Copper alloy rheoforming method

A forming method and technology of copper alloy, applied in the field of copper alloy rheological forming, can solve the problems of difficulty in preparing and forming copper alloy semi-solid blanks, and achieve the effects of compact structure, reduced transshipment, and complex product structure
CN104759601AInactive Publication Date: 2015-07-08KUNMING UNIV OF SCI & TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
KUNMING UNIV OF SCI & TECH
Publication Date
2015-07-08
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a copper alloy rheoforming method, and belongs to the technical field of metal semi-solid formation. The method comprises the steps of heating copper alloy in a vacuum or inert gas protecting atmosphere until reaching the temperature exceeding recrystallizing temperature under the liquid-solid temperature intervals of the copper ally; plastically forming; feeding the plastically-formed blank into a die of which the temperature is accurately controlled; heating to reach the semi-solid temperature interval; maintaining the temperature; directly extruding the heated blank, or performing die forging and other deformation; cooling by the air until reaching the room temperature; performing corresponding thermal treatment to obtain the a copper alloy rheoforming product. The method has the advantages of being small in process and high in formation efficiency; the obtained product is complex in structure, dense and uniform in structure, and high in performance.
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Description

Technical field

[0001] The invention relates to a copper alloy rheological forming method, belonging to the technical field of metal semi-solid forming. Background technique

[0002] In the 1970s, Professor Flemings of the Massachusetts Institute of Technology and others developed a new metal forming method called semi-solid processing technology. It is a method for forming the characteristics of the metal from liquid to solid or from solid to liquid (ie liquid-solid coexistence). This new forming method combines the advantages of solidification processing and plastic processing, that is, the processing temperature is lower than that of the liquid and the deformation resistance is smaller than that of the solid. It can form parts with complex shapes and high precision and performance quality requirements with a large amount of deformation at one time. Semi-solid processing technology is called the most promising material forming processing method in the 21st century.

[0003] Sem...

Claims

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