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High-power LED packaging adhesive composition

A technology of LED packaging and composition, applied in the direction of non-polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problems of UV resistance and heat aging performance that are difficult to meet the requirements of new LED packaging, and achieve good test results , Shore hardness effect

Inactive Publication Date: 2015-05-06
INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional epoxy resin packaging materials have been difficult to meet the packaging requirements of new LEDs and power LEDs in terms of UV resistance and heat aging performance. Silicone resin has the characteristics of both organic materials and inorganic materials, and has high temperature resistance, high radiation resistance and Cold resistance, good adhesion and mechanical properties

Method used

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  • High-power LED packaging adhesive composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Component A: 50 parts of phenyl vinyl silicone resin with 3% vinyl molar content and 50% phenyl molar content, transparent liquid MDQ resin with 40% phenyl molar content and 1% vinyl molar content 4 0.003 parts of platinum catalyst; the viscosity of phenylvinyl silicone resin at 25°C is 10Pa·s, the platinum catalyst is a compound of dimethyldiphenyldivinyldisiloxane and platinum, dimethyl diphenyl The refractive index of the phenyl divinyl disiloxane is greater than 1.5, and the content of platinum in the platinum catalyst is 2 wt%.

[0025] Component B: 25 parts of high phenyl hydrogen-containing silicone oil with a phenyl molar content of 35%, a refractive index greater than 1.50, and a viscosity of less than 1Pa·s, and 3 parts of a tackifier; the tackifier is selected from vinyltrimethoxysilane coupling Agent V06;

[0026] The ratio of vinyl content in components A and B is 1.1.

[0027] Mix components A and B evenly, completely defoam, place in an oven at 80°C for...

Embodiment 2

[0029] Component A: 70 parts of phenyl vinyl silicone resin with 5% vinyl molar content and 30% phenyl molar content, transparent liquid MDQ resin with 50% phenyl molar content and 2% vinyl molar content 2 0.005 parts of platinum catalyst; the viscosity of phenylvinyl silicone resin at 25°C is 15Pa·s, the platinum catalyst is a compound of methylphenylvinylsiloxane and platinum, methylphenylvinylsiloxane The refractive index of the alkane is greater than 1.5, and the content of platinum in the platinum catalyst is 2 wt%.

[0030] Component B: 25 parts of high phenyl hydrogen-containing silicone resin with a phenyl molar content of 45%, a refractive index greater than 1.50, and a viscosity of less than 1Pa·s, and 2 parts of a tackifier; the tackifier is vinyltrimethoxysilane Joint agent A-171; high phenyl hydrogen-containing silicone resin is a compound of phenyl hydrogen-containing silicone resin with different viscosities.

[0031] The ratio of vinyl content in components A ...

Embodiment 3

[0034] Component A: 90 parts of phenyl vinyl silicone resin with a vinyl molar content of 2% and a phenyl molar content of 38%, a transparent liquid MDQ resin with a phenyl molar content of more than 30% and a vinyl molar content of 4% 2 0.005 parts of platinum catalyst; the viscosity of phenylvinyl silicone resin at 25°C is 20Pa·s, the platinum catalyst is a compound of methylphenylvinylsiloxane and platinum, methylphenylvinylsiloxane The refractive index of the alkane is greater than 1.5, and the content of platinum in the platinum catalyst is 2 wt%.

[0035] Component B: 40 parts of high phenyl hydrogen-containing silicone resin with a phenyl molar content of 45%, a refractive index greater than 1.50, and a viscosity of less than 1 Pa·s, and 3 parts of a tackifier; the tackifier is vinyltrimethoxysilane The mixture of the joint agent KBM-1003 and WD-21, the two are mixed at a mass ratio of 1:1; the high phenyl hydrogen-containing silicone resin is a compound of phenyl hydro...

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Abstract

The invention discloses high-power LED packaging adhesive composition which is prepared from the following raw materials in parts by weight: 10-90 parts of phenyl vinyl silicon resin, 0-5 parts of MDQ resin, 0.002-0.005 parts of a platinum catalyst, 15-40 parts of high-phenyl hydrogen-containing silicone oil or 20-50 parts of high-phenyl hydrogen-containing silicone resin and 0-3 parts of a tackifier, the phenyl vinyl silicon resin, the MDQ resin and the platinum catalyst form a component A; the high-phenyl hydrogen-containing silicone oil or the high-phenyl hydrogen-containing silicone resin and the tackifier form a component B; the vinyl content ratio of the component A to the component B is 1.1-1.4. A preparation method for the high-power LED packaging adhesive composition comprises the following steps: mixing the component A with the component B, defoaming, putting a defoamed mixture into a drying oven with the temperature of 80 DEG C for 2 hours, heating to 150 DEG C, keeping the temperature for 3 hours, and cooling to the room temperature to obtain the high-power LED packaging adhesive composition. The high-power LED packaging adhesive composition has the refractive index of more than 1.52 and the light transmittance of more than 95% before and after being cured, and is good in mercurochrome test effect, high in shore hardness and suitable for high-power LED packaging.

Description

technical field [0001] Embodiments of the present invention relate to the field of organic silicon, and more specifically, embodiments of the present invention relate to a high-power LED encapsulating adhesive composition. Background technique [0002] Since the development of LEDs, 90% of the encapsulation resins use bisphenol A epoxy resins because the material has excellent optical, mechanical and process properties, and is low in cost. With the continuous development of LEDs, blue light, green light and ultraviolet-based white LEDs with shorter wavelengths have higher and higher requirements for packaging materials. Packaging materials with high refractive index, high resistance to ultraviolet rays and heat aging, and low stress can be used Improve the light output power and service life of lighting devices. Traditional epoxy resin packaging materials have been difficult to meet the packaging requirements of new LEDs and power LEDs in terms of UV resistance and heat agi...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J11/06H01L33/56C09K3/10
Inventor 纪兰香尚丽坤邓志华邓建国刘忠平付俊杰杨雪梅黄健
Owner INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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