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Anisotropic conductive film, image display and semiconductor device

An anisotropic, conductive film technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve problems such as excessive bubbles, achieve the effects of suppressing bubbles, excellent moisture resistance, and suppressing the increase in connection resistance

Active Publication Date: 2016-04-20
KUKDO ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, although conductive particles exhibiting high hardness have been used in both LCD and OLED displays, excessive air bubbles are generated around the conductive particles and in the space between electrodes after reliability testing

Method used

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  • Anisotropic conductive film, image display and semiconductor device
  • Anisotropic conductive film, image display and semiconductor device
  • Anisotropic conductive film, image display and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0118] Preparation of anisotropic conductive film composition

[0119] Based on the total weight of the anisotropic conductive film in terms of solid content, mixing 20 wt% of epoxy resin containing polycyclic aromatic rings (HP4032D, DainipponInk & Chemicals Co., Ltd., Tg: 245 ° C); 10 wt% of epoxy resin containing dicyclopentadiene The epoxy resin of alkene ring (HP7200L, DainipponInk & Chemicals Co., Ltd., Tg: 157 ℃); 20wt% of phenoxy resin (YP50, NipponSteel & SumitomoMetal Co., Ltd.); 30wt% of curing agent (HX-3922, AsahiKasei Co., Ltd.); 5wt% Silica nanoparticles (R812, Degussa Co., Ltd.); and 15wt% conductive particles (AUL704, SekisuiChemical Co., Ltd.), prepare anisotropic conductive film composition (wherein, the conductive particles have 1300N / mm 2 30% K value and 60% recovery rate).

[0120] Preparation of anisotropic conductive film

[0121] The prepared film composition was stirred at room temperature (25° C.) for 60 minutes at a stirring speed that does no...

Embodiment 2

[0123] In addition to using a 1600N / mm 2 An anisotropic conductive film was prepared in the same manner as in Example 1 except for conductive particles having a K value of 30% and a recovery rate of 50%.

Embodiment 3

[0125] In addition to using a 2100N / mm 2 An anisotropic conductive film was prepared in the same manner as in Example 1 except for conductive particles having a K value of 30% and a recovery rate of 60%.

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PUM

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Abstract

The present invention discloses an aeolotropy conductive film, an image display comprising the aeolotropy conductive film and a semiconductor device comprising the aeolotropy conductive film. The aeolotropy conductive film can improve the connection reliability, realizes a stable connection resistance, and possesses an epoxy resin having a 200-300 DEG C glass-transition temperature, an epoxy resin having a 130-200 DEG C glass-transition temperature and the 1000 N / mm<2> to 3000 N / mm<2> 30% K value of conductive particles. The aeolotropy conductive film is excellent in connection reliability and has fewer bubbles.

Description

technical field [0001] The present invention relates to an anisotropic conductive film, an image display including the anisotropic conductive film, and a semiconductor device including the anisotropic conductive film. More particularly, the present invention relates to an anisotropic conductive film including two kinds of epoxy resins having different glass transition temperatures (Tg) and conductive particles, and can achieve high connection reliability and stability connection resistance. Background technique [0002] Generally, an anisotropic conductive film (ACF) refers to a film-like adhesive in which conductive particles, such as metal particles including nickel particles or gold particles, or metal-coated polymer resin particles are dispersed in a coating such as epoxy resin. in the resin. The anisotropic conductive film is formed of a polymer layer having electrical anisotropy and adhesiveness, and exhibits conductive properties in the thickness direction of the fi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/00C09J163/00C09J11/00G02F1/13H01L51/52
Inventor 朴永祐朴憬修崔贤民李大圭金柄秀
Owner KUKDO ADVANCED MATERIALS CO LTD