Method for manufacturing diamond cutting wire
A technology of diamond cutting wire and manufacturing method, applied in metal material coating process, liquid chemical plating, coating and other directions, can solve the problems of nickel-phosphorus alloy wear, corrosion, peeling, etc., to improve corrosion resistance and hardness, The effect of improving hardness and wear resistance and improving service life
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Embodiment 1
[0024] (1) Diamond micropowder surface treatment: Put the diamond micropowder with a particle size of 10 μm into a sodium hydroxide solution with a mass percent concentration of 10% for 2 hours to remove oil, wash with distilled water until neutral, and then put the diamond micropowder into the mass percent Soak in 30% nitric acid solution for 24 hours to remove solid impurities on the surface, then wash with distilled water until neutral. (2) Electroless nickel-tungsten-phosphorus alloy plating on the surface of diamond micropowder: after sensitization and activation treatment, the diamond micropowder obtained in step (1) is placed in an electroless nickel-tungsten-phosphorus plating solution, and a layer of nickel is chemically plated on the surface of diamond micropowder Tungsten-phosphorus alloy, diamond micropowder is electroless-plated nickel-tungsten-phosphorus alloy, and its weight increases by 45%, of which the tungsten content is 7%, and the phosphorus content is 7%. ...
Embodiment 2
[0026](1) Diamond micropowder surface treatment: put the diamond micropowder with a particle size of 35 μm into a sodium hydroxide solution with a mass percentage concentration of 10% for 50 minutes to remove oil, wash with distilled water until neutral, and then put the diamond micropowder into the mass percent Soak in 40% nitric acid solution for 20 hours to remove solid impurities on the surface, and then wash with distilled water until neutral. (2) Electroless nickel-tungsten-phosphorus alloy plating on the surface of diamond micropowder: after sensitization and activation treatment, the diamond micropowder obtained in step (1) is placed in an electroless nickel-tungsten-phosphorus plating solution, and a layer of nickel is chemically plated on the surface of diamond micropowder Tungsten-phosphorus alloy, diamond micropowder is electroless-plated nickel-tungsten-phosphorus alloy, and its weight increases by 30%, including 5% tungsten and 8% phosphorus; the electroless nicke...
Embodiment 3
[0028] (1) Diamond micropowder surface treatment: put the diamond micropowder with a particle size of 45 μm into a sodium hydroxide solution with a mass percent concentration of 10% for 30 minutes to remove oil, wash with distilled water until neutral, and then put the diamond micropowder into the mass percent concentration Soak in 40% nitric acid solution for 15 hours, remove the solid impurities on the surface, and then wash to neutrality with distilled water; (2) electroless nickel-tungsten-phosphorus alloy plating on the surface of diamond micropowder: sensitize the diamond micropowder obtained in step (1) , After activation treatment, put it in the electroless nickel-tungsten-phosphorus plating solution, and chemically plate a layer of nickel-tungsten-phosphorus alloy on the surface of the diamond micropowder. , phosphorus content 8%; electroless nickel tungsten phosphorus plating solution contains 30g / L nickel sulfate, 25g / L sodium hypophosphite, 15g / L sodium tungstate, 2...
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