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Polyimide adhesive and preparation method thereof

A polyimide and adhesive technology, applied in the direction of adhesives, etc., can solve the problems of limited application, low peel strength, and low adhesion

Active Publication Date: 2015-01-21
CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this process, the polymerization of active groups will form a thermosetting material with a high crosslinking density, the bonding layer is brittle, the adhesion is not high, the peel strength is lower than 9N / cm, and the peel strength is low, which limits its application.

Method used

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  • Polyimide adhesive and preparation method thereof
  • Polyimide adhesive and preparation method thereof
  • Polyimide adhesive and preparation method thereof

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preparation example Construction

[0066] The present invention provides a kind of preparation method of polyimide adhesive described in above-mentioned technical scheme, comprises the following steps:

[0067] Mixing a diamine having a structure shown in formula II and a first organic solvent to obtain a diamine solution;

[0068] Polymerizing the diamine solution and the dianhydride having the structure shown in formula III to obtain the first polymer intermediate;

[0069] polymerizing the first polymer intermediate with a diamine having a structure shown in formula IV to obtain a second polymer intermediate;

[0070] The second polymer intermediate, the second organic solvent and the diamine having the structure shown in formula V are polymerized to obtain a polyamic acid solution;

[0071] Coating the polyamic acid solution, removing the first organic solvent and the second organic solvent, and then imidizing to obtain a polyimide adhesive;

[0072] h 2 N-R 2 -NH 2 Formula II; h 2 N-R 3 -NH 2 For...

Embodiment 1

[0097] Add 2,5-bis(4-aminophenyl)pyridine (7.84g, 0.03mol) into 140g of N-methylpyrrolidone, stir and dissolve to obtain 2,5-bis(4-aminophenyl)pyridine solution ;

[0098] Add 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride (31.02g, 0.10mol) to the 2,5-bis(4-aminophenyl)pyridine solution, stir and polymerize at 15°C Reaction 4h, obtains the first polymer intermediate;

[0099] Add 3,4'-diaminodiphenyl ether (12.01g, 0.06mol) to the first polymer intermediate, stir, and carry out polymerization reaction at 15°C for 6h to obtain the second polymer intermediate;

[0100] Add 70g of tetrahydrofuran to the second polymer intermediate, then add 1,3-diaminopropylhexamethyldisiloxane (2.48g, 0.01mol), stir, and carry out polymerization reaction at 15°C for 8h to obtain Polyamic acid solution;

[0101] The polyamic acid solution was salivated on the surface of the stainless steel plate, placed in an oven and dried at 80°C for 180 minutes; then, slowly heated to 300°C in the ove...

Embodiment 2

[0107] Add 2,5-bis(4-aminophenyl)pyrimidine (7.81g, 0.03mol) into 140g of N-methylpyrrolidone, stir and dissolve to obtain 2,5-bis(4-aminophenyl)pyrimidine solution ;

[0108] Add 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride (31.02g, 0.10mol) to the 2,5-bis(4-aminophenyl)pyrimidine solution, stir and polymerize at 15°C Reaction 4h, obtains the first polymer intermediate;

[0109] 1,3-bis(4-aminophenoxy)benzene (17.54 g, 0.06 mol) was added to the first polymer intermediate, stirred, and polymerized at 15°C for 6 hours to obtain the second polymer intermediate;

[0110] Add 70g of tetrahydrofuran to the second polymer intermediate, then add 1,3-diaminopropylhexamethyldisiloxane (2.48g, 0.01mol), stir, and carry out polymerization reaction at 15°C for 8h to obtain Polyamic acid solution;

[0111] The polyamic acid solution was salivated on the surface of the stainless steel plate, placed in an oven and dried at 80°C for 180 minutes; then, slowly heated to 300°C in the...

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Abstract

The invention provides a polyimide adhesive which is of a structure as shown in the formula I. In the formula I as shown in the specification, R2 is a nitrogen aromatic ring structure; R4 is a siloxane chain link; and the nitrogen aromatic ring structure is a phenylpyridine structure or a phenyl pyrimidine structure. Due to adoption of the nitrogen aromatic ring structure, the peeling strength of polyimide from metal is improved; due to adoption of the siloxane chain link, the melt strength of the polyimide adhesive is reduced, the molding of the adhesive is improved, and the peeling resistance is improved. The experiment result shows that the peeling strength of the polyimide adhesive provided by the invention from metal foil is 10.2-16.2N / cm, the vitrification conversion temperature of the polyimide adhesive is 170-250 DEG C, the hygroscopicity of the polyimide adhesive is 1.09-1.9%, and the solderability of the polyimide adhesive is qualified.

Description

technical field [0001] The invention belongs to the technical field of organic synthesis, and in particular relates to a polyimide adhesive and a preparation method thereof. Background technique [0002] Polymer to metal bonding is an important aspect of adhesive applications. For example, printed circuits use adhesives to bond polymers (such as polyimide, polyester, etc.) and metals (copper, aluminum, etc.). According to the adhesion mechanism, the adhesion mechanism of polymers and metals mainly includes the following types: mechanical locking, surface wetting and adsorption, electrostatic interaction and chemical bonding. Among them, mechanical locking: through the defects that the adhesive penetrates into the surface of the material, an anchoring effect and a locking effect are established at the interface after curing, increasing the contact area between each other and improving the bonding strength; surface wetting and adsorption: due to the formation of van der Waals...

Claims

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Application Information

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IPC IPC(8): C09J179/08C08G73/10
Inventor 郭海泉姚海波杜志军马晓野丁金英邱雪鹏高连勋
Owner CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
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