Electromagnetic interference resistant spherical copper powder and method for manufacturing the same

A technology for preventing electromagnetic interference and manufacturing method, applied in the direction of coating, etc., can solve the problems of limited large-scale application, poor corrosion resistance and poor weather resistance, insufficient anti-oxidation performance, etc. Effect

Inactive Publication Date: 2015-10-14
铜陵铜基粉体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Spherical copper powder conductive fillers are considered to be a potential substitute for expensive silver-based conductive fillers due to their good metal migration resistance and cost advantages, but spherical copper powder conductive fillers still have insufficient oxidation resistance, Disadvantages such as easy agglomeration, poor electrical conductivity, easy corrosion and poor weather resistance limit its large-scale application

Method used

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Embodiment Construction

[0012] The described spherical copper powder capable of preventing electromagnetic interference is characterized in that it is made of the following raw materials in parts by weight: block copper 100, acrylic acid 0.59, styrene 1.05, trimethylolpropane trimethacrylate 12 , Nano ferric oxide 1.1, bauxite powder 1, amino resin 7, dibutyltin dilaurate 0.2, diethylene glycol dibenzoate 6, dimethyl glutarate 5, stainless steel fiber 4, n-butanol 59.

[0013] The preparation method comprises the following steps:

[0014] (1) Dry and pulverize the stainless steel fiber, add nano-ferric oxide and mix well, spray into molten amino resin for ultrasonic dispersion for 30-50 minutes, dry and pulverize;

[0015] (2) Put diethylene glycol dibenzoate and dimethyl glutarate into the reaction kettle and heat up to 170-190°C, add dibutyltin dilaurate to keep the temperature and stir for 2-4 hours, then cool to room temperature;

[0016] (3) Add acrylic acid, styrene, and trimethylolpropane tr...

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PUM

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Abstract

The invention discloses electromagnetic interference resistant spherical copper powder. A copolymerization modification method is adopted to perform coating modification on the spherical copper powder; acrylic acid, styrene and trimethylolpropane trimethacrylate serve as monomers; nano-iron oxide and other effective additives are added; and the surface of blocky copper is coated with a layer of compact copolymer film with benzene rings and carboxy group. A shell layer formed on the surface of the copper powder not only achieves the effect of shielding the spherical copper powder and improves oxidation resistance of the spherical copper powder, but also can change the surface charge characteristics of the spherical copper powder, effectively weaken agglomeration acting force of the metal powder and overcome the shortcoming that the product is easily subjected to agglomeration; the manufactured spherical copper powder serves as conductive filler to be applied to conductive ink, is good in conductivity and has easiness in printing, a film layer is flexible and resistant to abrasion; the spherical copper powder can be widely applied to light and flexible electronic products such as intelligent packaging, membrane switches, conductive circuits and sensors; and the spherical copper powder has the advantage of electromagnetic interference resistance and is wide in market prospect.

Description

technical field [0001] The invention relates to the technical field of metal powder material preparation, in particular to a spherical copper powder capable of preventing electromagnetic interference and a manufacturing method thereof. Background technique [0002] With the rapid development of science and technology, conductive composite materials have been widely researched and applied. The conductive filler as its main component has therefore aroused great research enthusiasm. The performance and cost of the conductive filler are directly related to the conductivity, reliability and economy of the conductive material. Spherical copper powder conductive filler is considered to be a potential substitute for the current expensive silver-based conductive filler because of its good metal migration resistance and cost advantages, but the spherical copper powder conductive filler still has insufficient oxidation resistance, Disadvantages such as easy agglomeration, poor electri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02
Inventor 曹仕勤晏超俞峰
Owner 铜陵铜基粉体科技有限公司
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