Preparation method of polycrystalline black silicon of micro-nano composite suede structure
A micro-nano composite, polycrystalline silicon wafer technology, applied in chemical instruments and methods, crystal growth, final product manufacturing, etc., can solve the problems of fast reaction speed, single, difficult to control reaction process, etc., to reduce the surface reflectivity, reduce the surface Compounding, removal-friendly effect
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[0030] Example 1:
[0031] First, put the p-type polycrystalline silicon wafer into an etching solution composed of hydrofluoric acid and nitric acid for etching. The concentration of hydrofluoric acid is 2.5 mol / L and the concentration of nitric acid is 7.5 mol / L. After 100s, it is taken out and Clean, prepare and obtain polycrystalline silicon wafers with micron texture structure; then, place them in a mixed solution of hydrofluoric acid and silver nitrate, where the concentration of hydrofluoric acid is 4 mol / L and the concentration of silver nitrate is 0.005 mol / L, take it out after 60s of standing time to obtain a polycrystalline silicon wafer with silver nanoparticles adsorbed on the micro-textured surface; then place it in an etching solution of hydrofluoric acid and hydrogen peroxide, where the concentration of hydrofluoric acid The concentration of hydrogen peroxide is 4 mol / L, the concentration of hydrogen peroxide is 0.4 mol / L, and the etching time is 1 min. Take it o...
Example Embodiment
[0032] Example 2:
[0033] First, put the p-type polycrystalline silicon wafer into an etching solution composed of hydrofluoric acid and nitric acid for etching. The concentration of hydrofluoric acid is 2.5 mol / L and the concentration of nitric acid is 7.5%. After 100s, it is taken out and cleaned. , To prepare polycrystalline silicon wafers with a micron texture structure; then, place them in a mixed solution of hydrofluoric acid and copper nitrate, where the concentration of hydrofluoric acid is 4 mol / L and the concentration of copper nitrate is 0.005 mol / L , Take it out after 60s of standing time to obtain a polycrystalline silicon wafer with copper nanoparticles adsorbed on the micron suede; then place it in an etching solution of hydrofluoric acid and hydrogen peroxide, where the concentration of hydrofluoric acid is 4 mol / L, the concentration of hydrogen peroxide is 0.4 mol / L, the etching time is 1 min, and then take it out to obtain a polycrystalline silicon wafer with a...
Example Embodiment
[0034] Example 3:
[0035] First, put the p-type polycrystalline silicon wafer into an etching solution composed of hydrofluoric acid and nitric acid for etching. The concentration of hydrofluoric acid is 2.5 mol / L and the concentration of nitric acid is 7.5 mol / L. After 100s, it is taken out and Clean, prepare and obtain polycrystalline silicon wafers with micron texture structure; then, place them in a mixed solution of hydrofluoric acid and silver nitrate, where the concentration of hydrofluoric acid is 4 mol / L and the concentration of silver nitrate is 0.005 mol / L, take it out after 60s of standing time to obtain a polycrystalline silicon wafer with silver nanoparticles adsorbed on the micro-textured surface; then place it in an etching solution of hydrofluoric acid and hydrogen peroxide, where the concentration of hydrofluoric acid The concentration of hydrogen peroxide is 4 mol / L, the concentration of hydrogen peroxide is 0.4 mol / L, and the etching time is 1 min. Take it o...
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