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Photocurable resin composition for imprinting, method for producing mold for imprinting, and mold for imprinting

A technology of curable resin and composition, applied in semiconductor/solid-state device manufacturing, household appliances, other household appliances, etc., can solve the problems of high viscosity, difficulty in thin coating, problem of mold flexibility, etc., and achieve surface hardness High, yellowing inhibition, good peeling effect

Inactive Publication Date: 2015-06-24
SOKEN CHEM & ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the above-mentioned composition contains oligomers, silicone compounds and silicone resins are oligomers and polymers, so the viscosity is high, and it is difficult to apply thinly on the substrate.
In addition, the flexibility of the mold obtained by this composition is also problematic
[0007] Next, in the case of manufacturing a resin mold by photoimprinting, the resin to be transferred shrinks when it cures, and there is a problem that the manufactured mold does not accurately reflect the shape of the original mold.

Method used

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  • Photocurable resin composition for imprinting, method for producing mold for imprinting, and mold for imprinting
  • Photocurable resin composition for imprinting, method for producing mold for imprinting, and mold for imprinting
  • Photocurable resin composition for imprinting, method for producing mold for imprinting, and mold for imprinting

Examples

Experimental program
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Effect test

Embodiment 1～3

[0139] In 75 parts by weight of tripropylene glycol diacrylate (APG-200), 20 parts by weight of EO modified nonylphenyl acrylate (M166), 5 parts by weight of phenol EO modified acrylate (M144) and 3-methacryloyl In 15 parts by weight of oxypropyltrimethoxysilane (KBM503), mix two (2,4,6-trimethylbenzoyl)-phenylphosphine oxide ( IRGACURE819) and 1-hydroxy-cyclohexyl-phenyl-ketone (IRGACURE 184) to prepare a photocurable resin composition. Its composition is shown in Table 1.

Embodiment 4～6

[0141] 75 parts by weight of EO modified trimethylolpropane triacrylate (M-350), 20 parts by weight of EO modified nonylphenyl acrylate (M166), 5 parts by weight of phenol EO modified acrylate (M144) and In 15 parts by weight of 3-methacryloxypropyltrimethoxysilane (KBM503), bis(2,4,6-trimethylbenzoyl) as a photoinitiator was mixed in the amount shown in Table 1 - Phenylphosphine oxide (IRGACURE 819) and 1-hydroxy-cyclohexyl-phenyl-ketone (IRGACURE 184) to prepare a photocurable resin composition. Its composition is shown in Table 1.

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Abstract

[Problem] The purpose of the present invention is to provide: a photocurable resin composition for producing a flexible mold for imprinting which has good releasability from a resin onto which the mold is to be transferred; a photocurable resin composition which does not undergo cure shrinkage upon optical imprinting when used as a material on which optical imprinting is to be applied; and a photocurable resin composition which enables the production of a mold for imprinting which has high surface hardness and which does not undergo yellowish discoloration upon the irradiation with ultraviolet ray or the like. [Solution] The photocurable resin composition for imprinting according to the present invention comprises a (meth)acrylic monomer (A), a silicon-containing monomer (B) and a photoinitiator (C), said photocurable resin composition being characterized in that the photoinitiator comprises a combination of an alkylphenone-type photoinitiator (C1) and an acylphosphine oxide-type photoinitiator (C2).

Description

technical field [0001] The present invention relates to a photocurable resin composition for imprint, a method for producing an imprint mold using the photocurable resin composition, and an imprint mold formed from the photocurable resin composition. Background technique [0002] Imprint technology refers to the technology of pressing the master mold with nano- or micron-scale fine structure formed on the surface to the liquid resin, and transferring the fine structure of the mold to the resin. A structure with a fine structure formed by transfer printing is used as an imprint mold, an AR film, a diffusion film, etc. according to the shape of the fine structure, and is used in various fields such as semiconductor materials, optical materials, storage media, micro motors, biology, and the environment. kind of field. [0003] As the imprinting method, thermal embossing and photoimprinting etc. are mentioned. In the said thermal embossing, a mold having a predetermined shape f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/027B29C33/38B29C59/02C08F220/00C08F220/26C08F230/08
CPCG03F7/0002B29C33/3857B29C33/40G03F7/027G03F7/029G03F7/031G03F7/0755C08F2/48B29L2031/757C08F222/102C08F220/286C08F230/085B29C33/38
Inventor 山田纮子须藤康夫
Owner SOKEN CHEM & ENG CO LTD
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