A method and device for preparing micropores with high aspect ratio

Abstract

The invention relates to a preparation method and a preparation device of high-depth-diameter ratio micropores. The preparation method and the preparation device are used for high-depth-diameter ratio micropores. The preparation method is used for preparing the high-depth-diameter ratio micropores in a dual-pulse combination manner; the laser source comprises two laser combinations different in pulse width; a digital signal time delay generator is used for controlling the two pulse combinations for the time of a sample; the laser pulses of two laser devices are combined and focused on the sample by use of an optical component to perform laser etching on the sample directly; the preparation device comprises a femtosecond laser device, a nanosecond laser device, a digital signal time delay generator, a half-wave plate, an optical polarizer, a beam splitter, a total reflector, a white light source, a charge coupling element, a three-dimensional mobile platform and a computer. The preparation method is capable of directly breaking through the maximum micropore high-depth-diameter ratio limit that can be available by use of single pulse and well solving the technical problem of low depth-diameter ratio in current micropore preparation.

Description

Technical field [0001] The patent of the present invention relates to the application of laser technology, in particular to a method and device for preparing ultra-high aspect ratio micro-holes, which are applied to high-precision optoelectronic devices that have great demand for high-aspect-diameter ratio micro-holes. Background technique [0002] In recent years, with the integration and miniaturization of optoelectronic devices, the requirements for miniaturization of unit components have been increasing. Micropores are one of the basic configurations of unit elements, and many of its core components require small micropore diameters and large depth-to-diameter ratios, so as to effectively improve device performance and even have breakthrough developments. [0003] The use of single femtosecond pulsed lasers to prepare micropores is currently a commonly used technical method. However, as the depth of micropores increases, the preparation methods and residues generated during the...

AI Technical Summary

Problems solved by technology

[0003] The use of single femtosecond pulsed laser to prepare micropores is a commonly used technical method at present, but with the increase of the depth of micropores, it is more and more difficult to discharge the preparation methods and residues generated during the preparation process in the prior art, making the pulse preparation Pore ​​depth is limited

The limited depth of these microwells prevents the technology from being widely used in aerospace, energy, biomedicine, optoelectronic microfluidic devices, national defense, etc.

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