropowder obtained in step (1) , After activation treatment, put it in the electroless nickel-tungsten-phosphorus plating solution, and chemically plate a layer of nickel-tungsten-phosphorus alloy on the surface of the diamond micropowder. , phosphorus content 8%; electroless nickel tungsten phosphorus plating solution contains 30g / L nickel sulfate, 25g / L sodium hypophosphite, 15g / L sodium tungstate, 2...

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PUM

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Abstract

The invention relates to a method for manufacturing a diamond cutting wire. The method comprises the following steps: treating the surface of diamond micropowder; carrying out chemical nickel-tungsten-phosphorus alloy plating on the surface of the diamond micropowder; carrying out passivating treatment on a chemical nickel-tungsten-phosphorus alloy plating layer on the surface of the diamond micropowder; carrying out plating manufacture on the diamond cutting wire. According to the method, the diamond micropowder is subjected to the chemical nickel-tungsten-phosphorus alloy plating and then subjected to the passivating treatment, and a layer of passive film is formed on the chemical nickel-tungsten-phosphorus alloy plating layer on the surface of the diamond micropowder, so that the corrosion resistance and rigidity of the diamond micropowder are enhanced; the chemical nickel-tungsten-phosphorus alloy plating layer can be used for enhancing the abrasion resistance of the diamond micropowder and ensuring that an alloy layer on the surface of the diamond micropowder is difficult to abrade in the circulating process of a plating solution, so that the continuous and stable production of the diamond cutting wire can be realized, and the production length of the diamond cutting wire is increased.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to a method for manufacturing a diamond cutting wire. Background technique [0002] In the processing of hard and brittle materials such as silicon crystals, gemstones and ceramics, cutting is the key process. Due to the high brittleness and high hardness of hard and brittle materials, the cutting process is easy to cause damage to the material and reduce the yield. [0003] Electroplated diamond cutting wire is a commonly used cutting tool for hard and brittle materials. Electroplated diamond cutting wire uses electroplated metal as the binder and diamond as the abrasive. Through the electrodeposition of electroplated metal, the diamond particles are consolidated on the metal wire substrate. And made a cutting tool. The outstanding advantages of the electroplated diamond cutting wire are that the metal coating has a high holding force on abrasive grains, the coa...

Claims

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Application Information

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IPC IPC(8): C25D15/00B22F1/00C23C18/48
Inventor 高伟张顼王东雪
Owner QINGDAO GAOCE TECH CO LTD
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