Release film with silicon dioxide film layer and preparation method of release film
A technology of silicon dioxide film and release film, which is applied in the direction of coating, liquid chemical plating, metal material coating process, etc., can solve the problems of non-recyclable and reuse, the decrease of the surface bonding force of contact materials, and the bonding force of insulating boards. drop and other issues
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Embodiment 1
[0023] Embodiment 1 A kind of preparation method of the release film with silicon dioxide film layer, comprises the steps:
[0024] (1) Configure polysilazane solution: the concentration of polysilazane is 1%, and the solvent is organic solvent n-butyl ether;
[0025] (2) Coating of base film: coating the above-mentioned polysilazane solution on one side of the 25 micron PET film, driving off the solvent, and drying; then coating the above-mentioned polysilazane solution on the other side of the PET film, driving off the solvent, and drying Dry; polysilazane solution coating dry thickness range: 20 nanometers;
[0026] (3) The product obtained in step (2) is wet heat treated in an oven with a relative humidity of 85% and a temperature of 85°C for 2 hours, and then baked at a temperature of 120-150°C for 2 hours to obtain a double-sided film with a silicon dioxide film layer. Release film.
[0027] Performance Testing:
[0028] The double-sided release film with silicon diox...
Embodiment 2
[0029] Embodiment 2 A kind of preparation method of the release film with silicon dioxide film layer, comprises the steps:
[0030] (1) Configure polysilazane solution: the concentration of polysilazane is 5%, and the solvent is organic solvent n-butyl ether;
[0031] (2) Coating of the base film: coating the above-mentioned polysilazane solution on one side of the 50-micron PET film, driving off the solvent, and drying; then coating the above-mentioned polysilazane solution on the other side of the PET film, driving off the solvent, and drying Dry; polysilazane solution coating dry thickness range: 100 nm;
[0032] (3) The product obtained in step (2) is wet heat treated in an oven with a relative humidity of 85% and a temperature of 85°C for 3 hours, and then baked at a temperature of 120-150°C for 2 hours to obtain a double-sided film with a silicon dioxide film layer. Release film.
[0033] Performance Testing:
[0034] Laminate the double-sided release film with a sili...
Embodiment 3
[0035] Embodiment 3 A kind of preparation method of the release film with silicon dioxide film layer, comprises the steps:
[0036] (1) Configure polysilazane solution: the polysilazane concentration is 10%, and the solvent is organic solvent n-butyl ether;
[0037] (2) Coating of base film: coating the above-mentioned polysilazane solution on one side of the 25 micron PET film, driving off the solvent, and drying; then coating the above-mentioned polysilazane solution on the other side of the PET film, driving off the solvent, and drying Dry; polysilazane solution coating dry thickness range: 200 nm;
[0038] (3) The product obtained in step (2) is wet heat treated in an oven with a relative humidity of 85% and a temperature of 85°C for 3 hours, and then baked at a temperature of 120-150°C for 2 hours to obtain a double-sided film with a silicon dioxide film layer. Release film.
[0039] Performance Testing:
[0040] Laminate the double-sided release film with a silicon di...
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