A kind of method of oxygen-free copper surface nickel plating
An oxygen-free copper and nickel-plating technology, which is applied in the field of nickel-plating on the surface of oxygen-free copper, can solve the problems of affecting appearance and anti-corrosion performance, poor dispersion ability, rough coating, etc., and achieve the effect of not easy to crack, low cost and uniform nickel layer
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Embodiment 1
[0009] Example 1: A method for nickel-plating the surface of oxygen-free copper, comprising the following steps: (1) Sandblasting the surface of the oxygen-free copper substrate with 120-mesh quartz sand; (2) Immersing the oxygen-free copper substrate in pH 10 Soak in the alkaline cleaning solution for 3 minutes, clean the surface, remove the oil on the surface, rinse with water after electrolysis; (3), immerse the oxygen-free copper substrate in the mixture of dilute nitric acid and dilute sulfuric acid, of which The concentration ratio between them is 1:1 to remove the oxide film on the surface, and after pickling, put the oxygen-free copper substrate into clean water to clean it; (4), activate the oxygen-free copper substrate after the treatment in step 3, Soak the oxygen-free copper matrix in the mixed solution of stearic acid and sodium dodecylbenzenesulfonate for 5 minutes, and rinse it with clean water after the treatment; (5) Put the oxygen-free copper matrix Put into ...
Embodiment 2
[0012] A method for nickel-plating an oxygen-free copper surface, comprising the following steps: (1), sandblasting the surface of an oxygen-free copper substrate with 140-mesh quartz sand; (2), immersing the oxygen-free copper substrate in alkaline cleaning with a pH of 11 Soak in the solution for 4 minutes, clean the surface, remove the oil on the surface, rinse with water after electrolysis; (3), immerse the oxygen-free copper substrate in the mixture of dilute nitric acid and dilute sulfuric acid, the concentration of dilute nitric acid and dilute sulfuric acid is between The ratio is 1:1.5 to remove the oxide film on the surface, and after pickling, put the oxygen-free copper substrate into clean water to clean it; (4), activate the oxygen-free copper substrate after the treatment in step 3, and put the oxygen-free copper substrate Put the substrate into the mixed solution of stearic acid and sodium dodecylbenzenesulfonate for soaking, the soaking time is 7min, and rinse i...
Embodiment 3
[0014] A method for nickel-plating an oxygen-free copper surface, comprising the following steps: (1), sandblasting the surface of an oxygen-free copper substrate with 160-mesh quartz sand; (2), immersing the oxygen-free copper substrate in alkaline cleaning with a pH of 12 Soak in the solution for 6 minutes, clean the surface, remove the oil on the surface, rinse with water after electrolysis; (3), immerse the oxygen-free copper substrate in the mixture of dilute nitric acid and dilute sulfuric acid, the concentration of dilute nitric acid and dilute sulfuric acid is between The ratio is 1:2 to remove the oxide film on the surface, and after pickling, put the oxygen-free copper substrate into clean water to clean it; (4), activate the oxygen-free copper substrate after the treatment in step 3, and then Rinse it with clean water; (5) Put the oxygen-free copper substrate into the electroplating solution for electroplating. The electroplating solution includes the following compo...
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