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A method of directly forming and loading mud

A mud and direct technology, applied in the field of direct molding and loading of mud, can solve the problems of polluted materials, insufficient surface strength, and small loading capacity

Active Publication Date: 2018-06-05
苏州阿洛斯环境发生器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this method has the shortcoming that the loading capacity is small because it can only stick to one layer that is in contact with the glue.
In addition, for some materials like graphite, the surface strength itself is not enough, even if the adhesive is attached to the surface of the material, it is easy to peel off, and the required adhesion strength cannot be achieved
Some adhesives may also pose a risk of contaminating the material

Method used

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  • A method of directly forming and loading mud
  • A method of directly forming and loading mud
  • A method of directly forming and loading mud

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] figure 1 A schematic diagram of clay molding is given. Among them, 1 is a porous template made of silicone rubber (thickness 1mm), 2 is a 60-mesh mesh made of PP as the interface adjustment layer, and 3 is a carrier made of PP with three-dimensional mesh holes (thickness 10mm). 1 has more than 1000 forming holes, while figure 1 Only one hole is shown as an example. 4 circles the distribution of a small portion of mud in such a system: a portion stays in the forming holes of the formwork, and a portion passes through the interface adjustment layer and penetrates into the three-dimensional network of the carrier like tree roots.

[0021] figure 2 A schematic top view of the porous template is given. The length and width of the template are 34cm and 24cm respectively, and more than 1000 hexagonal honeycomb holes 6 are specially made in the area 5 of 30cm*24cm in the middle. The side length of the honeycomb hole 6 is 3mm. The gap 7 between honeycombs is 2 mm.

[002...

Embodiment 2

[0026] Other steps are the same as in Example 1. Change the interface adjustment layer from PP mesh to high-temperature non-stick cloth, so that no mud can penetrate into the carrier. After shaping, hexagonal flake manganese oxide particles with uniform shrinkage and flatness can be obtained.

Embodiment 3

[0028] Other steps are the same as in Example 1. Cancel the carrier, so it is equivalent to the place where the mud is not fixed. After shaping, it can be observed that the particles are easy to fall off from the interface adjustment layer, thereby obtaining uniform and flat hexagonal plate-shaped manganese oxide particles. Figure 5 The effect of this case is given.

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PUM

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Abstract

The present invention relates to a mud molded directly with the carrier and fixing process, belonging to the field of molding materials.The process uses a porous template, the interface having a carrier layer and adjusting three-dimensional pore network structure, while completing mud molded and fixed to the carrier.After the mud is pressed into the porous templates, wherein a portion of the hole formed through the plate, penetrate through the inner portion of the additional carrier layer interface after adjusting three-dimensional pore structure.After heat treatment, part of mud within the porous template releasing contraction, and contraction of mud in the carrier and the carrier is firmly compound.Adjusting the interfacial layer of mud infiltration amount of carrier necessary to control.Using the method of the invention, some of the material can not be added to the adhesive forming the carrier by molding and upload complete physical manner.Further portions of the mud free shrink closer to shrink, forming more uniform.

Description

technical field [0001] The invention relates to a technique for directly molding mud material and fixing it with a carrier. The mud can be catalysts, adsorbents and other materials or their precursors. The process can be applied in chemical industry, environmental protection, catalysis, energy and other fields. Background technique [0002] Most materials such as catalysts or their precursors need to be shaped before they can be used. The commonly used molding method is to add molding additives such as adhesives into the material, and then use extrusion, tableting, etc. to make granules. Or the materials and additives are made into slurry, and a coating is formed on the carrier by means of dipping or the like. No matter which method is used, it is often necessary to burn these additives at a higher temperature in the end. Otherwise, the additive will wrap the surface of the material or block its pores, thereby affecting the performance of the material. Related backgroun...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01J20/28B01J20/30B01J35/02B01J35/00
Inventor 汪江林张浩刘天雷张竹君
Owner 苏州阿洛斯环境发生器有限公司