Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Photocurable resin composition for imprinting, method for producing same, and structure

A curable resin and composition technology, applied in semiconductor/solid-state device manufacturing, microstructure technology, microstructure devices, etc., can solve problems such as inability to correctly reflect the structure, and achieve curing shrinkage inhibition, high surface hardness, and inhibition of yellowing. changing effect

Inactive Publication Date: 2015-02-11
SOKEN CHEM & ENG CO LTD
View PDF13 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the above-mentioned photoimprinting, there is a problem that the resin shrinks during curing, and a structure that does not accurately reflect the shape of the original mold is produced.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photocurable resin composition for imprinting, method for producing same, and structure
  • Photocurable resin composition for imprinting, method for producing same, and structure
  • Photocurable resin composition for imprinting, method for producing same, and structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4

[0134] In 75 parts by weight tripropylene glycol diacrylate (TPGDA), 20 parts by weight methyl methacrylate (MMA), 5 parts by weight glycidyl methacrylate (GMA), as photoinitiator, with the 1-Hydroxy-cyclohexyl-phenyl-ketone ("IRGACURE184" manufactured by BASF Corporation) and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide ("IRGACURE819" manufactured by BASF Corporation) , to prepare a photocurable resin composition. Its composition is shown in Table 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
hardnessaaaaaaaaaa
shrinkageaaaaaaaaaa
Login to View More

Abstract

[Problem] To provide a photocurable resin composition in which curing shrinkage during optical imprinting is suppressed. Also to provide a photocurable resin composition capable of producing, by optical imprinting, a structure which has a high surface hardness and in which occurrence of yellowing is suppressed even when subjected to irradiation with ultraviolet radiation and the like. [Solution] This photocurable resin composition for imprinting contains a (meth)acrylic monomer (A) and a photoinitiator (B), and is characterized in that the photoinitiator (B) comprises a combination of an alkylphenone-based photoinitiator (B1) and an acylphosphine oxide-based photoinitiator (B2), and the blending ratio of the alkylphenone-based photoinitiator (B1) and the acylphosphine oxide-based photoinitiator (B2) (B1:B2) is between 1:99 and 90:10 by weight.

Description

technical field [0001] The present invention relates to a photocurable resin composition for imprint, a method for producing a structure using the photocurable resin composition, and a structure formed using the photocurable resin composition. Background technique [0002] Imprint technology refers to the technology of pressing the master mold with nano- or micron-scale fine structure formed on the surface to the liquid resin, and transferring the fine structure of the mold to the resin. A structure with a microstructure formed by transfer is used as an imprint mold, an anti-reflection film, a diffusion film, etc., depending on the shape of the microstructure, and is used in semiconductor materials, optical materials, storage media, micro-motors, organisms, environments, etc. various fields. [0003] As the imprinting method, thermal embossing and photoimprinting etc. are mentioned. In the said thermal embossing, a mold having a predetermined shape formed on its surface is ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/027B81C99/00C08F2/50
CPCC08F2/50G03F7/0002Y10T428/24612B29C59/005B29C59/026C08F4/28C08F22/10C08J5/00H01L21/027
Inventor 山田纮子须藤康夫宫泽幸大
Owner SOKEN CHEM & ENG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com