Template-free method for preparing large-specific-surface-area copper particle/film composite material

Abstract

The utility model provides a template-free method for preparing a large-specific-surface-area copper particle / film composite material. According to the technical scheme of the invention, a copper-chromium alloy film is prepared on the surface of a glass matrix, and the glass matrix is kept at a certain temperature so as to enable copper atoms to grow on the surface of the alloy film as copper particles, namely the product provided by the invention. The copper-chromium alloy film is prepared through the magnetron sputtering and dual-target co-deposition process, and the matrix is heated in site. In this way, the large-specific-surface-area copper particle / film composite material can be prepared without any template, and the specific surface area thereof is increased by over 20% compared with that of a pure copper film. Both the thickness of the copper film in the composite material, and the scale of copper particles within the micro-nano scale range can be adjusted and controlled. The template-free method for preparing the large-specific-surface-area copper particle / film composite material is low in cost, green and environmentally-friendly. By means of the method, the large-specific-surface-area copper particle / film composite material of large area and high performance can be easily prepared on the matrix without any template.

Description

technical field [0001] The invention relates to the field of preparation of micro- and nano-scale materials, in particular to a method for preparing a copper particle film composite material with a large specific surface area without a template. Background technique [0002] With the development of micro-nano science and technology, the excellent properties and broad application prospects of micro- and nano-films and particles have gradually been recognized by researchers and have aroused great interest from material scientists, physicists and chemists around the world. When the size reaches the nanometer level, the particles will show obvious quantum size effect, small size effect, surface effect and macroscopic quantum tunneling effect, and have broad application prospects in the fields of catalysis, light filtering, light absorption, medicine, magnetic media and new materials. . [0003] In recent years, the design of new nanomaterial systems according to performance req...

AI Technical Summary

Problems solved by technology

Some people have also prepared Cu particles by hydrothermal reduction method. This method involves more preparation steps and process parameters, and the experiment period is longer. The prepared copper particle clusters are easier to aggregate.

In addition, pure Cu particles can also be prepared by traditional sputtering methods, but the size of the prepared pure Cu particles is limited. Once the particle size exceeds a dozen nanometers, the particles will connect to each other to form a thin film.

Based on the current research status, it can be seen that although people can prepare submicron and nanoscale copper films and copper particles in the laboratory through various methods, the prepared copper particles are basically free monodisperse particles or Many particles are agglomerated and it is difficult to fix these particles on the substrate or film surface

Although pure copper particles can be grown on the surface of the substrate or film by the template method, this method is complex in technology, and it is easy to pollute the Cu particles in the process of removing the template, so it is not suitable for the needs of industrial development.

[0007] In summary, it can be seen that it is difficult to grow Cu particles that are well-bonded with the film on the surface of the film by the prior art methods, that is to say, it is difficult to prepare a copper film / copper particle composite material