Intelligent Power Module
An intelligent power module and housing technology, which is applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of inability to dissipate heat from integrated circuit chips, reduce the volume of intelligent power modules, etc., to improve the working temperature and use. Efficiency, improve service life, improve the effect of heat dissipation
Active Publication Date: 2017-06-16
MACMIC SCIENCE & TECHNOLOGY CO LTD
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Problems solved by technology
The traditional intelligent power semiconductor module mainly includes the shell, the main circuit board and the driving circuit board. The semiconductor chip, multiple electrode terminals and signal terminals are welded on the metal ceramic substrate to form the main circuit board, and the integrated circuit chip and the printed circuit board of each device are welded. The circuit board constitutes the drive circuit board. In order to reduce the size of the power module, the drive circuit board is installed on the housing through screws. The terminals are welded on the drive circuit board, and the connection with the external circuit of the power semiconductor module and the input and output of the drive signal are realized through the terminals. The printed circuit board, on the one hand, cannot further reduce the volume of the intelligent power module, and on the other hand, cannot dissipate heat from the integrated circuit chip
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[0013] See Figure 1~2 As shown, the intelligent power module of the present invention includes a housing 3, an aluminum-based copper clad laminate 14 fixed at the bottom of the housing 3, a plurality of electrode terminals 4, a plurality of signal terminals 2, an integrated circuit chip 10, devices, and more than three groups of semiconductors The unit module, the shell 3 and the copper substrate 11 are connected by an adhesive and a bushing 5 . See figure 2 , 3 As shown, the aluminum-based copper-clad laminate 14 of the present invention includes an aluminum layer 11-1 at the bottom, an insulating layer 11-2 at the middle, and a copper layer 11-3 at the top, which are sequentially connected, and the upper part of the copper layer 11-3 is also provided with a A plurality of gold-plated parts 11-4 for welding and an insulating part 11-5 that is arranged on the outer periphery of each gold-plated part 11-4 and is used for soldering resistance has a gold-plated part at the pl...
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The invention relates to an intelligent power module, in which an integrated circuit chip and a device are respectively bonded to an aluminum-based copper-clad board through an aluminum wire; a semiconductor unit module includes a copper substrate, a semiconductor chip and a fast recovery diode chip, and the copper substrate is fixed on the aluminum-based copper-clad board , the collector of the semiconductor chip and the cathode of the fast recovery diode chip are connected to the copper substrate, the emitter and gate of the semiconductor chip and the anode of the fast recovery diode chip are connected to the aluminum-based copper-clad laminate through aluminum wires, each electrode terminal and each signal terminal They are respectively embedded on the side walls of the casing, and the lower parts of each electrode terminal and each signal terminal are connected to the aluminum-based copper clad plate through aluminum wires. The casing is filled with silicone gel to seal the integrated circuit chip, device and semiconductor unit module, and the cover The board is attached to the case. The invention can mix and package semiconductor chips, fast recovery diode chips and integrated circuit chips on the aluminum-based copper-clad board, reduce the overall size, improve the heat dissipation effect, and reduce the production cost.
Description
technical field [0001] The invention relates to an intelligent power module and belongs to the technical field of power module manufacturing. Background technique [0002] The high-power semiconductor module is a standard form factor and a non-standard form factor module product. Intelligent power modules are mainly used for inverter conversion of direct current (DC) to alternating current (AC), used for frequency conversion control of industrial and civil air conditioners, improving power efficiency and reducing energy consumption. The traditional intelligent power semiconductor module mainly includes the casing, the main circuit board and the driving circuit board. The semiconductor chip, multiple electrode terminals and signal terminals are welded on the cermet-clad substrate to form the main circuit board. The circuit board constitutes the drive circuit board. In order to reduce the size of the power module, the drive circuit board is mounted on the housing through scre...
Claims
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IPC IPC(8): H01L23/14H01L23/488
CPCH01L2924/13055H01L2924/19107H01L2224/48091H01L2224/48137H01L2224/49111H01L2224/48139H01L2924/00014H01L2924/00
Inventor 聂世义王晓宝赵善麒
Owner MACMIC SCIENCE & TECHNOLOGY CO LTD