Super-fine nickel-clad copper alloy wire and manufacturing method thereof

A technology of nickel-plated copper alloy and production method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of unfavorable product popularization and promotion, expensive palladium, high cost, etc., and achieves convenience for welding, Effect of preventing oxidation of copper wire and reducing cost

Inactive Publication Date: 2015-03-25
安徽华晶微电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, palladium is relatively expensive in this invention, and the cost remai

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] An extremely fine nickel-plated copper alloy wire, including an extremely fine copper wire, with a layer of nickel film on the outside of the extremely fine copper wire. The extremely fine copper wire is mainly made of high-purity copper with a purity of 99.9999%, and modified Elements are smelted. The alloy contains the following modifying elements: 5ppm Ca, 10ppm P, 10ppm Ag, 10ppm Au, 5ppm Y, 5ppm Zr, 10ppm In. The diameter of the extremely fine copper wire is 0.016mm, and the thickness of the nickel film is 120nm.

[0026] In this embodiment, a method for making an extremely fine nickel-plated copper alloy wire comprises the following steps:

[0027] (1) Purification of copper materials: using the commercially available No. 1 pure copper as raw material, the repeated purification process of electrolysis-smelting, re-electrolysis-re-smelting is used to reduce the total content of impurities such as S, Ag, Se, Si, Mg, Te, etc. Control it below 50ppm to obtain high-p...

Embodiment 2

[0035] An extremely fine nickel-plated copper alloy wire, including an extremely fine copper wire, which is provided with a layer of nickel film outside the extremely fine copper wire. The extremely fine copper wire is mainly made of high-purity copper with a purity of 99.9999%, and modified Elements are smelted. The contents of modifying elements in the alloy are: 100ppm Ca, 50ppm P, 20ppm Ag, 20ppm Au, 10ppm Y, 10ppm Zr, 5ppm In. The diameter of the extremely fine copper wire is 0.018mm, and the thickness of the nickel film is 150nm.

[0036] As a preference, a method for making a very fine nickel-plated copper alloy wire in this embodiment comprises the following steps:

[0037] (1) Purification of copper material: using commercially available No. 1 pure copper as raw material, the repeated purification process of electrolysis-smelting, re-electrolysis-re-smelting is used to reduce the total content of impurities such as S, Ag, Se, Si, Mg, Te, etc. in copper Control it be...

Embodiment 3

[0045] An extremely fine nickel-plated copper alloy wire, including an extremely fine copper wire, with a layer of nickel film on the outside of the extremely fine copper wire. The extremely fine copper wire is mainly made of high-purity copper with a purity of 99.9999%, and modified Elements are smelted. The contents of modifying elements in the alloy are: 95ppm Ca, 45ppm P, 15ppm Ag, 15ppm Au, 5ppm Y, 5ppm Zr, 3ppm In. The diameter of the extremely fine copper wire is 0.017mm, and the thickness of the nickel film is 150nm.

[0046] In this embodiment, a method for making an extremely fine nickel-plated copper alloy wire comprises the following steps:

[0047] (1) Purification of copper materials: using the commercially available No. 1 pure copper as raw material, the repeated purification process of electrolysis-smelting, re-electrolysis-re-smelting is used to reduce the total content of impurities such as S, Ag, Se, Si, Mg, Te, etc. Control it below 50ppm to obtain high-p...

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Abstract

The invention relates to the technical field of materials for the light energy industry and the micro-electronic industry and discloses a super-fine nickel-clad copper alloy wire and a manufacturing method of the super-fine nickel-clad copper alloy wire. The super-fine nickel-clad copper alloy wire comprises a super-fine copper wire, wherein a nickel film is arranged outside the super-fine copper wire, and the super-fine copper wire is mainly made of high-purity copper and is formed through smelting by adding modified elements to the high-purity copper. According to the super-fine nickel-clad copper alloy wire and the manufacturing method of the super-fine nickel-clad copper alloy wire, the problems that when drawing is conducted after plating, the film is uneven, wire rods are uneven and surface cracks occur after drawing due to the fact that the hardness of internal components is different from the hardness of external components and the plasticity of the internal components is different from the plasticity of the external component, and usability is affected can be avoided; meanwhile, the copper wire can be effectively prevented from being oxidized, and welding during application is facilitated; compared with an existing palladium-clad copper wire and an existing gold-clad copper wire, the nickel-clad copper wire has the advantage that material cost can be greatly reduced.

Description

technical field [0001] The invention relates to the technical field of materials used in light energy and microelectronic industries, in particular to a very fine nickel-plated copper alloy wire and a manufacturing method thereof. Background technique [0002] Bonding wire is the main way to connect the chip to the external packaging substrate (substrate) and / or multilayer circuit board (PCB). The development trend of bonding wire, from the application direction, is mainly the miniaturization of wire diameter, high floor life and high bobbin length. [0003] Typical bonding wires of semiconductor devices and LED chips are mainly gold wires, silver wires, copper wires, gold-plated wires, palladium-plated wires or their alloy wires. Except for copper wires, precious metals are used, and pure copper wires Easy to oxidize; common solar photovoltaic cells use screen-printed silver paste as grid electrodes, which are also precious metals; precious metals are expensive because of ...

Claims

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Application Information

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IPC IPC(8): H01L23/49H01L21/48C23F17/00
CPCH01L24/43H01L2224/43H01L2224/43848H01L2224/45H01L2224/45015H01L2224/45147H01L2224/45565H01L2224/48655H01L2924/00011H01L2924/00H01L2924/20751H01L2924/01079H01L2924/013H01L2924/01047H01L2924/00013H01L2924/0102H01L2924/01039H01L2924/0104H01L2924/01015H01L2924/00012H01L2924/01005H01L2224/45655H01L2224/45664H01L2924/00015H01L2224/45644H01L2924/01033H01L2924/01012H01L2924/01014H01L2924/01016H01L2924/01034H01L2924/01049H01L2924/01052H01L2924/01206
Inventor 程平李明郑东风
Owner 安徽华晶微电子材料科技有限公司
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