Copper plating liquid and process for direct cyanide-free acid copper plating on steel substrate

An acidic copper and steel plating technology, applied in the field of copper plating solution, can solve the problems of poor bonding force, achieve long life, simple maintenance of plating solution, and reduce investment cost

Inactive Publication Date: 2015-10-14
张志梁
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the iron and steel parts will quickly produce a serious loose replacement copper layer in the sulfate acid copper plating solution, the bonding force is very poor

Method used

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  • Copper plating liquid and process for direct cyanide-free acid copper plating on steel substrate
  • Copper plating liquid and process for direct cyanide-free acid copper plating on steel substrate
  • Copper plating liquid and process for direct cyanide-free acid copper plating on steel substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] In this embodiment, the formula of the electroplating solution is:

[0046]

[0047] In the electroplating solution, the cathode current density is 1A / dm2, the temperature of the electroplating solution is 40°C, the electroplating time is 60 minutes, and the phosphorous copper anode contains 0.5% phosphorus.

[0048] The following is the cyanic-free copper plating process, including the following steps:

[0049] Step 1: In order to go through the steel parts grinding and rust removal, chemical degreasing, hot water washing, water washing, pickling, water washing, electro degreasing, hot water washing, ultrasonic cleaning and acid activation (H 2 SO 4 10%);

[0050] Step 2: Put copper sulfate, sulfuric acid, chloride ion, luminous agent, activator, complexing agent in a container with a volume of 1000 ml according to the concentration ratio, and then add deionized water or distilled water to 1000 ml, and stir evenly until completely dissolved Obtain a plating solution. Put the ...

Embodiment 2

[0052] In this embodiment, the formula of the electroplating solution is:

[0053]

[0054] In the electroplating solution, the cathode current density is 8A / dm2, the temperature of the electroplating solution is 15°C, the electroplating time is 10 minutes, and the phosphorous copper anode contains 0.2% phosphorous.

[0055] The copper plating process of this embodiment is the same as that of Embodiment 1, and will not be described in detail here.

Embodiment 3

[0057] In this embodiment, the formula of the electroplating solution is:

[0058]

[0059] In the electroplating solution, the cathode current density is 5A / dm2, the temperature of the electroplating solution is 30°C, the electroplating time is 40 minutes, and the phosphorous copper anode contains 0.3% phosphorus.

[0060] The copper plating process of this embodiment is the same as that of Embodiment 1, and will not be described in detail here.

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Abstract

The invention relates to a copper plating liquid and process for direct cyanide-free acid copper plating on a steel substrate, belonging to the technical field of copper plating. The copper plating liquid comprises copper sulphate, sulfuric acid, deionized water, chloride ion, a desmutting agent, an activator and a complexing agent, wherein concentrations of the copper sulphate, the sulfuric acid, the chloride ion, the desmutting agent, the activator and the complexing agent are 50 to 200 g / L, 20 to 80 g / L, 0.02 to 0.08 g / L, 5 to 50 g / L, 10 to 100 g / L and 10 to 100 g / L, respectively, and the weight of deionized water is 400 to 900 g. Compared with the prior art, the invention has the following advantages: the copper plating liquid can realize direct copper plating on the steel substrate without pre-plating; an obtained plating is fine and shiny and has good bonding strength; after continuous electroplating on a steel band copper plating production line for 10 years, the copper plating liquid can still be normally used; and the copper plating liquid can be used for continuous electroplating of steel bands, steel wires and steel pipes and for rack plating, barrel plating and the like of steel members.

Description

Technical field [0001] The invention relates to a copper plating solution, in particular to a direct non-cyanic copper plating solution on a steel substrate and a process. Background technique [0002] At present, the most commonly used processes in the production of copper plating include cyanide copper plating, sulfuric acid and hydrochloric acid copper plating, Pyrophosphate Three kinds of copper plating. [0003] Cyanide Copper plating is the earliest and most widely used copper plating process. The plating solution is mainly composed of copper cyanide complex and a certain amount of free cyanide, which is strongly alkaline. due to Cyanide It has strong activating ability and complexing ability, so the first feature of this electroplating method is that the solution has certain degreasing and activating ability. Secondly, because this plating solution uses cyanide with strong complexing ability, it makes Complex ion Not easy to discharge, so that the bath Cathodic polariz...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 张志梁
Owner 张志梁
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