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A kind of high thermal conductivity heat conduction glue and preparation method thereof

A technology of high thermal conductivity and thermally conductive adhesive, applied in the direction of non-polymer adhesive additives, adhesive additives, etc., can solve the problems of low thermal conductivity, high density, low stability, etc., to improve thermal conductivity and electrical conductivity performance, improve dispersion, and solve the effect of chip heat dissipation

Active Publication Date: 2017-09-29
SHENZHEN SHEN RUI GRAPHENE TECH CO LTD
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

However, the development of traditional thermal adhesives also encountered some bottlenecks, such as low thermal conductivity, high density, and low stability.

Method used

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  • A kind of high thermal conductivity heat conduction glue and preparation method thereof
  • A kind of high thermal conductivity heat conduction glue and preparation method thereof
  • A kind of high thermal conductivity heat conduction glue and preparation method thereof

Examples

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Embodiment Construction

[0030] In order to further understand the technical means and characteristics of the present invention, I would like to give an example to further describe in detail in conjunction with the accompanying drawings:

[0031] The preparation method of thermally conductive adhesive of the present invention comprises the steps:

[0032] Step 1, prepare graphene oxide solution: first, oxidize and exfoliate natural scaly graphite powder in strong acid and strong oxidant to obtain graphene oxide; then put graphene oxide into deionized water, perform ultrasonic dispersion, and then centrifuge to remove untreated The exfoliated graphite particles are recovered to recover the supernatant, which is the graphene oxide solution.

[0033] Step 2, graphene oxide reduction: add a first reducing agent to the graphene oxide solution, and perform a reduction reaction in an environment of 90-98° C. for 1 hour to reduce it into graphene particles.

[0034] In the third step, the reduced graphene pa...

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Abstract

The invention provides a method for preparing a heat-conducting adhesive with high thermal conductivity, comprising: (1) preparing a graphene oxide solution; (2) adding a first reducing agent to the graphene oxide solution to reduce it to graphene particles; 3) graphene particle is dispersed in the aqueous solution that is mixed with tensio-active agent, to make graphene solution; (4) in graphene solution, add polymer monomer and cross-linking agent to react, with graphene particle Form polymer coating on outer surface; (5) add metal salt, ammonium, acid-base regulator and second reductant to react in the graphene solution that forms polymer coating, to obtain the graphene particle of metallized layer (6) Add metal particles to the graphene solution of the metal-plated layer and mix them, and evaporate the solvent to obtain solid particles; (7) After grinding the solid particles, mix them with the heat-conducting adhesive base material and make them glue. The thermally conductive adhesive prepared according to the method of the present invention has high thermal conductivity.

Description

technical field [0001] The invention relates to the field of interface heat dissipation materials, in particular to a heat-conducting adhesive with high thermal conductivity and a preparation method thereof. Background technique [0002] With the increasing integration density of microelectronic devices, the heat dissipation requirements of microelectronic devices are also increasing. Therefore, it is of great significance to develop an interface heat dissipation material with high thermal conductivity. Due to its environmental friendliness and low cost, thermal conductive adhesives have gradually replaced traditional tin-lead solder interconnect materials. However, the development of traditional thermal adhesives also encountered some bottlenecks, such as low thermal conductivity, high density, and low stability. Contents of the invention [0003] The object of the present invention is to provide a thermally conductive adhesive with high conductivity and a preparation me...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J11/04
Inventor 刘建影
Owner SHENZHEN SHEN RUI GRAPHENE TECH CO LTD
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