Metal alloy electroplating liquid

A metal alloy and electroplating solution technology, applied in the field of electroplating solution, can solve problems such as dullness, rough particles, and poor cathode current efficiency, and achieve the effect of eliminating defects such as burrs and roughness, high flatness, and good stability

Inactive Publication Date: 2015-09-16
梁胜光
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, alloy plating has a problem with solder wettability, so the reliability after brazing is low, and it cannot be practically used.
In addition, in the plating process, the cathode current efficiency is poor, the plating speed is slow, and the obtained plated particles are rough, and there are problems in appearance such as dullness.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0009] A kind of metal alloy electroplating solution described in the present embodiment 1 is made up of the following raw material components: 30 parts of copper sulfate, 30 parts of aluminum sulfate, 50 parts of copper chloride, 50 parts of nickel hydroxide, 20 parts of cobalt sulfate , 30 parts of cobalt chloride, 10-15 parts of ferric sulfate, 30 parts of ferrous chloride, 50 parts of cuprous oxide, 16 parts of hydrochloric acid, 15 parts of acetic acid, 3 parts of Tween 60, 4 parts of sodium isethionate, 5 parts of allyl polyoxyethylene ether, 6 parts of polyethylene glycol, 3 parts of ammonium lauryl sulfate, 5 parts of sodium lauryl sulfate, 200 parts of deionized water.

Embodiment 2

[0011] A kind of metal alloy electroplating solution described in the present embodiment 2 is made up of the raw material components of following parts: 40 parts of copper sulfate, 50 parts of aluminum sulfate, 60 parts of cupric chloride, 60 parts of nickel hydroxide, 30 parts of cobalt sulfate , 40 parts of cobalt chloride, 15 parts of ferric sulfate, 35 parts of ferrous chloride, 58 parts of cuprous oxide, 18 parts of hydrochloric acid, 20 parts of acetic acid, 4 parts of Tween 60, 5 parts of sodium isethionate, 6 parts Allyl polyoxyethylene ether, 7 parts of polyethylene glycol, 4 parts of ammonium lauryl sulfate, 8 parts of sodium lauryl sulfate, 300 parts of deionized water.

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PUM

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Abstract

The invention discloses a metal alloy electroplating liquid. The metal alloy electroplating liquid is composed of the following raw material components in parts: 30-40 parts of copper sulphate, 30-50 parts of aluminium sulphate, 50-60 parts of copper chloride, 50-60 parts of nickel hydroxide, 20-30 parts of cobalt sulphate, 30-40 parts of cobalt chloride, 10-15 parts of iron sulphate, 30-35 parts of ferrous chloride, 50-58 parts of cuprous oxide, 16-18 parts of hydrochloric acid, 15-20 parts of acetic acid, 3-4 parts of Tween-60, 4-5 parts of sodium hydroxyethyl sulfonate, 5-6 parts of allyl polyethenoxy ether, 6-7 parts of polyethylene glycol, 3-4 parts of ammonium lauryl sulphate, 5-8 parts of sodium lauryl sulphate and 200-300 parts of deionized water. The metal alloy electroplating liquid is good in stability, the surface of a plated film is high in brightness and smoothness, the flexibility of a plated layer is obviously improved, and the defects of burrs, roughness and the like on the outer surface of a plated part are basically eliminated.

Description

technical field [0001] The invention relates to the technical field of electroplating solutions, in particular to a metal alloy electroplating solution. Background technique [0002] At present, the alloy electroplating layer has superior physical and chemical properties. Compared with the traditional nickel plating process, the nickel-iron alloy electroplating uses cheap pure iron to replace part of the expensive metal nickel, so that harmful iron impurities become in the coating. The beneficial ingredients not only reduce the cost of electroplating, but also reduce the disadvantages of pinholes and brittleness of the coating. However, alloy plating has a problem with solder wettability, and therefore has low reliability after brazing, and cannot be put to practical use. In addition, in the plating process, the cathodic current efficiency is poor, the plating speed is slow, and the obtained plated particles are rough and have problems in appearance such as dullness. Cont...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/58
Inventor 梁胜光
Owner 梁胜光
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