Halogen-free flame-retardant epoxy resin composition for LED encapsulation and preparation method for halogen-free flame-retardant epoxy resin composition

An LED packaging and epoxy resin technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of lamp body burning, no flame retardant performance, easy to burn, etc., and achieve good light transmittance, high productivity, TG Effect with little effect of temperature

Inactive Publication Date: 2015-04-29
DONGGUAN SCI IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Most of the existing LED packaging epoxy resins do not have flame retardant properties, and are even extremely flammable. When the LED is continuously lit, the temperature of the lamp body will rise sharply, which may cause the lamp body to burn.
At present, although there are flame-retardant encapsulating epoxy resins on the market, because they use halogen flame-retardant, the colloidal halogen content is very high, and for electronic products such as LEDs that have very strict requirements on halogen content, this It is a serious defect, especially for LED lamps exported abroad, the requirements for halogen content are more stringent, LED lamps encapsulated with this epoxy resin will be directly rejected no matter how good other performances are.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Example 1, a halogen-free flame-retardant LED packaging epoxy resin composition provided in this example, which is composed of the following raw materials in mass percentage: 44.2% epoxy resin, 10% DOPO, 0.3% addition accelerator, methyl Hexahydrophthalic anhydride 44%, curing accelerator 1%, defoamer 0.5%.

[0027] Preferably, the epoxy resin is a compound containing two or more epoxy groups. Specifically, the epoxy resin is at least one of bisphenol A diglycidyl ether, alicyclic diepoxide, and bisphenol F diglycidyl ether. The DOPO is 9,10-dihydro-9-oxa-10-phospho-phenanthrene-10 oxide. The addition accelerator is at least one of triphenylphosphine, 4,4-diaminophenylsulfone and p-benzodione. The curing accelerator is a halogen-free quaternary ammonium salt accelerator.

[0028] A preparation method of the above-mentioned halogen-free flame-retardant LED encapsulation epoxy resin composition, which comprises the following steps:

[0029] (1) Add epoxy resin, DOPO a...

Embodiment 2

[0032] Example 2, a halogen-free flame-retardant LED encapsulation epoxy resin composition and its preparation method provided in this example are basically the same as Example 1, the difference is that it consists of the following raw materials in mass percentage: epoxy Resin 39.5%, DOPO 15%, addition accelerator 0.15%, methyl hexahydrophthalic anhydride 44%, curing accelerator 1%, defoamer 0.35%.

Embodiment 3

[0033] Example 3, a halogen-free flame-retardant LED encapsulation epoxy resin composition and its preparation method provided in this example are basically the same as Example 1, the difference is that it consists of the following raw materials in mass percentage: epoxy Resin 34.3%, DOPO 20%, addition accelerator 0.35%, methyl hexahydrophthalic anhydride 44%, curing accelerator 1%, defoamer 0.35%.

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PUM

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Abstract

The invention discloses halogen-free flame-retardant epoxy resin composition for LED encapsulation. The halogen-free flame-retardant epoxy resin composition comprises the following raw materials by mass percent: 30-50% of epoxy resin, 10-20% of DOPO, 0.1-1% of an addition accelerator, 30-50% of methylhexahydrophthalic anhydride, 0.5-2% of a curing accelerator and 0.1-0.5% of a defoaming agent. The invention further discloses a preparation method for the composition. The preparation method is simple in process step and easy to realize, and can be used for quickly preparing a halogen-free flame-retardant epoxy resin composition product for LED encapsulation. The halogen-free flame-retardant epoxy resin composition for LED encapsulation provided by the invention is reasonable in formula, very low in halogen content (not more than 900 ppm) and excellent in flame resistance, and adopts a phosphorus flame retardant technology. An encapsulated LED lamp is good in light transmittance and high in hardness, has small influence on TG (glass transition temperature) and is particularly suitable for LED encapsulation protection.

Description

technical field [0001] The invention relates to the technical field of epoxy resin compositions for LED packaging, in particular to a halogen-free flame-retardant LED packaging epoxy resin composition and a preparation method thereof. Background technique [0002] Most of the existing LED packaging epoxy resins do not have flame retardant properties, and are even extremely flammable. When the LED is continuously lit, the temperature of the lamp body will rise sharply, which may cause the lamp body to burn. . At present, although there are flame-retardant encapsulating epoxy resins on the market, because they use halogen flame-retardant, the colloidal halogen content is very high, and for electronic products such as LEDs that have very strict requirements on halogen content, this It is a serious defect, especially for LED lamps exported abroad, the requirements for halogen content are more stringent, and the LED lamps encapsulated with this epoxy resin will be directly rejec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/42C08G59/20C08G59/30H01L33/56
Inventor 查家华
Owner DONGGUAN SCI IND
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