Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Piezoelectric driven and detected miniature hemispherical resonant gyroscope and manufacturing method thereof

A technology of hemispherical resonant gyroscope and piezoelectric drive, applied in gyroscope/steering sensing equipment, gyro effect for speed measurement, instrument and other directions, can solve problems such as gyroscope influence, reduce processing requirements and energy consumption requirements, and improve accuracy performance and the effect of avoiding the influence of parasitic capacitance

Active Publication Date: 2014-12-10
SHANGHAI JIAO TONG UNIV
View PDF9 Cites 27 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the common miniature hemispherical resonant gyroscope adopts electrostatic drive and capacitance detection. This driving method needs to make a small-sized capacitance gap and apply a high-amplitude DC bias to provide sufficient driving force; this detection method requires Micro-sized capacitive gaps are made to improve detection accuracy; gyroscopes driven and sensed using this method are susceptible to parasitic capacitance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Piezoelectric driven and detected miniature hemispherical resonant gyroscope and manufacturing method thereof
  • Piezoelectric driven and detected miniature hemispherical resonant gyroscope and manufacturing method thereof
  • Piezoelectric driven and detected miniature hemispherical resonant gyroscope and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] As shown in Figure 2(a) and Figure 2(b), the present embodiment provides a piezoelectrically driven and detected miniature hemispherical resonant gyroscope, including:

[0037] a single crystal silicon substrate 1;

[0038] a central fixed support column 2;

[0039] A miniature hemispherical harmonic oscillator 3;

[0040] a common electrode 4;

[0041] Eight thin-film piezoelectric bodies 5;

[0042] Eight evenly distributed signal electrodes 6;

[0043] Among them, the single crystal silicon substrate 1 and the micro-hemispherical resonator 3 are connected through the central fixed support column 2; the common electrode 4 has the same shape as the micro-hemispherical resonator 3, and is located between the micro-hemispherical resonator 3 and the thin-film piezoelectric body 5; The thin-film piezoelectric body 5 has the same shape as the signal electrode 6 and is located between the common electrode 4 and the signal electrode 6 .

[0044] In this embodiment, the m...

Embodiment 2

[0051] Such as Figure 1(a)-Figure 1(i) As shown, the present embodiment provides a preparation method of the piezoelectrically driven and detected miniature hemispherical resonant gyroscope, comprising the following steps:

[0052]The first step, as shown in Fig. 1(a), is to clean the single crystal silicon substrate 1, apply glue on the single crystal silicon substrate 1, perform photolithography, development, sputtering mask layer, glue removal, and isotropic Etching and removing the mask layer to obtain a hemispherical groove with a radius of 300-700 μm on the single crystal silicon substrate 1;

[0053] In the second step, as shown in Figure 1(b), on the basis of the first step, the thermal oxidation method is used to grow the silicon dioxide layer, glue coating, photolithography, development, and partial etching of the silicon dioxide layer to obtain a radius SiO2 sacrificial layer for 15-40 μm circular grooves;

[0054] The third step, as shown in Figure 1(c), deposits...

Embodiment 3

[0063] Basically the same as embodiment 1 and embodiment 2, the difference is:

[0064] The gyroscope prepared in this embodiment: the material of the central fixed support column 2 and the micro-hemispherical resonator 3 is doped polysilicon or doped diamond, which can be used as the micro-hemispherical resonator 3 and the common electrode 4 at the same time, without Make additional common electrode 4;

[0065] Therefore, the third step in the preparation method of this embodiment: deposit doped polysilicon or doped diamond on the basis of the second step; remove the fourth step in the preparation method described in Example 2, and directly proceed from the fifth step to the first step nine steps. Other operations are the same as in Example 2.

[0066] The gyroscope in the present invention is manufactured by combining MEMS bulk silicon processing technology and surface silicon processing technology, which is a novel processing technology.

[0067] The present invention ut...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Radiusaaaaaaaaaa
Radiusaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a piezoelectric driven and detected miniature hemispherical resonant gyroscope and a manufacturing method thereof. The gyroscope comprises a monocrystalline silicon base, a center-fixed supporting column, a miniature hemispherical resonator, a common electrode, eight film piezoelectrics and eight uniformly-distributed signal electrodes, wherein the monocrystalline silicon base and the miniature hemispherical resonator are connected through the center-fixed supporting column; the common electrode has the same shape as that of the miniature hemispherical resonator and is located between the miniature hemispherical resonator and the piezoelectrics; the piezoelectrics have the same shapes as those of the signal electrodes and are located between the common electrode and the signal electrodes. The miniature hemispherical resonator is excited to work by adopting a piezoelectric driven manner, and a drive mode and a detection mode are matched with each other. The gyroscope is manufactured by combining an MEMS (Micro-Electromechanical Systems) bulk silicon processing process and a surface silicon processing process. According to the piezoelectric driven and detected miniature hemispherical resonant gyroscope and the manufacturing method thereof, the miniature gyroscope is driven and detected by using the inverse piezoelectric effect and the piezoelectric effect, so that the gyroscope has the characteristics of high degree of integration, low power consumption, convenience in mass production, and the like.

Description

technical field [0001] The invention relates to a hemispherical resonant gyroscope in the field of micro-electromechanical technology, in particular to a piezoelectrically driven and detected micro hemispherical resonant gyroscope and a preparation method thereof. Background technique [0002] Gyroscope is an inertial device that can detect the angle or angular velocity of the carrier, and it plays a very important role in the fields of attitude control, navigation and positioning. With the development of national defense technology and aviation and aerospace industries, the requirements of inertial navigation systems for gyroscopes are also developing in the direction of low cost, small size, high precision, multi-axis detection, high reliability, and adaptability to various harsh environments. Therefore, the importance of MEMS gyroscope is self-evident. In particular, as an important research direction of MEMS gyroscopes, micro-resonant gyroscopes have become a research h...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01C19/5691G01C25/00B81B7/00B81C1/00
CPCG01C19/5691G01C25/00
Inventor 张卫平唐健刘亚东汪濙海成宇翔孙殿竣邢亚亮陈文元
Owner SHANGHAI JIAO TONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products