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Improved thin type laminated power inductor process

A power inductor and stacking technology, which is applied in the field of thin stacked power inductor manufacturing process, can solve the problems of large size, inability to meet the requirements of light, thin, miniaturization, and component design limitations.

Inactive Publication Date: 2015-02-11
INPAQ TECH
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Problems solved by technology

[0003] However, this kind of power inductor, which utilizes wires to be wound into a helical inductance coil, has a large volume and cannot meet the requirements of lightness, thinness, and miniaturization of existing electrical products.
In recent years, although the manufacturing method of inductors has changed from traditional wire-wound or multilayer printing to thin-film manufacturing, the coils produced by the current thin-film manufacturing process have a depth and width (line thickness / line width) that are less than 1. design is very limited

Method used

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  • Improved thin type laminated power inductor process

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Embodiment Construction

[0029] The improved thin laminated power inductor manufacturing process of the present invention, such as figure 1 As shown, the thin-type laminated power inductor 100 forms a spiral inductor coil above a magnetic substrate 1, and the spiral inductor coil is composed of laminated thin-type spiral coils 2 and wrappings wrapped on the outside of the thin-type spiral coil 2. The cladding 3 is formed.

[0030] The manufacturing process of the improved thin laminated power inductor of the present invention comprises:

[0031] Substrate processing step: use chemical solvents such as methanol or acetone to remove impurities and grease on the surface of the substrate 101, then remove oxides on the surface of the substrate with hydrofluoric acid, and then dehydrate the substrate 101 (Dehydration Bake) (such as Figure 2A shown);

[0032] Seed layer forming step: using a sputtering process or an evaporation process to form a metal seed layer 200 on the substrate 101, the material of t...

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Abstract

An improved thin type laminated power inductor process. A power inductor includes multiple layers of stacked spiral inductance coils and an insulating layer, a spiral inductor graph is formed on a substrate by using a lithography process, then uses a polyimide (PI) or epoxy resin (Epoxy) dry film as retaining walls at upper sides of the coils, and then inside the retaining walls, the thickness of the inductor coils is increased through an electroplating process, so that a spiral coil with high density and a high aspect ratio is manufactured.

Description

technical field [0001] The invention relates to a thin-type laminated power inductor manufacturing process, in particular, after the coil pattern is formed on the upper surface of the magnetic substrate through a lithography process, the dry film of polyimide (PI) or epoxy resin (Epoxy) is used as a barrier. The wall, and then the thickness of the inductance coil is increased through the electroplating process in the retaining wall, so as to produce a spiral coil with high density and high aspect ratio. Background technique [0002] Existing power inductors are formed by using wires with a rectangular or circular cross-section and winding them into a helical inductance coil. The helical inductance coil has a plurality of coils extending in layers along the vertical direction, and its two ends are respectively connected with wires to connect with external electrodes. During production, first put the helical wire that has been welded into the mold, then inject magnetic powder...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/522H01F37/00
Inventor 叶秀伦张育嘉
Owner INPAQ TECH
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