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Thin film transistor, array substrate, and display device

A technology for thin film transistors and array substrates, applied in the display field, can solve the problems of large subthreshold swing of thin film transistors, affecting the conduction performance of thin film transistors, reducing carrier transfer rate, etc. The effect of communication performance and performance improvement

Active Publication Date: 2014-11-26
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the thin film transistor is in the on state, the oxygen vacancies in the metal oxynitride will form a trap state for carrier transport, thereby reducing the rate of carrier transport and improving the subthreshold swing of the thin film transistor, the subthreshold swing Increase will seriously affect the conduction performance of thin film transistors
[0005] In addition, the contact resistance between the active layer and the source and drain is usually relatively large, which will also affect the transport of carriers, and eventually lead to a large subthreshold swing of the thin film transistor, which seriously affects the conductance of the thin film transistor. general performance

Method used

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  • Thin film transistor, array substrate, and display device
  • Thin film transistor, array substrate, and display device
  • Thin film transistor, array substrate, and display device

Examples

Experimental program
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Embodiment 1

[0029] This embodiment provides a thin film transistor, such as figure 1 As shown, it includes gate 1, gate insulating layer 2, active layer 3, source 4 and drain 5, gate insulating layer 2 is arranged between gate 1 and active layer 3, source 4 and drain 5 Correspondingly arranged at both ends of the active layer 3, the active layer 3 is formed of a metal oxynitride material, and also includes a conductive oxygen vacancy reduction layer, and the oxygen vacancy reduction layer is arranged between the active layer 3 and the source electrode 4 , and the oxygen vacancy reduction layer is disposed between the active layer 3 and the drain electrode 5 for reducing the oxygen vacancies in the active layer 3 .

[0030] Among them, metal oxynitride materials such as zinc gallium oxynitride, zinc indium oxynitride, zinc aluminum oxynitride, zinc oxynitride (ZnON) and the like.

[0031] In this embodiment, the oxygen vacancy reduction layer includes a first reduction portion 61 and a se...

Embodiment 2

[0040] This embodiment provides a thin film transistor. The difference from Embodiment 1 is that the oxygen vacancy reduction layer in this embodiment only includes the first reduction portion 61 (such as figure 2 ), or, only the second cutting part 62 is provided in the present embodiment (as image 3 ).

[0041] Correspondingly, in figure 2When manufacturing the thin film transistor in , firstly, a pattern including the first cut portion 61 is formed through a patterning process, and then a pattern including the source 4 and the drain 5 is formed through a patterning process. exist image 3 When manufacturing the thin film transistor in , the pattern including the second cut portion 62 is firstly formed through a patterning process, and then the pattern including the source 4 and the drain 5 is formed through a patterning process.

[0042] Other structures and materials of the thin film transistor in this embodiment are the same as those in Embodiment 1, and will not be...

Embodiment 3

[0045] This embodiment provides a thin film transistor, which is different from Embodiment 1-2, such as Figure 4 As shown, the thin film transistor also includes an etch barrier layer 7, the etch barrier layer 7 is arranged between the active layer 3 and the source electrode 4 and the drain electrode 5, and the oxygen vacancy reduction layer is located at the edge of the etch barrier layer 7 away from the active layer 3; the etch stop layer 7 is provided with a first via hole 8 in the area corresponding to the first cut portion 61, and the first cut portion 61 is in contact with the active layer 3 through the first via hole 8; the etch stop A second via hole 9 is opened in the area of ​​the layer 7 corresponding to the second cutout portion 62 , and the second cutout portion 62 is in contact with the active layer 3 through the second via hole 9 .

[0046] Other structures of the thin film transistor in this embodiment are the same as those in any one of Embodiments 1-2, and w...

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Abstract

The invention provides a thin film transistor, an array substrate, and a display device. The thin film transistor consists of a gate electrode, a gate insulating layer, an active layer, a source electrode and a drain electrode; the gate insulating layer is arranged between the gate electrode and the active layer; the source electrode and the drain electrode are respectively and correspondingly arranged at the two ends of the active layer; and the active layer is made of a metallic nitrogen-oxide material. Besides, the thin film transistor also includes a conductive oxygen vacancy reduction layer that is arranged between the active layer and the source electrode and / or is arranged between the active layer and the drain electrode; and the conductive oxygen vacancy reduction layer is used for carrying out oxygen vacancy reduction in the active layer. According to the thin film transistor, because the oxygen vacancy reduction layer is arranged, the number of oxygen vacancy units in the active layer is substantially reduced, thereby improving the transmission rate of the carrier; and the sub threshold swinging of the thin film transistor is also reduced and thus the conduction performance of the thin film transistor is substantially improved.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a thin film transistor, an array substrate and a display device. Background technique [0002] Thin film transistors (TFTs) have been widely used in flat panel display devices due to their good switching characteristics. [0003] Generally, a thin film transistor includes a gate, an active layer, a source and a drain, and the source and the drain are respectively arranged at two ends of the active layer and are respectively in contact with the active layer. When the gate voltage is higher than its threshold voltage, the source and drain are turned on through the active layer, and carriers flow from the source to the drain or from the drain to the source. [0004] The active layer of the thin film transistor is usually formed of metal oxynitride materials, such as zinc gallium oxynitride, zinc indium oxynitride, zinc aluminum oxynitride, zinc oxynitride (ZnON) and the li...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/786H01L27/12
CPCH01L29/7869H01L29/34H01L29/66969H01L29/78618H01L27/1214H01L29/0856H01L29/41758
Inventor 王美丽辛龙宝
Owner BOE TECH GRP CO LTD
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