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Low-resistivity high-stability conductive ink and preparation method thereof

A high-stability, conductive ink technology, used in inks, household appliances, applications, etc., can solve problems such as low resistivity, and achieve the effect of low resistivity, easy implementation, and improved contact area

Inactive Publication Date: 2014-12-03
SUZHOU ZHONGYA INK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem mainly solved by the present invention is to provide a low-resistivity high-stability conductive ink and its preparation method, which can solve the above-mentioned shortcomings of existing conductive inks

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A conductive ink with low resistivity and high stability, comprising the following components by weight: 20 parts of epoxy resin, 30 parts of conductive filler, 1 part of polyethylene glycol 2000, 5 parts of titanate coupling agent, 40 parts of acetone , 8 parts of N,N-dimethylbenzylamine, 5 parts of pigments; wherein, the conductive filler is a mixture of nano-silver powder and nano-silver rods with a mass ratio of 1:1, and the average diameter of the nano-silver powder is 30nm; The diameter of the nano-silver rods is 80nm and the length is 8nm.

[0027] The preparation method of low-resistivity high-stability conductive ink comprises the steps:

[0028] (1) Preparation of nano-silver powder: Add N,N-dimethylformamide, silver nitrate solution (0.1mol / L) and polyvinylpyrrolidone (0.7mol / L) into a three-necked flask at a volume ratio of 125 to 130 Under ℃, magnetic stirring and reflux reaction for 30-45min, after cooling to room temperature, centrifuge at 6000r / min for ...

Embodiment 2

[0034] A conductive ink with low resistivity and high stability, comprising the following components by weight: 30 parts of epoxy resin, 50 parts of conductive filler, 3 parts of polyethylene glycol 2000, 10 parts of titanate coupling agent, 50 parts of acetone , 10 parts of N,N-dimethylbenzylamine, 8 parts of pigments; wherein, the conductive filler is a mixture of nano-silver powder and nano-silver rods with a mass ratio of 1:1, and the average diameter of the nano-silver powder is 40nm; The diameter of the nano-silver rods is 90nm and the length is 10nm.

[0035] The preparation method of low-resistivity high-stability conductive ink comprises the steps:

[0036] (1) Preparation of nano-silver powder: Add N,N-dimethylformamide, silver nitrate solution (0.1mol / L) and polyvinylpyrrolidone (0.8mol / L) into a three-necked flask at a volume ratio of 125 to 130 Under ℃, magnetic stirring and reflux reaction for 30-45min, after cooling to room temperature, centrifuge at a speed of...

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Abstract

The invention discloses a low-resistivity high-stability conductive ink and a preparation method thereof. The low-resistivity high-stability conductive ink comprises the following components in parts by weight: 20-30 parts of epoxy resin, 30-50 parts of conductive filler, 1-3 parts of polyethyleneglycol 2000, 5-10 parts of titanate coupling agent, 40-50 parts of acetone, 8-10 parts of N,N-dimethyl benzylamine and 5-8 parts of pigment. The preparation method comprises the following steps: (1) preparing nano silver powder; (2) preparing nano silver bars; (3) mixing; (4) defoaming; and (5) curing and forming. The preparation method is simple and easy to implement; the formula design and the preparation of the nano silver powder and nano silver bars are performed to enhance the contact area between the conductive fillers and between the conductive fillers and other components, thereby enhancing the conducting stability of the conductive fillers; and thus, the prepared conductive filler has the characteristics of low resistivity, high stability, favorable mechanical comprehensive properties and the like, and has wide application prospects.

Description

technical field [0001] The invention relates to the technical field of ink preparation, in particular to a conductive ink with low resistivity and high stability and a preparation method thereof. Background technique [0002] As a functional printed electronic material, conductive ink is a key electronic material used in printed electronic technology. It is widely used in membrane switches, flexible printed circuits, electromagnetic shielding, potentiometers, and radio frequency identification (RFID) systems. Applications in the electronics industry are increasing day by day. At present, there are various conductive inks in the market, such as silver paste, copper paste, carbon paste ink, etc., but these conductive inks usually have the following disadvantages: 1. The conductivity of carbon paste ink is poor, and it is generally not used to make low-resistance conductive inks. Materials; 2. Copper paste ink is relatively active and easy to oxidize due to the chemical proper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/52
Inventor 张东明
Owner SUZHOU ZHONGYA INK
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