Method and device for uniform magnetron sputtering deposition on inner surface of axisymmetric curved member

Abstract

The invention discloses a method and a device for uniform magnetron sputtering deposition on the inner surface of an axisymmetric curved member, and aims to solve the problem that energy is lost due to gravity and collision between deposition atoms and working gas during the preparation of a clad layer on the inner surface of the axisymmetric curved member according to the conventional magnetron sputtering method, so that the longer the distance from the member to a target surface is, the less deposition atoms can reach the target surface and the lower the deposition rate of the clad layer is, the thickness of the clad layer on the workpiece inner surface (member inner surface) at different latitudes is larger, and the uniformity of the clad layer is poor. The method and the device can effectively overcome defects of traditional methods, and the thickness uniformity of the clad layer on the inner surface of the axisymmetric curved member can be improved to 70% or above, so that the uniform magnetron sputtering clad layer can be formed on the workpiece inner surface. Meanwhile, the method is simple, the process is controllable, the repeatability is good, and the requirements on industrialized and large-scale preparation of uniform clad layers on inner surfaces of axisymmetric curved members can be met.

Description

technical field [0001] The invention relates to the field of coatings, in particular to the field of magnetron sputtering, in particular to a uniform magnetron sputtering deposition method and device for the inner surface of an axisymmetric curved surface part. The invention can greatly improve the uniformity of deposition on the inner surface of the axisymmetric curved surface part, and has better effect. Background technique [0002] As an industrialized coating deposition technology, magnetron sputtering works as follows: electrons do spiral motion in the orthogonal electromagnetic field on the sputtering target surface, and collide with the working gas (such as argon), so that the working gas is ionized into ions ( Such as argon ions), the ions are accelerated under the electric field of the sputtering cathode, gain energy and fly to the target surface, and collide with the atoms of the target surface, so that the target atoms are sputtered out, and the sputtered target ...

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Problems solved by technology

[0006] The purpose of the present invention is to: when the existing magnetron sputtering method is used for the coating preparation of the inner surface of the axisymmetric curved surface, the impact of gravity and the energy loss caused by the collision with the working gas, the farther the distance from the target surface, can The fewer deposited atoms arrive, the lower the deposition rate of the coating, resulting in a large difference in the thickness of the coating at different latitudes on the inner surface of the workpiece, and the problem of poor uniformity. A method for uniform magnetron sputtering deposition on the inner surface of an axisymmetric curved surface is provided. and its device

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