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Copper alloy rheoforming method

A forming method and technology of copper alloy, applied in the field of copper alloy rheological forming, can solve the problems of difficulty in preparing and forming copper alloy semi-solid blanks, and achieve the effects of compact structure, reduced transshipment, and complex product structure

Inactive Publication Date: 2015-07-08
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides a copper alloy rheological forming method, the purpose of which is to solve the problem of difficulty in the preparation and forming of copper alloy semi-solid billets, and to broaden the deep processing technology and method of copper alloy products

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Examples

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Embodiment 1

[0025] The copper alloy rheological forming method described in this embodiment is used for forming ZCuSn10 tin bronze products (see figure 1 ), including the following steps:

[0026] (1) Measure the liquid-solid temperature of the semi-solid rheological copper alloy; the alloy in this example is a ZCuSn10 tin bronze alloy, a rectangular material with a size of 40×40×100mm, using differential scanning calorimetry (DSC) The solidus temperature of the alloy is 830℃, and the liquidus temperature is 1020℃;

[0027] (2) Under vacuum (vacuum degree is 10 -2 Pa), heat the ZCuSn10 tin bronze to 450°C, and roll the billet one pass with a reduction of 1mm; then rotate the billet 90° along its axial direction and roll it with a reduction of 1mm; A total of 2 passes are rolled. After the length of the alloy billet after rolling reaches 5%, a plastically deformed ZCuSn10 tin bronze billet will be obtained; before each pass, if the temperature of the billet drops below the recrystallization te...

Embodiment 2

[0034] The copper alloy rheological forming method described in this embodiment is used for forming ZCuSn10 tin bronze products (see figure 1 ), including the following steps:

[0035] (1) Measure the liquid-solid temperature of the semi-solid rheological copper alloy; the alloy in this example is a ZCuSn10 tin bronze alloy, a bar with a size of φ20×60mm, and the alloy is measured by differential scanning calorimetry (DSC) The solidus temperature is 830℃, and the liquidus temperature is 1020℃;

[0036] (2) Under the protection of argon, heat the ZCuSn10 tin bronze to 500℃, and use equal channel angular extrusion to perform 4 passes of equal channel angular extrusion on the blank, and the cumulative deformation reaches 48%; before each pass of extrusion, If the temperature of the billet drops below the recrystallization temperature, the billet needs to be heated to 500°C.

[0037] (3) Put the deformed ZCuSn10 tin bronze into the extrusion die and heat it to 890°C for 45 minutes in a ...

Embodiment 3

[0041] The copper alloy rheological forming method described in this embodiment is used for forming ZCuSn10P1 tin bronze products (see figure 1 ), including the following steps:

[0042] (1) Measure the liquid-solid temperature of the semi-solid rheological copper alloy; the alloy in this example is a ZCuSn10P1 tin bronze alloy, a bar with a size of φ40×60mm, and the alloy is measured by differential scanning calorimetry (DSC) The solidus temperature is 820℃, and the liquidus temperature is 1003℃;

[0043] (2) Under the protection of helium, heat the ZCuSn10 tin bronze to 400℃, and use multiple passes to extrude the blank to φ34×83mm in the first pass, and the cross-sectional deformation is 28%; the second pass Extrude the blank to φ30×106mm, the cross-section deformation is 22%; the third pass extrudes the blank to φ28.5×118mm, the cross-section deformation is 10%; the cumulative cross-section deformation reaches 60%; each pass is extruded Before pressing, if the temperature of t...

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Abstract

The invention discloses a copper alloy rheoforming method, and belongs to the technical field of metal semi-solid formation. The method comprises the steps of heating copper alloy in a vacuum or inert gas protecting atmosphere until reaching the temperature exceeding recrystallizing temperature under the liquid-solid temperature intervals of the copper ally; plastically forming; feeding the plastically-formed blank into a die of which the temperature is accurately controlled; heating to reach the semi-solid temperature interval; maintaining the temperature; directly extruding the heated blank, or performing die forging and other deformation; cooling by the air until reaching the room temperature; performing corresponding thermal treatment to obtain the a copper alloy rheoforming product. The method has the advantages of being small in process and high in formation efficiency; the obtained product is complex in structure, dense and uniform in structure, and high in performance.

Description

Technical field [0001] The invention relates to a copper alloy rheological forming method, belonging to the technical field of metal semi-solid forming. Background technique [0002] In the 1970s, Professor Flemings of the Massachusetts Institute of Technology and others developed a new metal forming method called semi-solid processing technology. It is a method for forming the characteristics of the metal from liquid to solid or from solid to liquid (ie liquid-solid coexistence). This new forming method combines the advantages of solidification processing and plastic processing, that is, the processing temperature is lower than that of the liquid and the deformation resistance is smaller than that of the solid. It can form parts with complex shapes and high precision and performance quality requirements with a large amount of deformation at one time. Semi-solid processing technology is called the most promising material forming processing method in the 21st century. [0003] Sem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22D17/00
Inventor 肖寒陈泽邦周荣卢德宏蒋业华周荣锋
Owner KUNMING UNIV OF SCI & TECH
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