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A kind of method of oxygen-free copper surface nickel plating

An oxygen-free copper and nickel-plating technology, which is applied in the field of nickel-plating on the surface of oxygen-free copper, can solve the problems of affecting appearance and anti-corrosion performance, poor dispersion ability, rough coating, etc., and achieve the effect of not easy to crack, low cost and uniform nickel layer

Active Publication Date: 2018-05-22
ANHUI CHANGQING ELECTRONICS MACHINERY GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The prior art nickel-phosphorus alloy coating has the defect of poor dispersibility, that is, the problem of missing plating in the low current density area, and the existing electroplating nickel uses a constant current density for electroplating, and the current density directly affects the deposition rate of the coating, the current The density is high, the deposition speed is fast, and vice versa, it is slow, but after the current density is high, the coating will be rough or even burnt, which will affect the appearance and anti-corrosion performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0009] Example 1: A method for nickel-plating the surface of oxygen-free copper, comprising the following steps: (1) Sandblasting the surface of the oxygen-free copper substrate with 120-mesh quartz sand; (2) Immersing the oxygen-free copper substrate in pH 10 Soak in the alkaline cleaning solution for 3 minutes, clean the surface, remove the oil on the surface, rinse with water after electrolysis; (3), immerse the oxygen-free copper substrate in the mixture of dilute nitric acid and dilute sulfuric acid, of which The concentration ratio between them is 1:1 to remove the oxide film on the surface, and after pickling, put the oxygen-free copper substrate into clean water to clean it; (4), activate the oxygen-free copper substrate after the treatment in step 3, Soak the oxygen-free copper matrix in the mixed solution of stearic acid and sodium dodecylbenzenesulfonate for 5 minutes, and rinse it with clean water after the treatment; (5) Put the oxygen-free copper matrix Put into ...

Embodiment 2

[0012] A method for nickel-plating an oxygen-free copper surface, comprising the following steps: (1), sandblasting the surface of an oxygen-free copper substrate with 140-mesh quartz sand; (2), immersing the oxygen-free copper substrate in alkaline cleaning with a pH of 11 Soak in the solution for 4 minutes, clean the surface, remove the oil on the surface, rinse with water after electrolysis; (3), immerse the oxygen-free copper substrate in the mixture of dilute nitric acid and dilute sulfuric acid, the concentration of dilute nitric acid and dilute sulfuric acid is between The ratio is 1:1.5 to remove the oxide film on the surface, and after pickling, put the oxygen-free copper substrate into clean water to clean it; (4), activate the oxygen-free copper substrate after the treatment in step 3, and put the oxygen-free copper substrate Put the substrate into the mixed solution of stearic acid and sodium dodecylbenzenesulfonate for soaking, the soaking time is 7min, and rinse i...

Embodiment 3

[0014] A method for nickel-plating an oxygen-free copper surface, comprising the following steps: (1), sandblasting the surface of an oxygen-free copper substrate with 160-mesh quartz sand; (2), immersing the oxygen-free copper substrate in alkaline cleaning with a pH of 12 Soak in the solution for 6 minutes, clean the surface, remove the oil on the surface, rinse with water after electrolysis; (3), immerse the oxygen-free copper substrate in the mixture of dilute nitric acid and dilute sulfuric acid, the concentration of dilute nitric acid and dilute sulfuric acid is between The ratio is 1:2 to remove the oxide film on the surface, and after pickling, put the oxygen-free copper substrate into clean water to clean it; (4), activate the oxygen-free copper substrate after the treatment in step 3, and then Rinse it with clean water; (5) Put the oxygen-free copper substrate into the electroplating solution for electroplating. The electroplating solution includes the following compo...

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PUM

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Abstract

The invention discloses a method for plating nickel on a surface of oxygen-free copper. The method comprises the steps of carrying out sand-blasting treatment on the surface of an oxygen-free copper substrate; then carrying out pre-treatment; carrying activating treatment on the surface of a steel plate by using an acidic or alkaline solution; and then electroplating. By controlling alternative changes of the size of current density to carry out the electroplating, the thickness of a surface plated coating of an obtained product is uniform, and the obtained product has high quality and very good market prospects.

Description

technical field [0001] The invention relates to an electroplating method, in particular to a method for nickel-plating an oxygen-free copper surface. Background technique [0002] In modern industrial production, metal electroplating has been widely used by people. Chemical industry application research electroless nickel plating technology replaces expensive corrosion-resistant alloys to solve corrosion problems, in order to improve the purity of chemical products, protect the environment, improve operational safety and production The reliability of transportation, so as to obtain more favorable technical and economic competitiveness. The metal nickel coating that people are familiar with and often used can generally be used as an intermediate coating (the outer layer is mostly chromium coating) or a surface coating on a copper or copper-iron substrate to improve the protection and decoration of the base metal. The prior art nickel-phosphorus alloy coating has the defect o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/12
Inventor 吴长青何晓俊
Owner ANHUI CHANGQING ELECTRONICS MACHINERY GRP