Aluminum-resin bonded body and manufacturing method thereof
A manufacturing method, a technology for joints, applied in chemical instruments and methods, other household appliances, lamination, etc.
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Embodiment 1
[0065] (1) Fabrication of aluminum base material after surface treatment
[0066] An aluminum substrate having a size of 40 mm×40 mm was cut out from a commercially available aluminum plate (A5052; plate thickness 2.0 mm). In addition, the concentration of sodium hydroxide prepared as a film-forming treatment agent was 100 g / L and the concentration of zinc oxide was 25 g / L (as Zn + 20g / L) containing zinc ion sodium solution. Next, the above-mentioned aluminum substrate was immersed in the zinc ion-containing sodium aqueous solution at room temperature for 3 minutes, and then washed with water to prepare a surface-treated aluminum substrate for a test in which an oxygen-containing film containing zinc element was formed on the surface. material.
[0067] (2) Determination of film thickness of oxygen-containing film
[0068] After the obtained surface-treated aluminum substrate is embedded in epoxy resin and fixed, the surface-treated aluminum substrate is cut together with e...
Embodiment 2~9
[0091] Except for changing the following conditions, the aluminum resin bonded body for the test was produced in the same manner as in Example 1, and the IR analysis of the resin part and the evaluation test of the bonding strength were performed in the same manner as in Example 1; as the aluminum substrate , the same aluminum plate (A5052; plate thickness 2.0mm) as in Example 1 is used in Examples 2 to 7, in addition, aluminum plate (A1050; plate thickness 2.0mm) is used in Example 8, and aluminum plate is used in Example 9 (ADC12; plate thickness 2.0 mm); using the zinc ion-containing alkaline aqueous solution of the liquid composition shown in Table 1, the alkali hydroxide concentration and the zinc ion concentration were set to the concentrations shown in Table 1.
[0092] The results are shown in Table 1.
Embodiment 10~11
[0094] As the aluminum substrate, the same aluminum plate (A5052; plate thickness 2.0 mm) as in Example 1 was used in Example 10, and the same aluminum plate (ADC12; plate thickness 2.0 mm) as in Example 9 was used in Example 11. , implement in 30wt% nitric acid aqueous solution with normal temperature immersion for 5 minutes and fully wash with ion-exchanged water, then in 5wt% sodium hydroxide solution with 50 ℃ immersion for 1 minute and then wash with water, then in 30wt% nitric acid aqueous solution with normal temperature immersion 3 Minutes after washing with water for pretreatment. Next, an aluminum film formation treatment was carried out by immersing in hot water at 91° C. for 5 minutes and treated to form an oxygen-containing film containing aluminum compound AlO(OH) on the surface of the aluminum substrate. In the same manner as in Example 1, an aluminum-resin bonded body for a test was produced, and in the same manner as in Example 1, IR analysis of the resin port...
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Abstract
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