A kind of thick-film circuit resistance paste for stainless steel substrate and preparation method thereof

A technology of thick film circuit and resistance paste, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, circuits, cables/conductors, etc., which can solve the problems of high price, small coverage of square resistance, and limited application of materials , to achieve the effects of reducing production cost and use cost, realizing large-scale industrial production, and simple preparation process

Active Publication Date: 2019-08-30
NINGBO POLYTECHNIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the silver-palladium resistance paste has good electrical conductivity and suitable temperature coefficient of resistance, the square resistance coverage of the resistance paste is small, the process reproducibility is poor, the TCR is large when the resistance is high, and the silver ion migration resistance And the corrosion resistance of solder is poor, these shortcomings greatly limit the application of materials in thick film circuits, and the price of precious metals such as silver and palladium is also very expensive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Weigh 40g Cu(OH) 2 and 28gGe(OH) 4 Mix evenly, place in a high-temperature electric furnace, heat up to 1450°C at a heating rate of 8°C / min, keep warm for 4 hours, and after cooling, ball mill to an average diameter of 0.5μm, and the prepared Cu 2 O-GeO 2 Composite powder and 0.15μm Cu powder are fully mixed at a mass ratio of 40:60 to form a conductive phase Cu 2 O-GeO 2 Composite + Cu powder.

[0029] Weigh 37gSiO 2 , 20gAl 2 o 3 , 7gB 2 o 3 , 28gCaO, 6gZrO 2 , 2gCo 2 o 3 , mixed evenly, placed in a high-temperature electric furnace, heated to 1550°C at a heating rate of 10°C / min, kept for 2 hours, then water quenched, and ball milled to 3 μm to obtain a glass-ceramic phase SiO 2 -Al 2 o 3 -B 2 o 3 -CaO-ZrO 2 -Co 2 o 3 Complex powder.

[0030] Conductive phase Cu 2 O-GeO 2 Composite + Cu powder, glass-ceramic phase SiO 2 -Al 2 o 3 -B 2 o 3 -CaO-ZrO 2 -Co 2 o 3 The compound and the organic liquid phase are placed in a container at a mass ...

Embodiment 2

[0032] Weigh 45gCu(OH) 2 and 26gGe(OH) 4 Mix evenly, place in a high-temperature electric furnace, heat up to 1500°C at a heating rate of 10°C / min, keep warm for 2 hours, and after cooling, ball mill to an average diameter of 0.8μm, and the prepared Cu 2 O-GeO 2 Composite powder and 0.2μm Cu powder are fully mixed at a mass ratio of 45:55 to form a conductive phase Cu 2 O-GeO 2 Composite + Cu powder.

[0033] Weigh 30gSiO2 2 , 24gAl 2 o 3 , 8gB 2 o 3 , 30gCaO, 5gZrO 2 、3gCo 2 o 3 , mixed evenly, placed in a high-temperature electric furnace, heated to 1600°C at a heating rate of 12°C / min, kept for 1.5h, then water quenched, and ball milled to 2.5μm to obtain a glass-ceramic phase SiO 2 -Al 2 o 3 -B 2 o 3 -CaO-ZrO 2 -Co 2 o 3 Complex powder.

[0034] Conductive phase Cu 2 O-GeO 2 Composite + Cu powder, glass-ceramic phase SiO 2 -Al 2 o 3 -B 2 o 3 -CaO-ZrO 2 -Co 2 o 3 The powder and the organic liquid phase are placed in a container at a mass ratio of...

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Abstract

The invention discloses a thick-film circuit resistor paste for stainless steel substrates and a preparation method thereof. The thick-film circuit resistor paste is composed of a solid phase component and an organic liquid phase, and the solid phase component includes a conductive phase and a microcrystalline The glass phase, the conductive phase is composed of Cu2O‑GeO2 composite + Cu powder, the glass-ceramic phase is SiO2‑Al2O3‑B2O3‑CaO‑ZrO2‑Co2O3 composite, and the organic liquid phase is terpineol, tributyl citrate, ethyl acetate Mixed liquid phase of base cellulose, span 85, 1,4-butyrolactone, hydrogenated castor oil. The preparation method is as follows: firstly, the conductive phase and the glass-ceramic phase are respectively prepared, then the organic liquid phase is prepared, and finally the conductive phase, the glass-ceramic phase and the organic liquid phase are mixed and prepared to obtain the resistance paste.

Description

technical field [0001] The invention relates to the technical field of thick-film circuits, in particular to a thick-film circuit resistance paste for stainless steel substrates and a preparation method thereof. Background technique [0002] With the extensive application of thick-film high-power circuits, thick-film high-power resistors and their power modules are also widely used in circuits such as power control, overload protection and power distribution. High-power thick film resistors have the advantages of small size, light weight, high power density, reliable performance, flexible design, good controllability, long service life, environmental protection and energy saving, and high cost performance. They gradually occupy the mainstream position in the market, and their application fields have expanded to The market prospects are very broad in military, automotive electronics, communications, aerospace, home appliances, medical and chemical industries. Thick film resi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/20H01B1/22H01B13/00
Inventor 袁正勇
Owner NINGBO POLYTECHNIC
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