Method and device for preparing thin film materials by spin-coating method

A thin-film material and spin-coating technology, which is applied to devices and coatings for coating liquid on the surface, can solve the problems of glue liquid throwing out, reduced processing efficiency, and poor uniformity, and achieves improved thickness uniformity, The effect of improving utilization and improving liquidity

Inactive Publication Date: 2015-05-27
天津森普捷科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the traditional glue leveling machine, the glue injection process uses a needle syringe or a faucet-type injection glue injector to inject glue into the center of the substrate. The advantages of this method are that the amount of glue injected is easy to precisely control and the glue injection position is accurate; the disadvantages are When the size of the substrate is large or the viscosity of the sol-gel is large, it is easy to make the thickness of the spin-coated film gradually decrease from the center to the periphery, and the uniformity becomes poor. Long glue throwing time, but high speed and long time will easily lead to glue being thrown out, resulting in reduced processing efficiency

Method used

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  • Method and device for preparing thin film materials by spin-coating method
  • Method and device for preparing thin film materials by spin-coating method
  • Method and device for preparing thin film materials by spin-coating method

Examples

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no. 1 example

[0028] A kind of method utilizing spin-coating method to prepare film material, comprises the following steps:

[0029] 1) Spray the atomized glue evenly on the substrate, then drive the substrate to rotate so that the glue on the substrate forms a film layer, and stop the rotation of the substrate after the glue distribution is stable. On the surface of the substrate (glass or silicon wafer, etc.), a thin incubating layer that gradually becomes thicker from the center to the outside is formed, which plays a transitional role, allowing the surface of the substrate (such as glass) to form a layer of "fog", which is beneficial to the subsequent The diffusion of the spin coating solution, the stable distribution of the film layer, and the stable distribution time vary with the glue solution. The stable distribution means that the glue solution on the substrate completes the basic shape and no longer changes greatly with the rotation, that is, Because the dosage is very small and ...

no. 2 example

[0033] A kind of method utilizing spin-coating method to prepare film material, comprises the following steps:

[0034] 1) Inject glue at the center of the substrate, and then drive the substrate to rotate until the glue injected in the center is preliminarily shaped and then stops the rotation. The glue liquid completes the finalization of the basic center-to-outward gradually thinning distribution on the substrate, no large changes will occur with the rotation, and the rotation can be stopped at this time.

[0035] 2) Spray the atomized glue evenly on the substrate, then drive the substrate to rotate, and stop the rotation of the substrate after the glue distribution is stable.

[0036] First inject glue in the center and rotate it to form a film layer whose thickness gradually decreases from the center to the outside, and then spray the glue again by spraying method, and the thickness of the film layer formed after the sprayed glue is spin-coated shows that it gradually bec...

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Abstract

The invention discloses a method for preparing thin film materials by a spin-coating method. The method comprises the following steps that a, atomized glue liquid is uniformly sprayed and coated on a substrate, then, the substrate is driven to rotate so that the glue liquid on the substrate form a film layer, and after the glue liquid distribution is stable, the rotation of the substrate stops; b, glue injection is carried out in the center part of the substrate, then, the substrate is driven to rotate, and the rotation stops until the glue liquid of the center glue injection is uniformly distributed, wherein the step a and the step b are sequentially carried out, or are carried out by changing the sequence or are alternately carried out for many times. The method has the technical effects that 1, through spin-coating on the substrate with greater size and greater glue liquid viscosity, the thickness uniformity of a spin-coating thin film can be improved; 2, the control flexibility and the control precision of a spin-coating process can be improved through multi-step spin-coating; 3, one-step spray coating is added before the traditional injection type spin coating, a thin liquid film layer is formed on the surface of the substrate, the fluidity of injection type spin coating glue liquid on the surface of the substrate is improved, the motor speed requirement is reduced, and the spin-coating efficiency is improved; 4, the glue liquid utilization rate is improved.

Description

technical field [0001] The invention relates to the technical field of thin film preparation, in particular to a method and device for preparing thin film materials by spin coating. Background technique [0002] The sol-gel method is an important preparation method of thin film materials, which can be realized by spin coating method. The spin coating process generally uses a glue homogenizer (also known as a glue spinner, spin coater, etc.), and its working principle is to use the centrifugal force generated during high-speed rotation to make the glue on the substrate diffuse from the center to form a uniform film. . [0003] In the traditional glue leveling machine, the glue injection process uses a needle syringe or a faucet-type injection glue injector to inject glue into the center of the substrate. The advantages of this method are that the amount of glue injected is easy to precisely control and the glue injection position is accurate; the disadvantages are When the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D1/00B05C11/08B05C5/00B05C11/00
Inventor 胡增鑫
Owner 天津森普捷科技有限公司
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