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Antioxidation bonding copper wire and method for preparing same

A technology for oxidizing bonds and copper wires, which is applied in the field of bonding wires, can solve the problems of increasing costs, affecting the use effect of final products, storage of bare copper wires, and short service life, so as to prevent oxidation, solve copper wire oxidation, and improve metal quality. The effect of elongation

Active Publication Date: 2015-08-12
SHANDONG KEDADINGXIN ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, inert gas protection should also be added in the packaging and storage of the existing bonding copper wire in the preparation process; the storage and service life of the bare copper wire are very short, which also increases the cost of production and storage, and further affects The use effect of the final product

Method used

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  • Antioxidation bonding copper wire and method for preparing same

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Effect test

Embodiment 1

[0025] Bonded copper wire of the present invention is prepared according to the following process steps:

[0026] 1) High purity copper with a purity of 99.999wt% is purified by electrolysis of copper with a purity of 99.99wt%. The copper with a purity of 99.99wt% as a raw material is a commercially available gold material of ordinary purity. The raw material is purified by electrolysis to 99.999wt%, the specific method is: use commercially available copper as the anode, hang it on the anode conductive rod, use the inert carbon material as the cathode, hang it on the cathode conductive rod, keep the anode and the cathode parallel; add copper sulfate solution in the electrolytic cell As the electrolyte, the tank pressure is controlled at 0.6-1.2V during the electrolysis process to ensure the liquid level of the electrolyte. The electrolytic copper is washed with pure water, washed to neutral, and finally put into a protective gas oven to dry to obtain 99.999wt% high-purity copp...

Embodiment 2

[0047] The method of embodiment 1 is repeated by each component content specified in the following table 1:

[0048] Table 1 Example 1-2 product component content and product performance index

[0049]

[0050] In Table 1, by coating the organic layer on the surface of the bonding copper wire, the organic layer is 10% polyvinylpyrrolidone surfactant, 10% isopropanol / tetraethyl orthosilicate / ammonia solvent, 10% polyaluminum chloride The rest of the coagulant is silicone insulating varnish; the organic layer can also be 10% oleyl alcohol polyoxyethylene ether surfactant, 20% isopropanol / tetraethyl orthosilicate / ammonia solvent, 15% polyacrylamide The experimental comparison of coagulant all the other organosilicon insulating varnishes, the performance test parameter of each embodiment all illustrate, and bonding copper wire of the present invention can all reach target, has pin-coat binding force height, pinhole rate is low, high temperature resistance, resistance Oxidative...

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Abstract

The present invention discloses an antioxidation bonding copper wire, and the surface of the copper wire is coated with an organic matter layer of which the thickness is between 5 nanometers and 60 nanometers. The present invention also discloses a method for preparing the antioxidation bonding copper wire. The method comprises the steps of purification, alloy making, vertical smelting, wire drawing, annealing, coating and packaging. The antioxidation bonding copper wire prepared by the method possesses a better low long radian, and can be prevented from being oxidized effectively, so that the prepared bonding copper wire is not oxidized during the storage and transportation. Moreover, a coating material can withstand a high temperature more than 200 DEG C, thereby solving the copper wire oxidation problem effectively.

Description

technical field [0001] The invention relates to the technical field of bonding wires, in particular to an oxidation-resistant bonding copper wire and a preparation method thereof. Background technique [0002] Bonding gold wire is a key lead material for the connection of integrated circuits or discrete devices and LEDs. In recent years, with the rapid development of the semiconductor industry and the soaring price of gold, both production and use companies have brought cost pressures. The degree of integration of integrated circuits is getting higher and higher, the thickness of the circuit board is getting smaller and smaller, the number of electrodes on the device is increasing, the distance between the electrodes is getting narrower, and the packaging density is getting smaller and smaller accordingly. It has been unable to meet the increasing packaging requirements. Bonding copper wire is an ideal material to replace bonding gold wire, but the easy oxidation of copper ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48
CPCH01L2224/4321H01L2224/45144H01L2224/45147H01L2224/45565H01L2224/4569H01L2924/00011H01L2924/00H01L2924/01005H01L2924/01204H01L2924/01205H01L2924/0102H01L2924/01032H01L2924/01047
Inventor 李天祥
Owner SHANDONG KEDADINGXIN ELECTRONICS TECH
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