Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Packaging convex point structure

A bump structure and layer structure technology, applied in electrical components, electric solid devices, circuits, etc., can solve problems such as bumps prone to microcracks, affect welding quality, and large internal stress, and improve long-term stability and reliability. performance, low cost, and the effect of reducing internal stress

Inactive Publication Date: 2015-04-29
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
View PDF7 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the packaging test of the above-mentioned structure, it was found that if the metal copper pillar is in direct contact with the tin-based solder, the copper pillar will easily diffuse into the solder and form a copper-tin alloy with tin, thereby affecting the soldering quality. Solder mask nickel, too thick nickel layer will generate a large internal stress in the bump, after multiple temperature cycles or thermal shocks, micro cracks are prone to appear at the internal stress and cause the bump to fail

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packaging convex point structure
  • Packaging convex point structure
  • Packaging convex point structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] The present invention will be further described below in conjunction with accompanying drawing:

[0034] Such as figure 1 A bump structure for packaging shown includes a substrate layer 101 , a passivation layer 102 , a pad layer 103 , an adhesive layer 104 , a composite solder resist wetting layer 105 and a pre-solder layer 106 .

[0035] Both the passivation layer 102 and the pad layer 103 are located above the substrate layer 101 , and an opening is provided above the passivation layer 102 , and the pad layer 103 is embedded in the opening of the passivation layer 102 . The adhesive layer 104 , the composite solder resist wetting layer 105 , and the pre-solder layer 106 are sequentially arranged above the pad layer 103 from bottom to top.

[0036] The substrate layer 101 as the support of the entire bump structure should have good mechanical strength and good long-term stability. The material of the substrate layer is alumina ceramics, aluminum nitride ceramics, lo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Surface roughnessaaaaaaaaaa
Flatnessaaaaaaaaaa
Login to View More

Abstract

The invention relates to a packaging convex point structure. The packaging convex point structure comprises a substrate layer, a passivation layer, a welding pad layer, an adhesive layer, a composite solder-resist infiltration layer and a preset solder layer, wherein the passivation layer and the welding pad layer are both located above the substrate layer, the upper portion of the passivation layer is provided with an opening, the welding pad layer is embedded in the opening of the passivation layer, the adhesive layer, the composite solder-resist infiltration layer and the preset solder layer are sequentially arranged above the welding pad layer from bottom to top, the substrate layer is made of ceramics, the composite solder-resist infiltration layer is of a composite metal film layer structure with multiple metal layers, and the horizontal projection area of the preset solder layer is larger than that of the composite solder-resist infiltration layer. According to the technical scheme, the packaging convex point structure without copper and low in welding stress can improve the long-time stability and reliability of a packaging structure.

Description

[0001] technical field [0002] The invention relates to the field of packaging of microelectronics and optoelectronic products, in particular to a chip-level and substrate-level flip-chip packaging bump structure. Background technique [0003] In the field of microelectronics and optoelectronic packaging technology, there are currently two mainstream process implementation paths for the interconnection of solder joints: one is interconnection through wire bonding, and the other is flip-chip soldering through the production of bump structures. As the system integration level of the product is getting higher and higher, the volume is getting smaller and the power consumption is getting bigger and bigger, the high packaging density, excellent heat dissipation performance and high reliability of the flip-chip soldering realized by the bump structure are getting better and better. more and more competitive. The development trend of "replacing lines with dots" is irresistible. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/488
CPCH01L2224/11
Inventor 李林森汪涛童洋庄永河李鸿高
Owner NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com