A kind of high peel strength flexible copper clad laminate and its manufacturing method

Abstract

The invention discloses a flexible copper-clad laminate with high peel strength and a manufacturing method thereof. The copper-clad laminate comprises the following layer structure: an organic polymer film layer, an adjustment layer, a transition layer, and a copper layer; the preparation method is as follows: 1) in Forming an adjustment layer on at least one side of the organic polymer film layer; 2) forming a transition layer; 3) forming a copper layer; or: 1) modifying the surface of the organic polymer film layer, and then forming an adjustment layer on at least one side of the film layer; 2 ) forming a transition layer; 3) forming a copper layer; or: 1) forming an adjustment layer on at least one side of the organic polymer film layer; 2) surface modification; 3) forming a transition layer; 4) forming a metal copper layer. Alternatively: 1) surface modification of at least one side of the organic polymer film layer; 2) formation of an adjustment layer; 3) surface modification; 4) formation of a transition layer; 5) formation of a copper layer. The present invention forms a copper-clad laminate with higher peeling strength through a plating method, and the thickness of the copper foil of the copper-clad laminate can be very thin.

Description

technical field [0001] The invention relates to a flexible copper-clad laminate with high peeling strength and a manufacturing method thereof. Background technique [0002] As a special basic material for connecting electronic components, flexible printed circuit (FPC) has excellent properties such as lightness, thinness, various structures, and bending resistance. It can be widely used in high-end fields such as folding mobile phones, liquid crystal displays, notebook computers, and on-board IC packaging substrates. [0003] The traditional FCCL is mainly a glue-type product, a three-layer structure mainly composed of copper, adhesive, and PI film, referred to as 3L-FCCL. The adhesive in 3L-FCCL is mostly epoxy, and its thermal stability is poorer than that of PI substrates, resulting in a decrease in the thermal stability and dimensional stability of FCCL, and the thickness of the substrate is relatively large. In recent years, with the rapid development of the electroni...

AI Technical Summary

Problems solved by technology

The adhesive in 3L-FCCL is mostly epoxy, and its thermal stability is poorer than that of PI substrates, resulting in a decrease in the thermal stability and dimensional stability of FCCL, and the thickness of the substrate is larger

This invention uses plasma treatment technology to increase the peel strength of adhesive-free flexible copper-clad laminates, but the peel strength is still unsatisfactory and cannot meet the requirements of use. At the same time, the treated surface is unstable and is not suitable for mass production in rolls.

[0012] The publication number is CN 102717554 A, and the invention patent titled "A Two-layer Flexible Copper Clad Laminate" discloses a two-layer structure flexible copper clad laminate with a copper layer on the surface of an organic polymer film. Previously, ion implantation was used to increase the peel strength of the adhesive-free flexible copper clad laminate, but the peel strength was only 6-7N / cm, so it could not be used

[0013]In the above three specific methods, or directly form a conductor primer layer on the surface of the polymer film, and then form a copper layer, the peel strength of the copper clad laminate obtained by this method is extremely high Low, only 3-5N / cm; in order to improve the bonding force between the organic polymer film and the metal layer, or after plasma treatment on the surface of the polymer film, the primer layer and the metal layer are formed again; or the metal layer is formed Before, the ion implantation process was added, but none of the above methods solved the problem of low peel strength of adhesive-free flexible copper clad laminates

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