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Spherical copper powder with radiation protection function and preparation method for spherical copper powder

A radiation-proof and spherical technology, which is applied in chemical instruments and methods, household appliances, dyeing low-molecular organic compound treatment, etc., can solve the problems of poor corrosion resistance, poor weather resistance, limited scale application, insufficient oxidation resistance, etc., and achieve electrical conductivity Good, improved anti-oxidation performance, low cost effect

Inactive Publication Date: 2015-10-07
铜陵铜基粉体科技有限公司
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  • Summary
  • Abstract
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AI Technical Summary

Problems solved by technology

Spherical copper powder conductive fillers are considered to be a potential substitute for expensive silver-based conductive fillers due to their good metal migration resistance and cost advantages, but spherical copper powder conductive fillers still have insufficient oxidation resistance, Disadvantages such as easy agglomeration, poor electrical conductivity, easy corrosion and poor weather resistance limit its large-scale application

Method used

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Embodiment Construction

[0012] The described spherical copper powder with anti-radiation function is characterized in that it is made of the following raw materials in parts by weight: block spherical copper powder 100, acrylic acid 0.42, styrene 0.94, trimethylolpropane trimethacrylic acid Ester 8, nano graphite powder 0.8, glass fiber 2, alkyd resin 7, dibutyl maleate 1.7, dibutyltin dilaurate 0.3, diethylene glycol ethyl ether acetate 4, palygorskite powder 3, n-butanol 57.

[0013] The preparation method comprises the following steps:

[0014] (1) Dry and pulverize the glass fiber, add nano-graphite powder, stir and mix, spray into molten alkyd resin for ultrasonic dispersion for 30-50 minutes, dry and pulverize;

[0015] (2) Put dibutyl maleate and diethylene glycol ethyl ether acetate into the reaction kettle and heat up to 165-185°C, add dibutyltin dilaurate to keep the temperature and stir for 2-4 hours, then cool to room temperature;

[0016] (3) Add acrylic acid, styrene, and trimethylolp...

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PUM

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Abstract

The invention discloses spherical copper powder with a radiation protection function. A copolymerization modification method is adopted for the wrapping modification of the spherical copper powder, acrylic acid, styrene and trimethylol propane trimethacrylate are taken as monomers, nanometer graphite powder and other effective additives are also added, and the surface of the blocky spherical copper powder is wrapped with a layer of dense copolymer film with benzene rings and carboxyl groups by copolymerization reaction at 80 DEG C. By a shell layer formed on the surface, a shielding function in the spherical copper powder can be realized to improve oxidation resistance of the spherical copper powder, and the surface charge property of the spherical copper powder can also be changed to effectively weaken acting force between metal powder agglomerates and improve the shortcoming of high agglomeration rate of the product. When being applied to the field of conductive fillers, the prepared spherical copper powder has the advantages of low cost, radiation protection, wear resistance, good electrical conductivity and the like.

Description

technical field [0001] The invention relates to the technical field of metal powder material preparation, in particular to a spherical copper powder with radiation protection function and a manufacturing method thereof. Background technique [0002] With the rapid development of science and technology, conductive composite materials have been widely researched and applied. The conductive filler as its main component has therefore aroused great research enthusiasm. The performance and cost of the conductive filler are directly related to the conductivity, reliability and economy of the conductive material. Spherical copper powder conductive filler is considered to be a potential substitute for the current expensive silver-based conductive filler because of its good metal migration resistance and cost advantages, but the spherical copper powder conductive filler still has insufficient oxidation resistance, Disadvantages such as easy agglomeration, poor electrical conductivity...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09C1/62C09C3/10C09C3/06C09C3/08C09D11/52
Inventor 曹仕勤晏超俞峰
Owner 铜陵铜基粉体科技有限公司
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