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Active ester, thermosetting resin composition containing active ester, prepreg and laminated board

A resin composition, thermosetting technology, applied in the field of prepregs, laminates, and thermosetting resin compositions, can solve the problems of difficulty, heat resistance and low water absorption, and achieve low heat resistance, low water absorption, excellent The effect of dielectric properties

Inactive Publication Date: 2015-07-08
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In the above prior art, it has been proposed to use active ester as the curing agent of epoxy resin, which can improve the heat and humidity resistance of the cured product, reduce water absorption, reduce the dielectric constant and the dielectric loss value of the cured product, but its shortcoming is very It is difficult to achieve a balance between the above properties, so that it has good heat resistance, dielectric properties and low water absorption at the same time, and its dielectric properties are relatively stable with frequency changes

Method used

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  • Active ester, thermosetting resin composition containing active ester, prepreg and laminated board
  • Active ester, thermosetting resin composition containing active ester, prepreg and laminated board
  • Active ester, thermosetting resin composition containing active ester, prepreg and laminated board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0044] (1) Redistribution of PPO

[0045] Stir and heat 4000g of toluene in a three-necked flask equipped with a stirrer, condensing reflux tube and thermometer to 100°C, then add 2000g of PPO resin with a number average molecular weight of 20000, and add 600g of diallyl bis Phenol A (DABPA), stirred for 30min, then added 150g of benzoyl peroxide (BPO) dissolved in toluene, and kept the temperature at 92°C, and reacted for 360min. Then the product was cooled to room temperature and then 4000ml of methanol was added, and vigorously stirred, filtered and dried to obtain 2400g of small molecule bifunctional PPO resin (A1).

[0046] Repeat the above operations, change the ratio of various reactants in the redistributed PPO resin, and change the reaction temperature and reaction time to obtain difunctional PPO resins with different number average molecular weights, as shown in the following table:

[0047]

A1

A2

A3

A4

A5

A6

PPOs

2000 ...

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PUM

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Abstract

The invention provides active ester, a thermosetting resin composition containing the active ester, a prepreg and a laminated board. The active ester is a double-ended polyfunctional active ester containing a PPO main chain, and the thermosetting resin composition comprises epoxy resin and the double-ended polyfunctional active ester containing the PPO main chain. The prepreg, the laminated board and a copper-clad plate prepared from the thermosetting resin composition containing the double-ended polyfunctional active ester containing the PPO main chain has excellent dielectric properties, damp-heat resistance, heat resistance, extremely low water absorption and high bending strength.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to an active ester, a thermosetting resin composition, a prepreg and a laminate containing the active ester. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of information and communication equipment, in order to transmit and process large-capacity information at high speed, the operation signal tends to be high-frequency. At the same time, in order to meet the development trend of various electronic products , the circuit board is developing towards the direction of high multi-layer and high wiring density, which requires that the substrate material not only has good dielectric energy (low dielectric constant and low dielectric loss tangent) to meet the needs of high-frequency signal transmission, but also requires It has good heat resistance and machinability to meet the reliabilit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G65/48C08L71/12C08L63/00C08L79/04C08L79/08C08L47/00C08L25/10B32B15/092B32B15/08B32B15/20B32B27/04B32B27/28B32B27/38
CPCB32B15/092B32B15/20B32B27/04B32B27/28C08L79/04C08L79/08C08L61/14H05K1/0326H05K1/0353C08J2371/12C08J2463/00C08L71/126B32B15/08C08G65/485C08J2363/00C08J2471/12H05K1/0366H05K2201/012B32B2260/046B32B2260/023B32B5/26B32B2262/101B32B2457/08B32B2250/40B32B15/14B32B27/08C08J5/244C08J5/249C08L63/00C08G65/48C08L71/12C08L47/00B32B27/38B32B2307/3065B32B2457/00C08G59/4269C08J5/043C08L2201/02C08L2203/20
Inventor 罗成唐国坊
Owner GUANGDONG SHENGYI SCI TECH
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