Hypoeutectic aluminum-silicon alloy with excellent thermal conductivity, preparation method and application thereof

Abstract

The invention discloses a hypoeutectic aluminum-silicon alloy with excellent thermal conductivity. The alloy comprises the following chemical components: 5-9 wt% of Si, smaller than 0.5 wt% of Mg, smaller than 0.5 wt% of Cu, smaller than 0.7 wt% of Fe, smaller than 0.3 wt% of Mn, inevitable impurity elements and the balance of Al, a single inevitable impurity element is not less than 0.05 wt%, and the total amount of the inevitable impurity elements is lower than 0.25 wt%. The hypoeutectic aluminum-silicon alloy with thermal conductivity of 170-200 W/(m.K) can be obtained in a preparation process by such technical means as controlling the chemical components of the alloy and casting, and thermal treatment and the like. Good castability and mechanical properties of the aluminum-silicon alloy are guaranteed, and excellent thermal conductivity of the aluminum-silicon alloy is guaranteed at the same time.

Description

technical field [0001] The invention belongs to the field of nonferrous metal forming and processing, and in particular relates to a hypoeutectic aluminum-silicon alloy and a preparation method thereof. Background technique [0002] Aluminum-silicon alloy has the characteristics of small crystallization temperature interval, large latent heat of solidification and large specific heat capacity of its silicon phase; small linear shrinkage coefficient, thermal cracking and shrinkage tendency, so its casting performance is better than other aluminum alloys. Since the Al-Si alloy eutectic has good plasticity and can better balance the requirements of both mechanical properties and casting properties, Al-Si alloys are currently the most widely used casting alloys. Among them, the hypoeutectic aluminum-silicon alloy not only has good processability, but also has good casting performance, welding performance and thermal conductivity, and has been widely used in aerospace, transporta...

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Problems solved by technology

[0003]The current general-purpose eutectic aluminum-silicon alloy heat-conducting material has become increasingly prominent due to the limitation of its thermal conductivity. Taking the most commonly used ZL101 alloy as an example, its The as-cast thermal conductivity

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