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Inorganic fiber reinforced heat insulation board

An inorganic fiber, thermal insulation technology, applied in the field of fiber-reinforced thermal insulation composite materials, can solve the problems of complex preparation process, difficult process, poor mechanical properties, etc.

Inactive Publication Date: 2015-04-15
佛山市顺德区仁航科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its preparation process is complicated, the process is difficult to control, it is difficult to produce in batches, and its mechanical properties are poor.
However, the traditional ceramic fiberboard has no ability to block infrared rays in a certain band, so the radiant heat energy in this band will almost pass through the heat shield.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Example 1: Add 30 parts of aluminum silicate fiber, 55 parts of white carbon black, 10 parts of silica sol and 5 parts of titanium dioxide into the mixing equipment, fully stir and mix, and add an appropriate amount of water to wet the material; stir evenly Finally, the mixed material is put into a mold and press-molded; finally, the product is dried at 110°C to obtain the inorganic fiber-reinforced thermal insulation board of the present invention.

Embodiment 2

[0013] Example 2: Add 40 parts of glass fiber, 22 parts of white carbon black, 20 parts of sepiolite powder, 5 parts of starch, 5 parts of resin and 8 parts of titanium dioxide into the mixing equipment, fully stir and mix, and add an appropriate amount of water at the same time Wet the material; after stirring evenly, put the mixed material into a mold for pressure molding, and dry it at 200°C to obtain the inorganic fiber reinforced thermal insulation board of the present invention.

Embodiment 3

[0014] Example 3: Add 25 parts of aluminum silicate fiber, 20 parts of basalt fiber, 20 parts of sepiolite powder, 20 parts of expanded perlite powder, 5 parts of silica sol, 5 parts of aluminum sol and 5 parts of titanium dioxide into the mixing equipment , stir and mix thoroughly, and at the same time add an appropriate amount of water to moisten the material, and after stirring evenly, put the mixed material into a mold for press molding; finally dry the product at 150°C to obtain the inorganic fiber of the present invention Reinforced thermal insulation insulation board.

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PUM

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Abstract

The invention relates to an inorganic fiber reinforced heat insulation board. The board is prepared by: taking inorganic fiber as the reinforcement phase, adding one or more heat insulation fillers, and adding a proper ratio of an organic binder or inorganic binder and an additive, and carrying out mixing, molding and drying. The heat insulation board is characterized in that it comprises the following components by weight: 10-80 of the inorganic fiber, 10-60 of the heat insulation filler, 1-10 of the organic binder, 5-20 of the inorganic binder, and 1-10 of the additive. The inorganic fiber reinforced heat insulation board prepared by the invention has excellent high temperature resistance, good heat insulation comprehensive performance and mechanical properties, and the production process is simple, the operation is convenient, and the cost is low.

Description

technical field [0001] The invention relates to the field of fiber-reinforced thermal insulation composite materials. Background technique [0002] With the rapid development of social economy, the global energy consumption has risen sharply, and energy shortage has become a worldwide problem. Thermal insulation materials, as one of the most effective measures for energy conservation, have received sufficient attention and extensive research. The use of good thermal insulation materials in the industry is conducive to reducing energy consumption of products, reducing production costs, increasing the service life of equipment, etc., and has considerable social and economic benefits. In the field of military and aerospace, the harsh environment of the device requires that the thermal protection system not only has efficient heat insulation performance, but also must have the characteristics of higher temperature resistance, high reliability, light weight and high efficiency. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B28/00C04B28/24C04B14/38
Inventor 孙杰马道平孙志杰张宗科梁志伟
Owner 佛山市顺德区仁航科技有限公司
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