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Circuit board and gilding method thereof

A circuit board, electroplating gold treatment technology, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of short circuit of circuit board and low product yield.

Active Publication Date: 2015-04-29
CHONGQING FOUNDER HI TECH ELECTRONICS +1
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  • Claims
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Problems solved by technology

[0008] In order to solve the technical problems in the prior art that circuit boards that cannot pull gold-plated process lead wires in the board are easily short-circuited and the product yield is low when nickel-plated, the invention provides a circuit board and a gold-plating method thereof

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Embodiment Construction

[0021] The embodiment of the present invention provides a circuit board and a gold-plating method thereof, which are used to solve the problems existing in the prior art that when the circuit board cannot pull the gold-plated process leads in the board, it is easy to cause a short circuit on the circuit board and low product yield when the circuit board is plated with gold. question.

[0022] The technical solution in the embodiment of the present application is to solve the above-mentioned technical problems, and the general idea is as follows:

[0023] The gold plating method of the circuit board in an embodiment of the present invention comprises: pasting dry film on the copper plate, exposing the welding pad that needs gold plating; Utilizing the mode of electroless nickel-gold to carry out surface treatment to the welding pad, forming a gold layer on the welding pad , the gold layer has a first thickness; performing gold electroplating on the gold layer to increase the th...

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Abstract

The invention discloses a circuit board and a gilding method thereof. The gilding method of the circuit board comprises the following steps: pasting a dry film on a copper plate to expose welding plate to be gilded; processing the surface of the welding plate through chemical nickel gold immersion to form a gold layer on the welding plate, wherein the gold layer has first thickness; electrogilding the gold layer so as to increase the thickness of the gold layer to second thickness, wherein the thickness current is 0.2-0.6A.

Description

technical field [0001] The invention relates to the field of printed circuit board processing, in particular to a circuit board and a gold plating method thereof. Background technique [0002] In recent years, with the continuous development of miniaturization, high speed and high performance of electronic devices such as smartphones, tablet PCs and ultrabooks, printed circuit boards (PCB), which form the basis of electronic devices, are constantly moving towards Thin and short development. The PCB performs the functions of component mounting and signal transmission. Some circuit boards need to be physically plugged in. For example, two PCBs are connected to each other through an edge connector commonly known as a gold finger, that is, a gold finger on one PCB is inserted into a suitable connector on another PCB. In the slot, such as the graphics card, sound card, network card in the computer, etc., are directly inserted into the corresponding Peripheral Component Intercon...

Claims

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Application Information

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IPC IPC(8): H05K3/24H05K3/40
CPCH05K3/241H05K3/403H05K2201/09409H05K2201/09427
Inventor 周明镝王瑾舒明
Owner CHONGQING FOUNDER HI TECH ELECTRONICS
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