Circuit board and gilding method thereof

Abstract

The invention discloses a circuit board and a gilding method thereof. The gilding method of the circuit board comprises the following steps: pasting a dry film on a copper plate to expose welding plate to be gilded; processing the surface of the welding plate through chemical nickel gold immersion to form a gold layer on the welding plate, wherein the gold layer has first thickness; electrogilding the gold layer so as to increase the thickness of the gold layer to second thickness, wherein the thickness current is 0.2-0.6A.

Description

technical field

[0001] The invention relates to the field of printed circuit board processing, in particular to a circuit board and a gold plating method thereof. Background technique

[0002] In recent years, with the continuous development of miniaturization, high speed and high performance of electronic devices such as smartphones, tablet PCs and ultrabooks, printed circuit boards (PCB), which form the basis of electronic devices, are constantly moving towards Thin and short development. The PCB performs the functions of component mounting and signal transmission. Some circuit boards need to be physically plugged in. For example, two PCBs are connected to each other through an edge connector commonly known as a gold finger, that is, a gold finger on one PCB is inserted into a suitable connector on another PCB. In the slot, such as the graphics card, sound card, network card in the computer, etc., are directly inserted into the corresponding Peripheral Component Intercon...

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