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Laminates for circuit boards, metal base circuit boards, and power modules

A technology for circuit substrates and metal substrates, applied in circuit substrate materials, circuits, printed circuits, etc., can solve the problems of difficulty in ensuring durability and welding reliability, and increased stress, and achieve excellent welding reliability and durability. Effect

Active Publication Date: 2018-07-27
NHK SPRING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the stress caused by thermal cycles increases at the soldering portion connecting the power device and the metal circuit base board, making it difficult to ensure durability and soldering reliability.

Method used

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  • Laminates for circuit boards, metal base circuit boards, and power modules
  • Laminates for circuit boards, metal base circuit boards, and power modules
  • Laminates for circuit boards, metal base circuit boards, and power modules

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0069] Hereinafter, examples of the present invention will be described. The present invention is not limited to these examples.

[0070]

Synthetic example 1

[0071] Synthesis Example 1: Preparation of Composition 1

[0072] Bisphenol A type cyanate resin (Lonza, "BA200") and phenol novolac type cyanate resin (Lonza, "PT30") were heated and mixed at a mass ratio of 3:1, and then calculated according to the amount of the resin. It was mixed with 1% by mass of a phosphorus-based curing accelerator (tetraphenylphosphine tetraphenyl boron; manufactured by Hokko Chemical Co., Ltd., "TPP-MK"). In this mixed resin, dimethylacetamide is added to form a cyanate resin solution with a resin solid content of 40% by mass. For this cyanate resin solution, boron nitride (Mizushima Made of alloy iron, "HP-40") and aluminum nitride ("FAN-f30" manufactured by Furukawa Electronics Co., Ltd.) so that the total volume becomes 65% by volume based on the solid content of the resin, thereby preparing an insulating material solution (composition 1 ).

Synthetic example 2～5

[0073] Synthesis Examples 2-5: Preparation of Compositions 2-5

[0074] The ratio of bisphenol A cyanate resin (manufactured by Lonza, "BA200") and phenol novolac cyanate resin (manufactured by Lonza, "PT30") was changed to the ratio described in Table 3, except that , Compositions 2-5 were prepared in the same preparation method as Composition 1.

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Abstract

Provided is a laminated plate for a circuit substrate, the laminated plate for a circuit substrate comprising: a metal substrate; an insulating layer, the insulating layer is disposed on at least one surface of the metal substrate; a metal foil, the metal foil is disposed on the insulating layer; It is characterized in that the insulating layer contains a cross-linked copolymer of bisphenol cyanate resin and phenolic cyanate resin and an inorganic filler.

Description

technical field [0001] The present invention relates to a laminated board for circuit boards, a metal base circuit board manufactured from the laminated board for circuit boards, and a power module including the metal base circuit board. Background technique [0002] In recent years, the development of electronic technology has attracted attention, and the performance and miniaturization of electrical and electronic equipment are rapidly advancing. Concomitantly, the amount of heat generated by components mounted with electrical components and / or electronic components is gradually increasing. Against this background, for devices equipped with MOSFETs (metal-oxide-semiconductor field-effect transistors) and IGBTs (insulated-gate bipolar transistors: insulated gate bipolar transistors), etc. Metal base circuit boards of so-called power devices require sufficient heat resistance and excellent heat dissipation. Especially in the future, due to the use of SiC (silicon carbide) ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/05B32B15/08H05K1/03
CPCH01L23/142H01L23/3735H01L23/49894H05K1/056H05K2201/0209H01L2224/32225H01L2924/1305H01L2924/13055H01L2924/13091Y10T428/31678H05K1/0373H01L2924/00B32B15/08
Inventor 水野克美许斐和彦夏目丰
Owner NHK SPRING CO LTD
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