Epoxy resin ab glue for high temperature environment and method for making and using the same

A technology of epoxy resin and high-temperature environment, which is applied in the direction of epoxy resin glue, adhesive, polymer adhesive additive, etc., can solve the problems of epoxy resin AB glue strength decline, easy aging, and brittleness, etc., to achieve adhesion Improvement of junction performance, improvement of thermal stability and aging resistance, and improvement of high temperature aging resistance

Active Publication Date: 2017-10-24
ZHUZHOU SHILIN POLYMER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Although the above-mentioned patents all involve high-temperature-resistant epoxy resin adhesives, and also propose some improvements about epoxy resin AB adhesives, it can be seen through careful analysis that these patents do not propose how to improve epoxy resin AB adhesives in high-temperature environments. Under the thermal stability problem, there are still problems such as the decrease of the strength of the epoxy resin AB glue in the high temperature environment, prone to aging and brittleness, so it still needs to be further improved

Method used

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  • Epoxy resin ab glue for high temperature environment and method for making and using the same

Examples

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Comparison scheme
Effect test

Embodiment 1

[0055] An epoxy resin AB glue for high-temperature environment conditions, including AB two components, the AB two components are proportioned according to the following components and parts by weight:

[0056] 1) Group A is divided into:

[0057] E44 epoxy resin 60 parts

[0058] F51 epoxy resin 25 parts

[0059] MHR-070 hydantoin epoxy resin 10 parts

[0060] JEW-0113 aliphatic epoxy resin 10 parts

[0061] 10 parts of polyurethane modified epoxy resin

[0062] 25 parts of silica powder;

[0063] 2) Group B is divided into:

[0064] 50 parts of 650 low molecular weight polyamide

[0065] 4,4'-Diaminodiphenylsulfone 2 parts

[0066] 5 parts of 2-ethyl 4-methylimidazole

[0067] 20 parts m-phenylenediamine

[0068] Silica powder 20 parts

[0069] 3 parts of fumed white carbon black.

[0070] During preparation, the two components of A and B are prepared separately and packaged independently, wherein:

[0071] 1) The preparation of component A is as follows:

[007...

Embodiment 2

[0083] An epoxy resin AB glue for high-temperature environment conditions, including AB two components, the AB two components are proportioned according to the following components and parts by weight:

[0084] 1) Group A is divided into:

[0085] E44 epoxy resin 80 parts

[0086] F51 epoxy resin 55 parts

[0087] MHR-070 Haiying epoxy resin 20 parts

[0088] JEW-0113 aliphatic epoxy resin 20 parts

[0089] 10 parts of liquid carboxylated nitrile rubber

[0090] 25 parts of calcium carbonate;

[0091] 2) Group B is divided into:

[0092] 50 parts of 650 low molecular weight polyamide

[0093] 2 parts of 4-4 diaminodiphenylmethyl sulfone

[0094] 5 parts of 2-ethyl 4-methylimidazole

[0095] 20 parts m-phenylenediamine

[0096] 23 parts of calcium carbonate.

[0097] The method of preparation and use of the second embodiment is the same as that of the first embodiment.

Embodiment 3

[0099] An epoxy resin AB glue for high-temperature environment conditions, including AB two components, the AB two components are proportioned according to the following components and parts by weight:

[0100] 1) Group A is divided into:

[0101] E51 epoxy resin 50 parts

[0102] F51 epoxy resin 30 parts

[0103] MHR-070 Haiying epoxy resin 15 parts

[0104] JEW-0112 aliphatic epoxy resin 5 parts

[0105] Nitrile 40 rubber 12 parts

[0106] 28 parts of silica powder;

[0107] 2) Group B is divided into:

[0108] 30 parts of 651 low molecular weight polyamide

[0109] 3 parts of 4-4 diaminodiphenyl sulfone

[0110] 5 parts of 2-ethyl 4-methylimidazole

[0111] 25 parts m-phenylenediamine

[0112] Silica powder 20 parts

[0113] 2 parts of fumed white carbon black.

[0114] The preparation and use method of the third embodiment is basically the same as that of the first embodiment, except that the curing method is different. The curing method is: under the contact pr...

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Abstract

An epoxy resin AB glue for high temperature environment and its production and use method, including AB two components, A component is based on bisphenol epoxy resin, and hydantoin epoxy is added to the component Resin; component B is based on low-molecular-weight polyamide, and 4,4'-diaminodiphenylsulfone is added to the component; when using, the two components of AB are mixed and cured, through hydantoin epoxy resin and The combined effect of 4,4'-diaminodiphenyl sulfone improves the thermal stability and aging resistance of epoxy resin AB glue.

Description

technical field [0001] The invention relates to an epoxy resin glue and its production and use method, especially a high-strength epoxy resin AB glue used in an environment with a temperature above 180°C and its production and use method. This product is mainly used for metal It can also be used for the bonding of high temperature resistant parts such as metal, ceramic and metal, ceramic and ceramic, and can also be used for the cold welding process of different metals and other plastics, especially for the bonding of high temperature resistant parts such as brushless motors. Background technique [0002] Epoxy resin adhesive (epoxy resin adhesive) generally refers to the adhesive made with epoxy resin as the main body, and epoxy resin adhesive is divided into soft glue and hard glue. Most epoxy resin glues are hard glues with high hardness but high brittleness. The epoxy resin AB glue of the present invention is a kind of epoxy resin glue, is a kind of two-component high-t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/06C09J11/04C08G59/60
Inventor 张隽华张向宇
Owner ZHUZHOU SHILIN POLYMER
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