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Piezoelectric film producing process, vibrator element, vibrator, oscillator, electronic device, and moving object

A manufacturing method, piezoelectric film technology, applied in the field of moving bodies, can solve problems such as deterioration of vibration characteristics, increase in value, and decrease in reliability, and achieve the effect of improving functions

Inactive Publication Date: 2015-02-04
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Therefore, in the above-mentioned vibrating piece having the above-mentioned piezoelectric film, the CI (crystal impedance) value may increase, the vibration characteristics may deteriorate, and the reliability may be lowered.

Method used

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  • Piezoelectric film producing process, vibrator element, vibrator, oscillator, electronic device, and moving object
  • Piezoelectric film producing process, vibrator element, vibrator, oscillator, electronic device, and moving object
  • Piezoelectric film producing process, vibrator element, vibrator, oscillator, electronic device, and moving object

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0045] Here, as an example of a vibrating element, a vibrating element using Si (silicon) as a base material will be described.

[0046] figure 1 It is a schematic diagram showing the schematic structure of the vibrating element of the first embodiment, figure 1 (a) is a floor plan, figure 1 (b) is figure 1 The cross-sectional view at line A-A of (a). In addition, each wiring is omitted, and the dimensional ratio of each component is different from the actual one.

[0047] figure 2 Yes figure 1 (a) The cross-sectional view at the line B-B and the wiring diagram of each excitation electrode.

[0048]In addition, the X-axis, the Y-axis, and the Z-axis in each figure are mutually orthogonal coordinate axes.

[0049] like figure 1 As shown, as a base material, a vibrating piece 1 has a base 10 and three vibrating arms 11 a , 11 b , and 11 c extending from the base 10 in the Y-axis direction. In this embodiment, a Si substrate (for example, a substrate obtained by forming...

no. 2 Embodiment approach

[0111] Next, a vibrator including the vibrating piece described in the first embodiment will be described.

[0112] Figure 5 It is a schematic diagram showing a schematic configuration of a vibrator according to the second embodiment. Figure 5 (a) is a plan view viewed from the lid (lid body) side, Figure 5 (b) is Figure 5 Cross-sectional view at line C-C of (a). In addition, the cover is omitted in the plan view. Also, each wiring is omitted.

[0113] In addition, the same code|symbol is attached|subjected to the same part as the said 1st Embodiment, and detailed description is abbreviate|omitted, and it demonstrates centering on the part which differs from the said 1st Embodiment.

[0114] like Figure 5 As shown, the vibrator 5 has the vibrating element 1 described in the first embodiment and the package 20 housing the vibrating element 1 .

[0115] The package 20 has a package base 21 having a substantially rectangular planar shape and a concave portion, and a f...

no. 3 Embodiment approach

[0134]Next, an oscillator including the vibrating piece described in the first embodiment will be described.

[0135] Image 6 It is a schematic diagram showing the schematic configuration of the oscillator of the third embodiment. Image 6 (a) is a plan view viewed from the lid side, Image 6 (b) is Image 6 Cross-sectional view at line C-C of (a). In addition, the cover and some structural elements are omitted in the plan view. Also, each wiring is omitted.

[0136] In addition, the same reference numerals are assigned to the same parts as those of the above-mentioned first embodiment and second embodiment, and detailed description thereof will be omitted, and the description will focus on the parts that are different from the above-mentioned first embodiment and second embodiment.

[0137] like Image 6 As shown, the oscillator 6 includes the vibrating element 1 described in the first embodiment, an IC chip 40 as an oscillation circuit for oscillating the vibrating el...

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Abstract

A piezoelectric film producing process includes depositing a piezoelectric body in a mixed atmosphere of N2 gas and Ar gas by using a sputtering method, using an Al—Cu alloy as deposition material.

Description

technical field [0001] The present invention relates to a method for manufacturing a piezoelectric film, a vibrating piece having the piezoelectric film, a vibrator having the vibrating piece, an oscillator, electronic equipment, and a moving body. Background technique [0002] Conventionally, as a vibrating piece, a piezoelectric thin film resonator (hereinafter referred to as a vibrating piece) having a structure including a lower electrode provided on a substrate, a piezoelectric film provided on the lower electrode, and a piezoelectric film provided on the piezoelectric film is known. The upper electrode has a region facing the lower electrode across the piezoelectric film (for example, refer to Patent Document 1). [0003] In the vibrating reed, aluminum nitride (hereinafter referred to as AlN) is used for the piezoelectric film. The piezo film is at N 2 In a mixed atmosphere of (nitrogen) gas and Ar (argon) gas, a film is formed (formed) by sputtering using Al (alumi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/02H03H9/17H03H9/02H10N30/20H10N30/092H10N30/40H10N30/85H10N30/853
CPCH01L41/18C23C14/34H03B5/32C22C21/12H01L41/09H01L41/107C23C14/14C23C14/06C23C14/0688C23C14/3414H10N30/2042H10N30/853H10N30/092H03H9/171
Inventor 山崎隆岩本修
Owner SEIKO EPSON CORP
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